Nanocopper Interconnections for High-power Die-attach by Low-temperature Sintering

  • Authors:
    Rao R. Tummala (Georgia Tech), Vanessa Smet (Georgia Tech), Kashyap Mohan (Georgia Tech), Ninad Shahane (Georgia Tech), P. Markondeya Raj (Georgia Tech), Antonia Antoniou (Georgia Tech)
    Publication ID:
    Publication Type:
    Annual Review
    Received Date:
    Last Edit Date:
    2661.001 (Georgia Institute of Technology)
    2661.002 (Georgia Institute of Technology)


This annual report outlines research accomplishments and plans for future work.

Past Events

  Event Summary
13 June 2017
Packaging Review
Tuesday, June 13, 2017, 8 a.m.–5 p.m. ET
Atlanta, GA, United States

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