Questions?
[x] GRC Science Area
IPS – Interconnect & Packaging Sciences

Content Type
Events 29
Other 1
Patent Filings 1

SRC Program
SRC 24
GRC 7
3D EC 2
FCRP 2

Year
2016 3
2013 8
2012 7
2011 10
2010 1

Center
C2S2 15
FENA 15
GSRC 15
IFC 15
MSD 15
MuSyC 15
C-FAR 9
CNFD 9
FAME 9
INDEX 9
LEAST 9
SONIC 9
SWAN 9
TerraSwarm 9
EBSM 8
TxACE 8
NPT 7
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
PKG – Packaging 5
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AMS-CSD – Analog/Mixed-Signal Ci... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

1 through 30 of 31 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 next >>
1: pdfDescription
Call for Abstracts Call for abstracts opens Monday, January 16, 2012. Deadline for submission is 3:00 p.m. eastern time on Wednesday, February 22, 2012. Description TECHCON is ...
URL: https://www.src.org/calendar/e004114/call-for-abstracts.pdf
Modified: 2012-01-26 - 27KB
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2: pdfOverview of Research
Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB
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3: 3D IC University Research e-Workshop (Event E004357) - SRC
3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB
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4: Submitting Presentation - TECHCON 2011 AUthor's Kit - SRC
TECHCON 2011 Author's Kit Instructions for Submitting Oral Presentation Materials Presentation Materials: DEADLINE IS August 24, 2011 Please follow these instructions carefully; ...
URL: https://www.src.org/calendar/e004113/submit-presentation/
Modified: 2011-04-15 - 22KB
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5: TECHCON 2013 Authors Kit: Submitting the Oral Presentation -...
TECHCON 2012 TECHCON 2013 Author's Kit: Submitting the Oral Presentation The deadline for presentation materials is August 21, 2013 Please follow these instructions carefully; our ...
URL: https://www.src.org/...ndar/e004683/submitting-presentation/
Modified: 2013-04-24 - 22KB
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6: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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7: TECHCON 2012 - Author's Kit: Submitting Oral Presentation - SRC
TECHCON 2012: Instructions for Submitting Oral Presentation Materials Presentation Materials: DEADLINE IS August 22, 2012 Please follow these instructions carefully; our time and ...
URL: https://www.src.org/...4114/authors-kit/submit-presentation/
Modified: 2012-05-10 - 22KB
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8: Semiconductor Research Corporation - SRC
GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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9: TECHCON 2012 (Event E004114) - SRC
TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB
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10: pdfPresentation Title
PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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11: Guidelines for 4-Page Paper - TECHCON 2011 Author's Kit - SRC
TECHCON 2011 Author's Kit Guidelines for 4-Page Paper and Electronic Submission 4-PAGE PAPER: DEADLINE IS JUNE 21, 2011 Papers should be no more than four (4) pages including ...
URL: https://www.src.org/calendar/e004113/4-page-paper/
Modified: 2011-04-15 - 21KB
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12: TECHCON 2012 - Author's Kit: 4 Page Paper Guide - SRC
TECHCON 2012 Author's Kit: Guidelines for 4-Page Paper and Electronic Submission 4-PAGE PAPER: DEADLINE IS JUNE 13, 2012 Papers should be no more than four (4) pages including all ...
URL: https://www.src.org/...dar/e004114/authors-kit/4-page-paper/
Modified: 2012-05-10 - 21KB
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13: TECHCON 2013 Authors Kit: Guidelines for 4-Page Paper and - SRC
TECHCON 2012 TECHCON 2013 Author's Kit: Guidelines for 4-Page Paper and Electronic Submission Paper Guidelines Papers should be no more than four (4) pages including all figures ...
URL: https://www.src.org/calendar/e004683/paper-submisison/
Modified: 2013-04-24 - 21KB
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14: pdfMEMORANDUM
MEMORANDUM TO: TECHCON 2011 Session Chairs, Vice Chairs, Judges FROM: Harold Hosack, TECHCON 2011 Judges Chair DATE: August 12, 2011 SUBJECT: Chairs, Vice Chairs, Judges ...
URL: https://www.src.org/calendar/e004113/letter-judges.pdf
Modified: 2011-08-10 - 22KB
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15: 2013 GRC SACC and TAB Chair Recognition - SRC
2013 GRC SACC and TAB Chair Recognition TAB and SACC Chairs at TECHCON 2013 Technical Advisory Boards (TABs) and Science Area Coordinating Committees (SACCs) work together with the ...
URL: https://www.src.org/calendar/e004683/tab-chair/
Modified: 2011-09-16 - 21KB
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16: TECHCON 2011 (Event E004113) - SRC
TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
URL: https://www.src.org/calendar/e004113/
Modified: 2012-03-13 - 97KB
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17: pdfSemiconductor Research Corporation
TECHCON 2012 Judging Criteria Criteria Technical Content (0 - 35 points) Perceived Value (0 - 15 points) Technology/Information Transfer (0 - 20 points) Presentation (Paper and ...
URL: https://www.src.org/calendar/e004114/judging-criteria.pdf
Modified: 2012-05-10 - 13KB
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18: Judging Criteria - TECHCON 2011 Author's Kit - SRC
TECHCON 2011 Author's Kit Judging Criteria Criteria Technical Content 0 - 35 points Perceived Value 0 - 15 points Technology / Information Transfer 0 - 20 points Presentation ...
URL: https://www.src.org/calendar/e004113/judging-criteria/
Modified: 2010-06-21 - 22KB
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19: pdfPowerPoint Presentation
Paper Title Authors (presenter first) University Presenter's e-mail address Theme/Task: XXXX.XXX Note: You may alter this slide design to match your template. Make sure your title ...
URL: https://www.src.org/calendar/e004683/sample-slides.pdf
Modified: 2013-04-25 - 192KB
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20: Composite Thermal Interface Material Including Aligned Nanofibers...
Composite Thermal Interface Material Including Aligned Nanofibers with Low Melting Temperature Binder Application Type: Utility Patent Number: 8389119 Country: United States ...
URL: https://www.src.org/library/patent/p1023/
Modified: 2013-03-05 - 25KB
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21: Poster Instructions - TECHCON 2011 Author's Kit - SRC
TECHCON 2011 Poster/Demonstration Instructions All paper presenters are expected to present a poster. Failure to present a poster will adversely affect the judging of your ...
URL: https://www.src.org/calendar/e004113/poster-instructions/
Modified: 2011-04-15 - 24KB
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22: TECHCON 2012 - Author's Kit: Poster-Instructions - SRC
TECHCON 2012 - Poster/Demonstration Instructions All paper presenters are expected to present a poster. Failure to present a poster will adversely affect the judging of your ...
URL: https://www.src.org/...4114/authors-kit/poster-instructions/
Modified: 2012-05-10 - 24KB
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23: TECHCON 2013 Authors Kit: Poster Instructions - SRC
TECHCON 2012 TECHCON 2013 Author's Kit: Poster Instructions All paper presenters are expected to present a poster. Failure to present a poster will adversely affect the judging of ...
URL: https://www.src.org/calendar/e004683/poster-instructions/
Modified: 2013-04-24 - 24KB
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24: pdfInstructions/Guidelines for Session Chairs & Vice Chairs
TECHCON 2013 Instructions/Guidelines for Session Chairs & Vice Chairs Each presentation must be held to 15 minutes - if a presenter does not use all of the allotted time, it is up ...
URL: https://www.src.org/calendar/e004683/instructions-chairs.pdf
Modified: 2013-07-24 - 14KB
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25: TECHCON 2013 Authors Kit: Preparing the Oral Presentation - SRC
TECHCON 2012 TECHCON 2013 Author's Kit: Preparing the Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals ...
URL: https://www.src.org/calendar/e004683/preparing-presentation/
Modified: 2013-04-24 - 24KB
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26: TECHCON 2012 - Author's Kit: Preparing Oral Presentation - SRC
TECHCON 2012: Preparing the Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals that are readable from all ...
URL: https://www.src.org/...4/authors-kit/preparing-presentation/
Modified: 2012-05-10 - 24KB
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27: pdfMicrosoft PowerPoint - Watson SRC TECHCON 090913 FINAL PUBLISH...
© 2013 International Business Machines Corporation SRC TECHCON 2013 Putting Watson to Work September 9, 2013 Richard Talbot Director, PLM IBM Power Systems - Austin, Texas ...
URL: https://www.src.org/...004683/watson/talbot-techcon-2013.pdf
Modified: 2013-09-19 - 3.0MB
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28: pdfTECHCON SESSION CHAIR/CO-CHAIR INFORMATION
TECHCON 2011 Instructions/Guidelines for Session Chairs & Vice Chairs 1. Please review information for Chairs/Vice Chairs carefully prior to coming to TECHCON 2011. 2. Both the ...
URL: https://www.src.org/calendar/e004113/chair-instructions.pdf
Modified: 2011-08-10 - 14KB
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29: TECHCON 2013 (Event E004683) - SRC
TECHCON 2013 Date: Monday, Sept. 9, 2013, 8 a.m. - Tuesday, Sept. 10, 2013, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004683 E004683 image ...
URL: https://www.src.org/calendar/e004683/
Modified: 2014-03-10 - 136KB
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30: pdfMicrosoft PowerPoint - Lall_PackagedAutomotiveSystemsR2
cave 3 NSF Center for Advanced Vehicle and Extreme Environment Electronics Packaged Systems Research for Advanced Vehicle Electronics @CAVE3 Pradeep Lall MacFarlane Endowed ...
URL: https://www.src.org/calendar/e005907/pradeep-lall.pdf
Modified: 2016-06-08 - 10.4MB
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1 through 30 of 31 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 next >>