Questions?
Content Type
Other 181
Events 111
Patent Filings 78

SRC Program
SRC 152
GRC 124
JUMP 38
JUMP2 21
NRI 17
FCRP 8
STARnet 7
nCORE 6
3D EC 2
ICA 1
NINE 1
SRP 1

Year
2024 10
2023 24
2022 26
2021 26
2020 13
2019 7
2018 13
2017 16
2016 8
2015 5
2014 5
2013 9
2012 20
2011 41
2010 67
2009 1

Center
ASCENT 18
CRISP 9
EBSM 8
MSD 8
C2S2 6
FENA 6
C-SPIN 5
GSRC 5
IFC 5
TxACE 5
ComSenTer 4
MuSyC 4
CBRIC 3
CHIRP 3
CONIX 3
IMPACT 3
LEAST 3
SUPREME 3
ACE 2
ADA 2
CUBIC 2
DEEP3M 2
E2CDA-NRI 2
INDEX 2
NRI-NSF 2
SWAN 2
C-FAR 1
CHIMES 1
CNFD 1
COCOSYS 1
COGNISENSE 1
FAME 1
NPT 1
PRISM 1
SONIC 1
TerraSwarm 1

Thrust/Theme
ASCENT-T1 – Vertical CMOS 11
Advanced Devices & Technologies 8
CRISP-T1 – Hardware Support for ... 7
ESH – Environment Safety and Hea... 7
ASCENT-T2 – Beyond CMOS 5
HWS – Hardware Security 5
NEM – Nanoengineered Materials 5
NMP – Nanomanufacturing Material... 4
PKG – Packaging 4
CONIX-T1 – ARENA Integrator 3
LMD – Logic and Memory Devices 3
ADA-T1 – Deft Development 2
AMS-CSD – Analog/Mixed-Signal Ci... 2
CBRIC-T1 – Neuro-inspired Algori... 2
CRISP-T3 – Scaling Applications ... 2
ComSenTer-T1 – Systems and Algor... 2
DEEP3M-T4 – Architectures 2
I3T – Innovative and Intelligent... 2
IMPACT-T1 – Materials for Scaled... 2
PAT – Patterning 2
Packaging & Interconnect Systems 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
AIHW – Artificial Intelligence H... 1
ASCENT-T4 – Merged Logic Memory ... 1
CADT – Computer-Aided Design and... 1
CBRIC-T2 – Neuromorphic Fabrics 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T2 – mm-wave/THz ICs a... 1
ComSenTer-T3 – Application-speci... 1
FACSYS – Factory Systems 1
IMPACT-T2 – Materials for Storag... 1
IRP – India Research Program 1
LPD – Logic & Physical Design 1
Materials 1
PRISM-T1 – Systems and Software 1
PRISM-T2 – Architecture 1
PRISM-T3 – Devices and Circuits 1
PRISM-T4 – Grand Challenges 1
SLD – System Level Design 1
SUPREME-T1 – Digital and Analog 1
SUPREME-T2 – Memory and Applicat... 1
SUPREME-T3 – Interconnects and M... 1
SUPREME-T4 – Materials Discovery... 1

GRC Science Area
NMS – Nanomanufacturing Sciences 25
NIS – Nanostructure & Integratio... 13
CADTS – Computer Aided Design & ... 11
IPS – Interconnect & Packaging S... 8
CSR – Cross-disciplinary Semicon... 7
DS – Device Sciences 7
ICSS – Integrated Circuit & Syst... 7
PID – Process Integration & Devi... 5
MIC – Microstructure Sciences 4
ES-H – Environmental Safety & He... 3
MPS – Material & Process Science... 3
SRCEA – SRC Education Alliance 3
INT – Interconnect Sciences 1
PKG – Packaging Sciences 1

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Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>