Interconnection Architecture and Method of Assessing Interconnection Architecture

    • Application Type:
      Utility
      Patent Number:
      7622779
      Country:
      United States
      Status:
      Filed on 1-Mar-2005, Issued on 24-Nov-2009, Patent Abandoned
      Organization:
      University of California, San Diego
      SRC Filing ID:
      P1027

    Inventors

    • Hongyu Chen (UC/San Diego)
    • Bo Yao (UC/San Diego)
    • Chung-Kuan Cheng (UC/San Diego)

    Related Patents

    P0388
    Application Expired
    GRC

    Interconnection Architecture and Method of Assessing Interconnection Architecture

    Hongyu Chen (UC/San Diego); Chung-Kuan Cheng (UC/San Diego); Bo Yao (UC/San Diego)
    Patent Application Expired
    Application Type: Patent Cooperation Treaty

    INFORMATION

    FOR MEMBERS

    SRC VALUE

    ACADEMIA

    4819 Emperor Blvd, Suite 300 Durham, NC 27703 Voice: (919) 941-9400 Fax: (919) 941-9450

    © 2024 by Semiconductor Research Corporation ®
    Access to information on this website may be limited to member companies,
    participating agencies, and qualified researchers.

    Important Information for the SRC website. This site uses cookies to store information on your computer. By continuing to use our site, you consent to our cookies. If you are not happy with the use of these cookies, please review our Cookie Policy to learn how they can be disabled. By disabling cookies, some features of the site will not work.