Content Type

Other	97
Patent Filings	74
Events	49

SRC Program

GRC	91
SRC	75
JUMP	23
NRI	15
nCORE	7
FCRP	5
JUMP2	5
STARnet	5
3D EC	1
SRCEA	1

Year

2024	3
2023	7
2022	6
2021	7
2020	3
2019	3
2018	7
2017	8
2016	8
2015	5
2014	5
2013	6
2012	8
2011	17
2010	51
2009	1

Center

ASCENT	10
CRISP	9
ComSenTer	4
LEAST	4
MSD	4
WIN	4
EBSM	3
GSRC	3
NEWLIMITS	3
ADA	2
C2S2	2
CEMPI	2
CHIRP	2
CNFD	2
DEEP3M	2
FAME	2
FENA	2
IFC	2
INDEX	2
MuSyC	2
SWAN	2
C-FAR	1
C-SPIN	1
CAIST	1
IMPACT	1
NCRC	1
NPT	1
NRI-NSF	1
SMART	1
SONIC	1
TerraSwarm	1
TxACE	1

Thrust/Theme

CRISP-T1 – Hardware Support for ...	9
NEM – Nanoengineered Materials	7
ASCENT-T2 – Beyond CMOS	6
NMP – Nanomanufacturing Material...	5
PKG – Packaging	5
ASCENT-T1 – Vertical CMOS	3
Advanced Devices & Technologies	3
BEP – Back End Processes	3
ADA-T1 – Deft Development	2
CFM&TCM – CFM & Total Chemical M...	2
ComSenTer-T1 – Systems and Algor...	2
DEEP3M-T4 – Architectures	2
ESH – Environment Safety and Hea...	2
Multi-level Interconnect	2
NEWLIMITS-T3 – Advanced Manufact...	2
NEWLIMITS-T4 – Characterization ...	2
TT – Test & Testability	2
ASCENT-T4 – Merged Logic Memory ...	1
AdvTech – Advanced Technology	1
ComSenTer-T2 – mm-wave/THz ICs a...	1
ComSenTer-T3 – Application-speci...	1
DCMOS – Digital CMOS Technologie...	1
FACSYS – Factory Systems	1
HWS – Hardware Security	1
IMPACT-T2 – Materials for Storag...	1
LMD – Logic and Memory Devices	1
NEWLIMITS-T1 – Novel Computing a...	1
NEWLIMITS-T2 – 2D Materials Devi...	1
NEWLIMITS-T5 – Simulations and M...	1
PAT – Patterning	1
Processes – Processes	1
SMART-T1 – Spin-orbit Torque Mat...	1
SemiSynBio – Semiconductor Synth...	1

GRC Science Area

NMS – Nanomanufacturing Sciences	18
IPS – Interconnect & Packaging S...	11
MIC – Microstructure Sciences	7
CADTS – Computer Aided Design & ...	6
DS – Device Sciences	6
ICSS – Integrated Circuit & Syst...	6
NIS – Nanostructure & Integratio...	6
SRCEA – SRC Education Alliance	5
PID – Process Integration & Devi...	4
CSR – Cross-disciplinary Semicon...	3
MPS – Material & Process Science...	3
PKG – Packaging Sciences	3
DES – Design Sciences	2
INT – Interconnect Sciences	2
LIT – Lithography Sciences	2
MBP – Materials & Bulk Processes...	2