Questions?
Content Type
Other 502
Events 205

SRC Program
SRC 413
GRC 228
NRI 23
JUMP2 17
FCRP 8
SRP 5
JUMP 4
SRCEA 3
3D EC 2
Auto 2
STARnet 2
nCORE 2
ICA 1

Year
2024 20
2023 33
2022 46
2021 28
2020 20
2019 24
2018 23
2017 32
2016 31
2015 30
2014 28
2013 34
2012 37
2011 185
2010 133
2009 1

Center
C2S2 23
FENA 23
GSRC 23
IFC 23
MSD 23
MuSyC 15
TxACE 13
EBSM 12
NPT 8
C-FAR 6
CNFD 6
FAME 6
INDEX 6
LEAST 6
SONIC 6
SWAN 6
TerraSwarm 6
CHIRP 5
ACE 2
CUBIC 2
ACE4S 1
ASCENT 1
CAIST 1
CBRIC 1
CDADIC 1
CEMPI 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
IPC 1
NCRC 1
PRISM 1
SUPREME 1

Thrust/Theme
PKG – Packaging 7
ESH – Environment Safety and Hea... 5
NMP – Nanomanufacturing Material... 5
LMD – Logic and Memory Devices 4
AMS-CSD – Analog/Mixed-Signal Ci... 3
HWS – Hardware Security 3
CADT – Computer-Aided Design and... 2
CD – Circuit Design 2
EP3C – Efficiency and Performanc... 2
ISD – Integrated System Design 2
LPD – Logic & Physical Design 2
SCARF – Supply Chain AI Realized... 2
SLD – System Level Design 2
TT – Test & Testability 2
VER – Verification 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
ASCENT-T3 – Heterogeneous Integr... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PRISM-T1 – Systems and Software 1
PRISM-T2 – Architecture 1
PRISM-T3 – Devices and Circuits 1
PRISM-T4 – Grand Challenges 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1

GRC Science Area
CADTS – Computer Aided Design & ... 42
NMS – Nanomanufacturing Sciences 33
CSR – Cross-disciplinary Semicon... 30
DS – Device Sciences 30
ICSS – Integrated Circuit & Syst... 27
IPS – Interconnect & Packaging S... 26
SRCEA – SRC Education Alliance 6
ES-H – Environmental Safety & He... 4
PKG – Packaging Sciences 4
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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1: Call for Research in Packaging (CHIRP) - SRC
Call for Packaging (CHIRP) Submit Proposal Overview Research Needs White Paper Guidelines Timetable and Deadlines Overview Semiconductor Research Corp. (SRC) Global Research ...
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2: Call for Research in Packaging - SRC
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8: Call for Research in Nanoelectronics Computing Research (nCORE...
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9: Call for Research in System Level Design - SRC
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12: Call for Research in Computer Aided Design & Test (CADT) - SRC
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13: SRC: Call for White Papers in Packaging Science - SRC
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15: Call for Research in Innovative and Intelligent Internet of Things...
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18: SRC: Call for White Papers - Ultimate CMOS Research Center -...
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19: Call for Research: Interconnect and Packaging Sciences Program...
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20: SRC: Call for Research in Test and Testability - SRC
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21: GRC: Call for Research in Patterning - SRC
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23: SRC: Call for Research in Integrated System Design - SRC
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24: Call for White Papers in Environment, Safety & Health - SRC
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