Low-Temperature Deposition of High-Quality Aluminum Nitride Films for Heat Spreading Applications

    • Application Type:
      Utility
      Country:
      United States
      Status:
      Filed on 8-Feb-2021, Published by Patent Office
      Organization:
      University of California, San Diego
      SRC Filing ID:
      P1895

    Inventors

    • Scott T. Ueda (UC/San Diego)
    • Aaron McLeod (UC/San Diego)
    • Andrew Kummel (UC/San Diego)
    • Mike Burkland (RTX)
    • Sean P. Kilcoyne (RTX)
    • Eduardo M. Chumbes (RTX)
    • Thomas Kazior (RTX)
    • Eric Pop (Stanford)
    • Michelle Chen (Stanford)
    • Christopher Perez (Stanford)
    • Mark Rodwell (UC/Santa Barbara)

    Related Patents

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    Low-Temperature Deposition of High-Quality Aluminum Nitride Films for Heat Spreading Applications

    Mike Burkland (RTX); Michelle Chen (Stanford); Eduardo M. Chumbes (RTX); Thomas Kazior (RTX); Sean P. Kilcoyne (RTX); Andrew Kummel (UC/San Diego); Aaron McLeod (UC/San Diego); Christopher Perez (Stanford); Eric Pop (Stanford); Mark Rodwell (UC/Santa Barbara); Scott T. Ueda (UC/San Diego)
    Patent Application Expired
    Application Type: Provisional
    P1943
    Application Expired
    JUMP

    Low-Temperature Deposition of High-Quality Aluminum Nitride Films for Heat Spreading Applications

    Mike Burkland (RTX); Michelle Chen (Stanford); Eduardo M. Chumbes (RTX); Thomas Kazior (RTX); Sean P. Kilcoyne (RTX); Andrew Kummel (UC/San Diego); Aaron McLeod (UC/San Diego); Christopher Perez (Stanford); Eric Pop (Stanford); Mark Rodwell (UC/Santa Barbara); Scott T. Ueda (UC/San Diego)
    Patent Application Expired
    Application Type: Provisional

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