Questions?
Content Type
Other 379
Events 316
Patent Filings 265

SRC Program
GRC 395
SRC 351
FCRP 57
STARnet 56
JUMP 42
NRI 26
JUMP2 23
SRP 6
3D EC 4
Auto 4
ERI 2
ICA 2
MSR-Intel 2
SRCEA 2
nCORE 1

Year
2024 12
2023 39
2022 50
2021 47
2020 19
2019 21
2018 36
2017 56
2016 21
2015 25
2014 25
2013 27
2012 43
2011 165
2010 101
2009 1
2008 1

Center
C2S2 26
ASCENT 25
ACE4S 22
LEAST 21
TxACE 19
C-FAR 18
GSRC 17
SONIC 12
C-SPIN 9
FENA 9
CBRIC 7
EBSM 7
CONIX 6
E2CDA-NRI 6
TerraSwarm 6
CHIRP 5
CRISP 5
IFC 5
CNFD 4
ComSenTer 4
INDEX 4
MSD 4
MuSyC 4
SWAN 4
FAME 3
SUPREME 3
ACE 2
CEMPI 2
CUBIC 2
NRI-NSF 2
ADA 1
Benchmarking 1
CAIST 1
CDADIC 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
IPC 1
JUMP-URI 1
MIND 1

Thrust/Theme
SLD – System Level Design 26
CD – Circuit Design 25
I3T – Innovative and Intelligent... 23
PAT – Patterning 18
LPD – Logic & Physical Design 16
ISD – Integrated System Design 14
AMS-CSD – Analog/Mixed-Signal Ci... 13
ASCENT-T1 – Vertical CMOS 13
CADT – Computer-Aided Design and... 13
PKG – Packaging 13
HWS – Hardware Security 12
TT – Test & Testability 12
ASCENT-T2 – Beyond CMOS 9
VER – Verification 8
AIHW – Artificial Intelligence H... 6
CONIX-T1 – ARENA Integrator 6
ESH – Environment Safety and Hea... 6
Pat(MPS) – Patterning 6
NMP – Nanomanufacturing Material... 5
ASCENT-T3 – Heterogeneous Integr... 4
LMD – Logic and Memory Devices 4
Advanced Devices & Technologies 3
BEP – Back End Processes 3
Back End Processes 3
CBRIC-T1 – Neuro-inspired Algori... 3
CRISP-T1 – Hardware Support for ... 3
CRISP-T3 – Scaling Applications ... 3
ComSenTer-T1 – Systems and Algor... 3
MT – Memory Technologies 3
Packaging & Interconnect Systems 3
Physical Design 3
SemiSynBio – Semiconductor Synth... 3
ASCENT-T4 – Merged Logic Memory ... 2
CBRIC-T2 – Neuromorphic Fabrics 2
CFM&TCM – CFM & Total Chemical M... 2
ComSenTer-T2 – mm-wave/THz ICs a... 2
DV – Design Verification 2
DesTech – Design Techniques 2
Doping Technologies 2
EP3C – Efficiency and Performanc... 2
IRP – India Research Program 2
Masks 2
Reliability 2
SCARF – Supply Chain AI Realized... 2
Synthesis & Verification 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADA-T1 – Deft Development 1
ADA-T2 – Algorithm-driven Archit... 1
ADA-T3 – Technology-driven Syste... 1
ADS – Alternative Device Structu... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Technology Option 1
Analysis Design & Simulation 1
C&S – Controls and Sensing 1
CBRIC-T3 – Distributed Intellige... 1
CBRIC-T4 – Application Drivers 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T2 – Hardware/Software Pla... 1
CONIX-T3 – Security 1
CONIX-T4 – Machine Learning 1
CONIX-T5 – Communication Positio... 1
CONIX-T6 – Programming and Resou... 1
CRISP-T2 – System Support for Ma... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T3 – Application-speci... 1
ComSenTer-T4 – Center-wide Demon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
JUMP-URI – JUMP Undergraduate Re... 1

GRC Science Area
CADTS – Computer Aided Design & ... 57
ICSS – Integrated Circuit & Syst... 53
NMS – Nanomanufacturing Sciences 33
MPS – Material & Process Science... 26
IPS – Interconnect & Packaging S... 20
LIT – Lithography Sciences 19
NIS – Nanostructure & Integratio... 10
DS – Device Sciences 9
DES – Design Sciences 8
SRCEA – SRC Education Alliance 8
CSR – Cross-disciplinary Semicon... 5
PKG – Packaging Sciences 5
INT – Interconnect Sciences 4
MBP – Materials & Bulk Processes... 3
MFGPS – Manufacturing Process Sc... 3
ES-H – Environmental Safety & He... 2
FAC – Factory Sciences 1
GEN – General 1
ISA – Industrial Support Activit... 1
MFG – Manufacturing Sciences 1
MIC – Microstructure Sciences 1
MSS – Manufacturing Systems Scie... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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