Achieving Etching Selectivity for Atomic Layer Etching Processes by Utilizing Material-Selective Deposition Phenomena

• Application Type:

  Utility

  Patent Number:

  10790157

  Country:

  United States

  Status:

  Filed on 16-Jul-2019, Issued on 29-Sep-2020

  Organization:

  University of Maryland, College Park

  SRC Filing ID:

  P1842

Inventors

• Gottlieb Oehrlein (UM/College Park)
• Chen Li (UM/College Park)
• Kang Yi Lin (UM/College Park)