Scan Test of Die Logic in 3D ICs Using TSV Probing

• Application Type:

  Utility

  Patent Number:

  8782479

  Country:

  United States

  Status:

  Filed on 1-Nov-2012, Issued on 15-Jul-2014, Patent Abandoned

  Organization:

  Duke University

  SRC Filing ID:

  P1368

Inventors

• Krishnendu Chakrabarty (Duke)
• Brandon Noia (Duke)