Nanocopper Interconnections for High-power Die-attach by Low-temperature Sintering

  • Authors:
    Rao R. Tummala (Georgia Tech), Vanessa Smet (Georgia Tech), Kashyap Mohan (Georgia Tech), Ninad Shahane (Georgia Tech), P. Markondeya Raj (Georgia Tech), Antonia Antoniou (Georgia Tech)
    Publication ID:
    P091105
    Publication Type:
    Annual Review
    Received Date:
    13-Jun-2017
    Last Edit Date:
    13-Jun-2017
    Research:
    2661.001 (Georgia Institute of Technology)
    2661.002 (Georgia Institute of Technology)

Abstract

This annual report outlines research accomplishments and plans for future work.

Past Events

  Event Summary
13 June 2017
GRC
GRC
Packaging Review
Tuesday, June 13, 2017, 8 a.m.–5 p.m. ET
Atlanta, GA, United States

4819 Emperor Blvd, Suite 300 Durham, NC 27703 Voice: (919) 941-9400 Fax: (919) 941-9450

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