Questions?
Content Type
Other 604
Events 279
Patent Filings 188

SRC Program
SRC 514
GRC 242
FCRP 88
STARnet 60
NRI 59
JUMP 55
JUMP2 26
nCORE 21
SRP 6
SRCEA 5
ICA 2
3D EC 1
Auto 1
ERI 1
MSR-Intel 1
Undergrad 1

Year
2024 19
2023 50
2022 63
2021 58
2020 26
2019 25
2018 47
2017 42
2016 33
2015 36
2014 27
2013 39
2012 46
2011 168
2010 194
2009 1

Center
C-SPIN 40
IFC 37
C2S2 30
ASCENT 24
MSD 24
GSRC 23
FENA 21
SWAN 16
LEAST 15
FAME 14
EBSM 13
CRISP 12
INDEX 12
CNFD 11
CBRIC 10
NRI-NSF 10
MuSyC 9
TxACE 8
E2CDA-NRI 7
CONIX 6
IMPACT 6
NEWLIMITS 6
AMML 5
C-FAR 5
ComSenTer 5
MIND 5
SONIC 5
TerraSwarm 5
WIN 5
ADA 4
CHIRP 4
Benchmarking 3
DEEP3M 3
SUPREME 3
ACE 2
E2CDA 2
NPT 2
SMART 2
ACE4S 1
CAIST 1

Thrust/Theme
ASCENT-T1 – Vertical CMOS 13
ESH – Environment Safety and Hea... 12
CRISP-T1 – Hardware Support for ... 10
ASCENT-T2 – Beyond CMOS 9
NMP – Nanomanufacturing Material... 9
PKG – Packaging 7
CONIX-T1 – ARENA Integrator 6
LMD – Logic and Memory Devices 6
AMML-T1 – Antiferromagnetic Magn... 5
AMS-CSD – Analog/Mixed-Signal Ci... 5
CBRIC-T2 – Neuromorphic Fabrics 5
HWS – Hardware Security 5
IMPACT-T1 – Materials for Scaled... 5
ADA-T1 – Deft Development 4
CBRIC-T1 – Neuro-inspired Algori... 4
ISD – Integrated System Design 4
ASCENT-T3 – Heterogeneous Integr... 3
CADT – Computer-Aided Design and... 3
CD – Circuit Design 3
CRISP-T3 – Scaling Applications ... 3
ComSenTer-T1 – Systems and Algor... 3
DEEP3M-T4 – Architectures 3
LPD – Logic & Physical Design 3
NEM – Nanoengineered Materials 3
NEWLIMITS-T2 – 2D Materials Devi... 3
SCARF – Supply Chain AI Realized... 3
SLD – System Level Design 3
TT – Test & Testability 3
VER – Verification 3
ASCENT-T4 – Merged Logic Memory ... 2
ComSenTer-T2 – mm-wave/THz ICs a... 2
ComSenTer-T3 – Application-speci... 2
E2CDA2 – E2CDA 2.0 2
EP3C – Efficiency and Performanc... 2
IMPACT-T2 – Materials for Storag... 2
Materials 2
NEWLIMITS-T1 – Novel Computing a... 2
NEWLIMITS-T3 – Advanced Manufact... 2
NEWLIMITS-T4 – Characterization ... 2
PAT – Patterning 2
SMART-T1 – Spin-orbit Torque Mat... 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADA-T2 – Algorithm-driven Archit... 1
ADA-T3 – Technology-driven Syste... 1
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
CBRIC-T3 – Distributed Intellige... 1
CBRIC-T4 – Application Drivers 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T2 – Hardware/Software Pla... 1
CONIX-T3 – Security 1
CONIX-T4 – Machine Learning 1
CONIX-T5 – Communication Positio... 1
CONIX-T6 – Programming and Resou... 1
CRISP-T2 – System Support for Ma... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T4 – Center-wide Demon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1

GRC Science Area
NMS – Nanomanufacturing Sciences 29
CADTS – Computer Aided Design & ... 20
CSR – Cross-disciplinary Semicon... 15
DS – Device Sciences 15
IPS – Interconnect & Packaging S... 15
ICSS – Integrated Circuit & Syst... 12
ES-H – Environmental Safety & He... 7
SRCEA – SRC Education Alliance 5
PKG – Packaging Sciences 4
INT – Interconnect Sciences 2
MPS – Material & Process Science... 2
NIS – Nanostructure & Integratio... 2
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MSS – Manufacturing Systems Scie... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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1: Bio: Roman Caudillo - SRC
Roman Caudillo JUMP Director Roman Caudillo Dr. Roman Caudillo joined SRC as an Intel Assignee to serve as the JUMP 2.0 Director starting January 2023. Previously, and throughout ...
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2: pdfJUMP 2.0 Virtual SAB - End of Year 1 December 5, 2023
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3: pdfJUMP 2.0 SAB F2F with Center Leadership April 25-26, 2023 ADI...
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URL: https://www.src.org/about/p001960.pdf
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5: pdfTable
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SRC Management Todd Younkin President & CEO Karen Di Spigna Chief Accounting Officer, Finance and Contracts Jennifer Dickens Communications Manager Naomi Godfrey Director, Human ...
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7: pdfJUMP 2.0 SAB F2F with Center Leadership April 25-26, 2023 ADI...
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URL: https://www.src.org/...b_f2f_april_2023_romanwelcomeday1.pdf
Modified: 2023-04-28 - 980KB
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8: pdfSRC CONNECTIONS February 23
F E B R U A R Y 2 0 2 3 CONNECTIONS L A T E S T N E W S A N D U P D A T E S F R O M S E M I C O N D U C T O R R E S E A R C H C O R P O R A T I O N Get to Know the 7 New JUMP 2.0 ...
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9: SRC Biography: Kashyap Yellai - SRC
Kashyap Yellai Program Manager Kashyap Yellai Kashyap Yellai joined SRC as a program manager in 2022. Kashyap leads Logic & Memory Devices (LMD), Nanomanufacturing Materials & ...
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10: pdf2016 SRC Corporate Annual Report
A R Letter from the President SRC - Evolving to Meet Tomorrow's Challenges SRC continues to evolve from a company focused on process and device research to one that approaches the ...
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11: SRC Member Organizations - SRC
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12: NST - SRC
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13: nCORE Request for Proposals - SRC
Request for Proposals for the nanoelectronic COmputing REsearch (nCORE) Program A. Background A1. Research Areas of Interest A2. Proposal Process A3. Program Scope and Planned ...
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14: pdfJUMP Frequently Asked Questions - 2/28/2017 @ 1:00 pm EST
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15: pdfProposers' Day Workshop
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S E P T E M B E R 2 0 2 2 Register Here* *SRC.org website account is required September 18 - 20, 2022 Austin, Texas Register for TECHCON 2022 CONNECTIONS L A T E S T N E W S A N D ...
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17: pdfSRC CONNECTIONS January 2022
J A N U A R Y 2 0 2 2 The Semiconductor Research Corporation (SRC) and Defense Advanced Research Projects Agency (DARPA) have announced a new solicitation for the Joint University ...
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18: SRC Biography: Todd Younkin - SRC
Todd Younkin President and CEO In August of 2020, Dr. Todd Younkin became the President & CEO of SRC, where he leads a ~$100M/yr. global research agenda supported by ~3k academic ...
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19: pdfAnnual Report
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20: JUMP Mission - SRC
JUMP Mission The mission of JUMP is to look beyond today's technology horizon and lay the scientific groundwork that extends the viability of Moore's Law economics through 2040. ...
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21: pdfSRC CONNECTIONS SEPTEMBER 2021
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23: pdfFI Rponse to Commerce Q1
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24: Carbon Electronics Workshop (Event E003973) - SRC
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25: pdfTable
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26: pdfRFP for NERC #S201006
1 Request for Proposals for the Nanoelectronics Research Initiative (NERC RFP # S201006) A. Background The Nano Electronics Research Corporation (NERC) is soliciting proposals ...
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27: pdfPowerPoint Presentation
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28: JUMP Research Announcement - SRC
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29: pdfSUPREME Annual Review - JUMP 2.0 Director's Perspective
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30: Invited JUMP URI Proposal Call - SRC
Invited Proposals for JUMP Undergraduate Research Initiative (URI) - Due June 29, 2018 Program Objectives and Description Proposal Guidelines Timetable and Deadlines Program ...
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1 through 30 of 1,071 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>