Questions?
Content Type
Other 576
Patent Filings 499
Events 394

SRC Program
SRC 546
GRC 496
FCRP 120
STARnet 102
NRI 91
JUMP 56
JUMP2 27
nCORE 26
SRCEA 11
SRP 5
ERI 3
3D EC 2
ICA 2
MSR-Intel 2
Auto 1
Undergrad 1

Year
2024 18
2023 51
2022 55
2021 58
2020 28
2019 27
2018 50
2017 57
2016 57
2015 39
2014 34
2013 32
2012 60
2011 202
2010 192
2009 1
2008 1

Center
TxACE 43
C2S2 41
FENA 41
C-SPIN 40
GSRC 30
MSD 27
LEAST 26
ASCENT 25
IFC 24
C-FAR 23
ACE4S 22
SWAN 22
FAME 21
EBSM 20
CNFD 17
NRI-NSF 17
INDEX 16
SONIC 15
CRISP 12
E2CDA-NRI 12
CBRIC 11
TerraSwarm 9
MuSyC 8
WIN 8
AMML 7
MIND 7
CHIRP 6
CONIX 6
IMPACT 6
NEWLIMITS 6
ComSenTer 5
ADA 4
CEMPI 4
DEEP3M 4
Benchmarking 3
CAIST 3
E2CDA 3
NPT 3
SUPREME 3
ACE 2

Thrust/Theme
CD – Circuit Design 45
AMS-CSD – Analog/Mixed-Signal Ci... 28
TT – Test & Testability 28
SLD – System Level Design 26
I3T – Innovative and Intelligent... 24
ESH – Environment Safety and Hea... 16
Factory Systems 15
HWS – Hardware Security 15
ISD – Integrated System Design 15
NMP – Nanomanufacturing Material... 15
CADT – Computer-Aided Design and... 14
ASCENT-T1 – Vertical CMOS 13
PKG – Packaging 13
LPD – Logic & Physical Design 11
CRISP-T1 – Hardware Support for ... 10
ASCENT-T2 – Beyond CMOS 9
Advanced Devices & Technologies 8
PAT – Patterning 8
AMML-T1 – Antiferromagnetic Magn... 7
BEP – Back End Processes 7
DesTech – Design Techniques 7
CONIX-T1 – ARENA Integrator 6
LMD – Logic and Memory Devices 6
NEM – Nanoengineered Materials 6
Back End Processes 5
CBRIC-T1 – Neuro-inspired Algori... 5
CBRIC-T2 – Neuromorphic Fabrics 5
IMPACT-T1 – Materials for Scaled... 5
ADA-T1 – Deft Development 4
DEEP3M-T4 – Architectures 4
TechCAD – Technology CAD 4
VER – Verification 4
ASCENT-T3 – Heterogeneous Integr... 3
CFM&TCM – CFM & Total Chemical M... 3
CRISP-T3 – Scaling Applications ... 3
ComSenTer-T1 – Systems and Algor... 3
DCMOS – Digital CMOS Technologie... 3
DesSyn – Design Synthesis 3
E2CDA2 – E2CDA 2.0 3
Masks 3
NEWLIMITS-T2 – 2D Materials Devi... 3
Physical Design 3
ADS – Alternative Device Structu... 2
AIHW – Artificial Intelligence H... 2
ASCENT-T4 – Merged Logic Memory ... 2
CAPSL-T4 – Architectures and Sys... 2
CM – Compact Modeling 2
ComSenTer-T2 – mm-wave/THz ICs a... 2
ComSenTer-T3 – Application-speci... 2
DEEP3M-T2 – Circuits 2
DV – Design Verification 2
EP3C – Efficiency and Performanc... 2
FACSYS – Factory Systems 2
IMPACT-T2 – Materials for Storag... 2
Materials 2
Modeling & Simulation 2
NEWLIMITS-T1 – Novel Computing a... 2
NEWLIMITS-T3 – Advanced Manufact... 2
NEWLIMITS-T4 – Characterization ... 2
PatMat – Patterning Materials 2
Reliability 2
SCARF – Supply Chain AI Realized... 2
SMART-T1 – Spin-orbit Torque Mat... 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADA-T2 – Algorithm-driven Archit... 1
ADA-T3 – Technology-driven Syste... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Technology Option 1
Analysis Design & Simulation 1
C&S – Controls and Sensing 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CBRIC-T3 – Distributed Intellige... 1
CBRIC-T4 – Application Drivers 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T2 – Hardware/Software Pla... 1
CONIX-T3 – Security 1
CONIX-T4 – Machine Learning 1
CONIX-T5 – Communication Positio... 1
CONIX-T6 – Programming and Resou... 1
CRISP-T2 – System Support for Ma... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T4 – Center-wide Demon... 1
Contamination Control 1
Cost Reduction 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1

GRC Science Area
ICSS – Integrated Circuit & Syst... 76
CADTS – Computer Aided Design & ... 71
NMS – Nanomanufacturing Sciences 49
MPS – Material & Process Science... 31
IPS – Interconnect & Packaging S... 30
DS – Device Sciences 22
DES – Design Sciences 20
NIS – Nanostructure & Integratio... 18
CSR – Cross-disciplinary Semicon... 17
MBP – Materials & Bulk Processes... 11
ES-H – Environmental Safety & He... 9
LIT – Lithography Sciences 8
PID – Process Integration & Devi... 8
MIC – Microstructure Sciences 7
SRCEA – SRC Education Alliance 7
INT – Interconnect Sciences 6
PKG – Packaging Sciences 5
MFGPS – Manufacturing Process Sc... 2
FAC – Factory Sciences 1
GEN – General 1
ISA – Industrial Support Activit... 1
MFG – Manufacturing Sciences 1
MSS – Manufacturing Systems Scie... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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61: pdfResearch Needs for Secure,
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62: NSF Past Research - SRC
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63: pdfSRC CONNECTIONS February 2022
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64: pdf1986 Annual Report
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69: pdf1992 Annual Report
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76: pdfSRC CONNECTIONS September 2022
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82: pdfSlide 1
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87: NRI : NRI-NSF Centers - SRC
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89: pdf1985 Annual Report
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90: University of Illinois-led SONIC Center Awarded $30 Million for...
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61 through 90 of 1,469 similar documents, best matches first.   
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