3D ICs with Microfluidic Interconnects and Methods of Constructing Same

• Application Type:

  Utility

  Patent Number:

  7928563

  Country:

  United States

  Status:

  Filed on 28-May-2008, Issued on 19-Apr-2011, Patent Abandoned

  Organization:

  Georgia Institute of Technology

  SRC Filing ID:

  P1080

Inventors

• Muhannad S. Bakir (Georgia Tech)
• Deepak Chandra Sekar (Georgia Tech)
• Bing Dang (IBM)
• Calvin Richard King (Georgia Tech)
• James D. Meindl (Georgia Tech)