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- 121:
Guided-Wave Optical Interconnections Embedded within Microelectronic...
- Guided-Wave Optical Interconnections Embedded within Microelectronic Wafer-Level Batch Package Application Type: Continuation Patent Number: 6954576 Country: United States Status: ...
URL: https://www.src.org/library/patent/p0481/
Modified: 2005-10-11 - 21KB
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- 122:
Method for Fabricating Monolithic Two-Dimensional Nanstructures...
- Method for Fabricating Monolithic Two-Dimensional Nanstructures Application Type: Utility Patent Number: 8641912 Country: United States Status: Filed on 21-May-2008, Issued on ...
URL: https://www.src.org/library/patent/p1346/
Modified: 2014-02-04 - 22KB
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- 123:
Multiple Carbon Nanotube Transfer and its Applications for Making...
- Multiple Carbon Nanotube Transfer and its Applications for Making High-Performance Carbon Nanotube Field-Effect Transistor (CNFET), Transparent Electrodes, and Three-Dimensional ...
URL: https://www.src.org/library/patent/p1188/
Modified: 2017-08-29 - 22KB
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- 124:
High Input/Output Density Optoelectronic Probe Card for Wafer...
- High Input/Output Density Optoelectronic Probe Card for Wafer-Level Test of Electrical and Optical Interconnect Components, Methods of Fabrication, and Methods of Use Application ...
URL: https://www.src.org/library/patent/p0361/
Modified: 2009-06-30 - 21KB
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- 125:
Backplane, Printed Wiring Board and\or Multi-Chip Module-Level...
- Backplane, Printed Wiring Board and\or Multi-Chip Module-Level Optical Interconnect Layer Having Embedded Air-Gap Technologies and Methods of Fabrication Application Type: ...
URL: https://www.src.org/library/patent/p0442/
Modified: 2004-09-07 - 21KB
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- 126:
Method of Forming a Multi-Layer Semiconductor Structure Having...
- Method of Forming a Multi-Layer Semiconductor Structure Having a Seam-Less Bonding Interface Application Type: Utility Patent Number: 7064055 Country: United States Status: Filed ...
URL: https://www.src.org/library/patent/p0434/
Modified: 2006-06-20 - 22KB
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- 127:
 Microsoft Word - final-fcrp-3d-2012.docx
- Semicondu Cross-Cent 3D Inte 2nd E-Wo March 9, Organizer 1. Introdu 12:00 - 12 2. Cooling 12:15 - 12 12:40 - 1: 1:00 - 1:0 3. Archite 1:05 - 1:2 1:25 - 1:4 1:45 - 2:0 2:05 - 2:1 4. ...
URL: https://www.src.org/calendar/e004681/agenda.pdf
Modified: 2012-03-26 - 102KB
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- 128:
Wireless Reliability Architecture And Methods Using Network Coding...
- Wireless Reliability Architecture And Methods Using Network Coding Application Type: Utility Patent Number: 9271123 Country: United States Status: Filed on 29-Aug-2013, Issued on ...
URL: https://www.src.org/library/patent/p1467/
Modified: 2016-02-23 - 23KB
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- 129:
Wireless Reliability Architecture and Methods Using Network Coding...
- Wireless Reliability Architecture and Methods Using Network Coding Application Type: Utility Patent Number: 9271123 Country: United States Status: Filed on 29-Aug-2013, Issued on ...
URL: https://www.src.org/library/patent/p1466/
Modified: 2016-02-23 - 23KB
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- 130:
Wireless Reliability Architecture and Methods Using Network Coding...
- Wireless Reliability Architecture and Methods Using Network Coding Application Type: Utility Patent Number: 9253608 Country: United States Status: Filed on 16-Aug-2013, Issued on ...
URL: https://www.src.org/library/patent/p1464/
Modified: 2016-02-02 - 23KB
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- 131:
Devices Having Compliant Wafer-Level Input/Output Interconnections...
- Devices Having Compliant Wafer-Level Input/Output Interconnections and Packages Using Pillars and Methods of Fabrication Thereof Application Type: Divisional Patent Number: 7468558 ...
URL: https://www.src.org/library/patent/p0654/
Modified: 2008-12-23 - 23KB
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- 132:
Devices Having Compliant Wafer-Level Input/Output Interconnections...
- Devices Having Compliant Wafer-Level Input/Output Interconnections and Packages Using Pillars and Methods of Fabrication Thereof Application Type: Utility Patent Number: 7135777 ...
URL: https://www.src.org/library/patent/p0369/
Modified: 2006-11-14 - 23KB
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- 133:
Presentation Title
- PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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- 134:
PowerPoint Presentation
- RTI International High Performance Processing Systems Enabled by 3D Integration Bob Conn May 5, 2011 1 Bob Conn, RTI International, rconn@rti.org, bobconn@ieee.org RTI ...
URL: https://www.src.org/calendar/e004357/03-conn.pdf
Modified: 2011-05-04 - 1.1MB
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