Multiple-Thickness Gate Oxide Formed by Oxygen Implantation - device claims

    • Application Type:
      Utility
      Patent Number:
      6855994
      Country:
      United States
      Status:
      Filed on 5-Sep-2001, Issued on 15-Feb-2005, Patent Abandoned
      Organization:
      University of California, Berkeley
      SRC Filing ID:
      P0259

    Inventors

    • Chenming Hu (UC/Berkeley)
    • Tsu-Jae Liu (UC/Berkeley)

    Related Patents

    P0086
    Abandoned Patent
    GRC

    Multiple-Thickness Gate Oxide Formed by Oxygen Implantation - Method claims

    Chenming Hu (UC/Berkeley); Tsu-Jae Liu (UC/Berkeley)
    Patent Abandoned
    Application Type: Utility
    P0210
    Abandoned Application
    GRC

    Multiple-Thickness Gate Oxide Formed by Oxygen Implantation

    Chenming Hu (UC/Berkeley); Tsu-Jae Liu (UC/Berkeley)
    Patent Application Abandoned
    Application Type: Foreign National
    P0211
    Expired
    GRC

    Multiple-Thickness Gate Oxide Formed by Oxygen Implantation

    Chenming Hu (UC/Berkeley); Tsu-Jae Liu (UC/Berkeley)
    Patent Expired
    Application Type: Foreign National
    P0212
    Abandoned Application
    GRC

    Multiple-Thickness Gate Oxide Formed by Oxygen Implantation

    Chenming Hu (UC/Berkeley); Tsu-Jae Liu (UC/Berkeley)
    Patent Application Abandoned
    Application Type: European Patent Office
    P0213
    Application Expired
    GRC

    Multiple-Thickness Gate Oxide Formed by Oxide Implantation

    Chenming Hu (UC/Berkeley); Tsu-Jae Liu (UC/Berkeley)
    Patent Application Expired
    Application Type: Patent Cooperation Treaty

    INFORMATION

    FOR MEMBERS

    SRC VALUE

    ACADEMIA

    4819 Emperor Blvd, Suite 300 Durham, NC 27703 Voice: (919) 941-9400 Fax: (919) 941-9450

    © 2024 by Semiconductor Research Corporation ®
    Access to information on this website may be limited to member companies,
    participating agencies, and qualified researchers.

    Important Information for the SRC website. This site uses cookies to store information on your computer. By continuing to use our site, you consent to our cookies. If you are not happy with the use of these cookies, please review our Cookie Policy to learn how they can be disabled. By disabling cookies, some features of the site will not work.