Nonlinear Optical Spectroscopic and Imaging Studies on Surfaces and Buried Interfacesin Packaging in Situ

  • Authors:
    Zhan Chen (Univ. of Michigan)
    Publication ID:
    Publication Type:
    Annual Review
    Received Date:
    Last Edit Date:
    2662.001 (University of Michigan)


We summarized our progress in the following projects:
Plasma treatment of covered polymer interfaces (with TI)
Plasma adhesion promotion (with TI and IBM)
Flip-chip packages (with TI – Addressed both above questions)
Flux treatment of surfaces (with Intel)
Flux mapping

Past Events

  Event Summary
13 June 2017
Packaging Review
Tuesday, June 13, 2017, 8 a.m.–5 p.m. ET
Atlanta, GA, United States

4819 Emperor Blvd, Suite 300 Durham, NC 27703 Voice: (919) 941-9400 Fax: (919) 941-9450

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