Content Type

Other	79
Patent Filings	74
Events	62

SRC Program

GRC	81
SRC	68
NRI	26
JUMP	21
STARnet	10
FCRP	5
JUMP2	5
nCORE	5
3D EC	1
ICA	1

Year

2024	5
2023	8
2022	7
2021	4
2020	2
2019	2
2018	8
2017	7
2016	11
2015	5
2014	2
2013	6
2012	11
2011	14
2010	48
2009	1

Center

SWAN	15
TxACE	15
ASCENT	12
CRISP	9
C2S2	8
EBSM	7
C-SPIN	6
INDEX	6
LEAST	6
MSD	6
FENA	5
GSRC	5
IFC	5
CEMPI	3
CHIRP	3
CNFD	3
MuSyC	3
ADA	2
DEEP3M	2
FAME	2
NRI-NSF	2
ACE	1
Benchmarking	1
C-FAR	1
IMPACT	1
MIND	1
NEWLIMITS	1
NPT	1
SMART	1
SONIC	1
TerraSwarm	1
WIN	1

Thrust/Theme

NEM – Nanoengineered Materials	12
CRISP-T1 – Hardware Support for ...	9
AMS-CSD – Analog/Mixed-Signal Ci...	8
ASCENT-T2 – Beyond CMOS	6
ASCENT-T1 – Vertical CMOS	5
BEP – Back End Processes	5
ESH – Environment Safety and Hea...	5
CADT – Computer-Aided Design and...	3
CD – Circuit Design	3
PKG – Packaging	3
ADA-T1 – Deft Development	2
Advanced Devices & Technologies	2
Back End Processes	2
DEEP3M-T4 – Architectures	2
LMD – Logic and Memory Devices	2
TT – Test & Testability	2
ASCENT-T4 – Merged Logic Memory ...	1
FACSYS – Factory Systems	1
Factory Systems	1
HWS – Hardware Security	1
I3T – Innovative and Intelligent...	1
IMPACT-T2 – Materials for Storag...	1
NEWLIMITS-T2 – 2D Materials Devi...	1
NMP – Nanomanufacturing Material...	1
PAT – Patterning	1
SMART-T1 – Spin-orbit Torque Mat...	1

GRC Science Area

NMS – Nanomanufacturing Sciences	24
IPS – Interconnect & Packaging S...	11
CADTS – Computer Aided Design & ...	10
ICSS – Integrated Circuit & Syst...	8
CSR – Cross-disciplinary Semicon...	7
DS – Device Sciences	6
MPS – Material & Process Science...	5
ES-H – Environmental Safety & He...	3
MIC – Microstructure Sciences	2
NIS – Nanostructure & Integratio...	2
PID – Process Integration & Devi...	2
SRCEA – SRC Education Alliance	2
PKG – Packaging Sciences	1