Questions?
[x] GRC Science Area
CADTS – Computer Aided Design & Test Sciences

Content Type
Events 39
Patent Filings 8
Other 1

SRC Program
SRC 26
GRC 22
FCRP 5
3D EC 2

Year
2015 2
2013 3
2012 4
2011 15
2010 15

Center
C2S2 22
GSRC 21
FENA 20
IFC 20
MSD 20
MuSyC 9
TxACE 8
EBSM 5
C-FAR 4
CNFD 4
FAME 4
INDEX 4
LEAST 4
NPT 4
SONIC 4
SWAN 4
TerraSwarm 4
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
LPD – Logic & Physical Design 7
TT – Test & Testability 5
CADT – Computer-Aided Design and... 4
AMS-CSD – Analog/Mixed-Signal Ci... 3
CD – Circuit Design 3
HWS – Hardware Security 3
ISD – Integrated System Design 3
SLD – System Level Design 3
VER – Verification 3
DV – Design Verification 2
Physical Design 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PKG – Packaging 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

31 through 48 of 48 similar documents, best matches first.   
<< previous Page: 1 2 Results by:Thunderstone
31: TECHCON 2010 for Faculty - SRC
TECHCON 2010 is a not-to-be-missed event for faculty. Here's why: Faculty who have a student presenting also have an exceptional opportunity to discuss their research with industry ...
URL: https://www.src.org/calendar/e003428/faculty/
Modified: 2010-08-04 - 20KB
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32: TECHCON 2010: A Tradition of High Quality - SRC
TECHCON 2010: Technology and Talent for the 21st Century A Tradition of High Quality Since its inception in 1990, the quality of presentations at TECHCON Conferences has gotten ...
URL: https://www.src.org/calendar/e003428/tradition/
Modified: 2010-06-21 - 21KB
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33: 2010 Inventor Recognition Award Winners - SRC
Inventor Recognition Awards Presented at TECHCON 2010 [Note: The following is the presentation of the 2009 Inventor Recognition Awards by Elizabeth Weitzman, SRC Executive Vice ...
URL: https://www.src.org/calendar/e003428/inventor/
Modified: 2010-09-29 - 21KB
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34: TECHCON 2010 Preview - SRC
TECHCON 2010 Preview TECHCON is the primary event where SRC presents the best of research sponsored by the membership and showcases the students who perform the research. It is ...
URL: https://www.src.org/calendar/e003428/preview/
Modified: 2010-07-28 - 24KB
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35: TECHCON 2010: Author's Kit - Judging Criteria - SRC
TECHCON 2010: Technology and Talent for the 21st Century Judging Criteria Criteria Technical Content 0 - 35 points Perceived Value 0 - 15 points Technology / Information Transfer 0 ...
URL: https://www.src.org/calendar/e003428/judging-criteria/
Modified: 2010-06-21 - 24KB
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36: pdfSemiconductor Research Corporation
TECHCON 2012 Judging Criteria Criteria Technical Content (0 - 35 points) Perceived Value (0 - 15 points) Technology/Information Transfer (0 - 20 points) Presentation (Paper and ...
URL: https://www.src.org/calendar/e004114/judging-criteria.pdf
Modified: 2012-05-10 - 13KB
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37: Judging Criteria - TECHCON 2011 Author's Kit - SRC
TECHCON 2011 Author's Kit Judging Criteria Criteria Technical Content 0 - 35 points Perceived Value 0 - 15 points Technology / Information Transfer 0 - 20 points Presentation ...
URL: https://www.src.org/calendar/e004113/judging-criteria/
Modified: 2010-06-21 - 22KB
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38: pdfSRC/NSF Design Forum - Position Statement
A Forum on Future Directions for Design Automation Research Juan C. Rey Senior Director Of Engineering Design to Silicon Division Mentor Graphics Corporation October, 2006 10:30 ...
URL: https://www.src.org/...02764/juan-rey-position-statement.pdf
Modified: 2011-08-02 - 13KB
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39: TECHCON 2012 (Event E004114) - SRC
TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB
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40: Cost Effective DAC Linearization System (Patent P1749) - SRC
Cost Effective DAC Linearization System Application Type: Utility Patent Number: 10218371 Country: United States Status: Filed on 1-Mar-2018, Issued on 26-Feb-2019 Organization: ...
URL: https://www.src.org/library/patent/p1749/
Modified: 2019-02-26 - 28KB
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41: pdfSRC/NSF Design Forum - Position Statement
Thoughts on the "Future Directions of Design Automation Research" Andreas Kuehlmann, Cadence Berkeley Labs October 24, 2006 Some of the main challenges we will face in the next ...
URL: https://www.src.org/...reas-kuehlmann-position-statement.pdf
Modified: 2011-08-02 - 69KB
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42: Method, Apparatus and Computer Program Product for Determining...
Method, Apparatus and Computer Program Product for Determining a Frequency Domain Response of a Nonlinear Microelectronic Circuit Application Type: Utility Patent Number: 5663890 ...
URL: https://www.src.org/library/patent/p0014/
Modified: 1997-09-02 - 24KB
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43: pdfSRC/NSF Design Forum - Professor Arvind
Future Directions in Design Automation Arvind, CSAIL , MIT Will there be a greater or smaller variety of electronic chips a decade from now? There is a dramatic decrease in the ...
URL: https://www.src.org/...64/prof-arvind-position-statement.pdf
Modified: 2011-08-02 - 9KB
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44: pdfSRC/NSF Design Forum - Position Statement
A Position Statement in the Forum on Future Directions for Design Automation Research Jason Cong UCLA Computer Science Department http://cadlab.cs.ucla.edu/~cong There are many ...
URL: https://www.src.org/...764/jason-cong-position-statement.pdf
Modified: 2011-08-02 - 35KB
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45: pdfPresentation Title
PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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46: pdfDesign Forum: Sharad Malik Panel Position Statement
Making our Way through the End-of-the Roadmap Maze Panel Position Statement Sharad Malik Princeton University As we look forward over the next 10-15 years, there are several ...
URL: https://www.src.org/...4/sharad-malik-position-statement.pdf
Modified: 2011-08-02 - 20KB
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47: pdfE003932 - Variability Forum - Nowka
Test Structures for Variability Characterization Kevin Nowka IBM Research - Austin nowka@us.ibm.com IBM Research Worldwide Watson Almaden Zurich Beijing Haifa Austin Tokyo Delhi ...
URL: https://www.src.org/calendar/e003932/e003932_s1_3_nowka.pdf
Modified: 2010-06-29 - 1.4MB
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48: pdfE003932 - Variability Forum - Gupta
NanoCAD Lab Modeling Performance Impact of Variability Puneet Gupta Dept. of EE, University of California Los Angeles (puneet@ee.ucla.edu) Work partly supported by NSF, UC ...
URL: https://www.src.org/calendar/e003932/e003932_s2_2_gupta.pdf
Modified: 2010-06-29 - 1.4MB
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31 through 48 of 48 similar documents, best matches first.   
<< previous Page: 1 2 Results by:Thunderstone