Deposition of Aluminum Nitirde Templating Layers by Thermal Pulsed Chemical Vapor Deposition for the Enhancement of Aluminum Nitride Thick Films

    • Application Type:
      Utility
      Country:
      United States
      Status:
      Filed on 2-May-2023, Published by Patent Office
      Organization:
      University of California, San Diego
      SRC Filing ID:
      P2129

    Inventors

    • Aaron McLeod (UC/San Diego)
    • Scott T. Ueda (UC/San Diego)
    • Andrew Kummel (UC/San Diego)

    Related Patents

    P2079
    Filed
    JUMP

    Deposition of Aluminum Nitirde Templating Layers by Thermal Pulsed Chemical Vapor Deposition for the Enhancement of Aluminum Nitride Thick Films

    Andrew Kummel (UC/San Diego); Aaron McLeod (UC/San Diego); Scott T. Ueda (UC/San Diego)
    Patent Application Filed (on 2-May-2022)
    Application Type: Provisional

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