Questions?
Content Type
Other 506
Events 220
Patent Filings 1

SRC Program
SRC 423
GRC 234
NRI 20
JUMP2 19
FCRP 9
JUMP 6
SRP 5
3D EC 3
Auto 3
SRCEA 3
ICA 2
STARnet 2
nCORE 2

Year
2024 21
2023 38
2022 51
2021 37
2020 21
2019 25
2018 27
2017 30
2016 31
2015 32
2014 26
2013 33
2012 36
2011 188
2010 126
2009 1

Center
C2S2 25
FENA 25
GSRC 25
IFC 25
MSD 25
MuSyC 14
TxACE 12
EBSM 11
NPT 7
C-FAR 6
CHIRP 6
CNFD 6
FAME 6
INDEX 6
LEAST 6
SONIC 6
SWAN 6
TerraSwarm 6
ASCENT 3
CBRIC 3
ACE 2
CUBIC 2
SUPREME 2
ACE4S 1
ADA 1
CAIST 1
CDADIC 1
CEMPI 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
CONIX 1
CRISP 1
ComSenTer 1
IPC 1
JUMP-URI 1
NCRC 1
PRISM 1

Thrust/Theme
PKG – Packaging 11
NMP – Nanomanufacturing Material... 6
ESH – Environment Safety and Hea... 5
LMD – Logic and Memory Devices 4
AMS-CSD – Analog/Mixed-Signal Ci... 3
ASCENT-T3 – Heterogeneous Integr... 3
HWS – Hardware Security 3
CADT – Computer-Aided Design and... 2
CD – Circuit Design 2
EP3C – Efficiency and Performanc... 2
ISD – Integrated System Design 2
LPD – Logic & Physical Design 2
SCARF – Supply Chain AI Realized... 2
SLD – System Level Design 2
TT – Test & Testability 2
VER – Verification 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADA-T1 – Deft Development 1
ADA-T2 – Algorithm-driven Archit... 1
ADA-T3 – Technology-driven Syste... 1
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
ASCENT-T1 – Vertical CMOS 1
ASCENT-T2 – Beyond CMOS 1
ASCENT-T4 – Merged Logic Memory ... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CBRIC-T1 – Neuro-inspired Algori... 1
CBRIC-T2 – Neuromorphic Fabrics 1
CBRIC-T3 – Distributed Intellige... 1
CBRIC-T4 – Application Drivers 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T1 – ARENA Integrator 1
CONIX-T2 – Hardware/Software Pla... 1
CONIX-T3 – Security 1
CONIX-T4 – Machine Learning 1
CONIX-T5 – Communication Positio... 1
CONIX-T6 – Programming and Resou... 1
CRISP-T1 – Hardware Support for ... 1
CRISP-T2 – System Support for Ma... 1
CRISP-T3 – Scaling Applications ... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T1 – Systems and Algor... 1
ComSenTer-T2 – mm-wave/THz ICs a... 1
ComSenTer-T3 – Application-speci... 1
ComSenTer-T4 – Center-wide Demon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
Interconnect Architecture 1
JUMP-URI – JUMP Undergraduate Re... 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1

GRC Science Area
CADTS – Computer Aided Design & ... 44
NMS – Nanomanufacturing Sciences 35
CSR – Cross-disciplinary Semicon... 32
DS – Device Sciences 32
IPS – Interconnect & Packaging S... 28
ICSS – Integrated Circuit & Syst... 26
SRCEA – SRC Education Alliance 6
PKG – Packaging Sciences 5
ES-H – Environmental Safety & He... 4
NIS – Nanostructure & Integratio... 2
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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1: S201005 - Packaging Solicitation - SRC
Call for Research in Packaging Overview Research Needs White Paper Guidelines Timetable and Deadlines Overview The Interconnect and Packaging Sciences (IPS) area of SRC is ...
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12: GRC: Call for Research in BEP and Packaging - SRC
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1 through 30 of 727 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>