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Thrust/Theme
PKG – Packaging
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| 1 through 14 of
14 similar documents, best matches first. |
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- 1:
 Overview of Research
- Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB
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- 2:
Research Program Annual Review
- Packaging (PKG) Research Program Annual Review July 12-14, 2022 Dallas, TX @ Texas Instruments John Oakley, Science Director Tameka Bell, Research Program Coordinator SRC Select ...
URL: https://www.src.org/...oslides/2022reviewpkgintroduction.pdf
Modified: 2022-07-27 - 514KB
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- 3:
IRP Advisory Board Meeting
- Packaging Research Program e-Kickoff March 22-23, 2023, virtual John Oakley, Science Director LaDonya Dooley, Research Program Coordinator Day 1 : https://www.src.org/calendar/...
URL: https://www.src.org/.../1_2023-ekickoff-pkg-introduction.pdf
Modified: 2023-03-27 - 535KB
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- 4:
3DASSM
- Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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- 5:
Virtual John Oakley, Science Director Tameka Bell & Mary Nichols...
- Packaging (PKG) e-Kickoff March 23 and 29-31, 2022 Virtual John Oakley, Science Director Tameka Bell & Mary Nichols, Research Program Coordinator SRC Select Disclosure Because the ...
URL: https://www.src.org/calendar/e007527/pkgintroslides.pdf
Modified: 2022-04-04 - 663KB
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- 6:
Student Poster Information
- 2021 Packaging Review August 17-19 - Virtual Event https://www.src.org/calendar/e007229/ Student Poster Information (Abstracts) Featuring: Diego Vaca Allison Osmanson Yi Ram Kim ...
URL: https://www.src.org/calendar/e007229/pkg_poster_catalog.pdf
Modified: 2021-08-12 - 305KB
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- 7:
2021 Packaging CHIRP Center Review
- 2021 Packaging CHIRP Center Review August 24-26 - Virtual Event https://www.src.org/calendar/e007230/ Student Poster Information (Abstracts) Featuring: Sanoop Thekkut Ronit Das ...
URL: https://www.src.org/...ster/catalog/chirp_poster_catalog.pdf
Modified: 2021-08-23 - 597KB
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- 8:
Semiconductor Research Corporation - SRC
- GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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- 9:
Composite Thermal Interface Material Including Particles and...
- Composite Thermal Interface Material Including Particles and Nanofibers Application Type: Utility Patent Number: 7504453 Country: United States Status: Filed on 17-Dec-2004, Issued ...
URL: https://www.src.org/library/patent/p0506/
Modified: 2009-03-17 - 22KB
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- 10:
Composite Thermal Interface Material Including Aligned Nanofibers...
- Composite Thermal Interface Material Including Aligned Nanofibers with Low Melting Temperature Binder Application Type: Utility Patent Number: 8389119 Country: United States ...
URL: https://www.src.org/library/patent/p1023/
Modified: 2013-03-05 - 25KB
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- 11:
Integrated Tunable Inductors (Patent P1632) - SRC
- Integrated Tunable Inductors Application Type: Utility Patent Number: 9881731 Country: United States Status: Filed on 14-Jun-2016, Issued on 30-Jan-2018 Organization: Arizona State ...
URL: https://www.src.org/library/patent/p1632/
Modified: 2018-01-30 - 24KB
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- 12:
Mixed-signal Substrate with Integrated Through-Substrate Vias...
- Mixed-signal Substrate with Integrated Through-Substrate Vias Application Type: Utility Patent Number: 10330874 Country: United States Status: Filed on 2-Feb-2017, Issued on ...
URL: https://www.src.org/library/patent/p1675/
Modified: 2019-06-25 - 23KB
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- 13:
Methods and Apparatuses for Integrated Packaging of Microelectromechan...
- Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices Application Type: Utility Patent Number: 8557623 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1230/
Modified: 2013-10-15 - 26KB
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- 14:
PKG AR Day 3 Recordings - SRC
- 2022 Packaging / Packaging CHIRP Annual Review Thursday, July 14, 2022 Presentation Videos Bongtae Han / UM/College Park Matthew Johnston / Oregon State Univ. Muhannad S. Bakir / ...
URL: https://www.src.org/calendar/e007520/day3recordings/
Modified: 2022-07-14 - 22KB
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