Questions?
[x] GRC Science Area
IPS – Interconnect & Packaging Sciences

Content Type
Events 20
Patent Filings 5
Other 1

SRC Program
SRC 16
GRC 10
3D EC 2
FCRP 2

Year
2016 2
2013 5
2012 4
2011 7
2010 2

Center
C2S2 10
FENA 10
GSRC 10
IFC 10
MSD 10
MuSyC 10
C-FAR 6
CNFD 6
FAME 6
INDEX 6
LEAST 6
SONIC 6
SWAN 6
TerraSwarm 6
EBSM 5
TxACE 5
CEMPI 4
NPT 4
CAIST 2
ACE4S 1
CDADIC 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
BEP – Back End Processes 5
PKG – Packaging 4
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AMS-CSD – Analog/Mixed-Signal Ci... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

1 through 26 of 26 similar documents, best matches first.   
1: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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2: TECHCON 2011 (Event E004113) - SRC
TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
URL: https://www.src.org/calendar/e004113/
Modified: 2012-03-13 - 97KB
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3: TECHCON 2012 (Event E004114) - SRC
TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB
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4: TECHCON 2013 (Event E004683) - SRC
TECHCON 2013 Date: Monday, Sept. 9, 2013, 8 a.m. - Tuesday, Sept. 10, 2013, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004683 E004683 image ...
URL: https://www.src.org/calendar/e004683/
Modified: 2014-03-10 - 136KB
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5: pdfOverview of Research
Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB
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6: Semiconductor Research Corporation - SRC
GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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7: Putting Watson to Work (TECHCON 2013) - SRC
Putting Watson to Work TECHCON 2013 Special Session Richard Talbot, Director, PLM of the IBM Poser Systems View presentation as PDF Presented: Monday, September 9 at TECHCON 2013 ...
URL: https://www.src.org/calendar/e004683/watson/
Modified: 2013-09-09 - 21KB
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8: 3D IC University Research e-Workshop (Event E004357) - SRC
3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB
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9: pdfSlide 1
Renaissance Hotel Austin, TX September 12-13, 2011 . student presentations . broad research spectrum . networking global research collaboration, focus center research program and ...
URL: https://www.src.org/calendar/e004113/flyer.pdf
Modified: 2010-12-15 - 169KB
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10: Growth of Inorganic Thin Films using Self-Assembled Monolayers...
Growth of Inorganic Thin Films using Self-Assembled Monolayers as Nucleation Sites Application Type: Utility Patent Number: 7829150 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1139/
Modified: 2010-11-09 - 22KB
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11: Wafer Fabrication Monitoring/Control System and Method (Patent...
Wafer Fabrication Monitoring/Control System and Method Application Type: Utility Patent Number: 9366601 Country: United States Status: Filed on 15-Mar-2012, Issued on 14-Jun-2016 ...
URL: https://www.src.org/library/patent/p1332/
Modified: 2016-06-14 - 23KB
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12: URO Judging Criteria - TECHCON 2011 Author's Kit - SRC
TECHCON 2011 Author's Kit URO Judging Criteria Research knowledge (10 points max.) Demonstrated knowledge/understanding of the information presented Demonstrated knowledge/...
URL: https://www.src.org/calendar/e004113/uro-judging-criteria/
Modified: 2010-06-21 - 20KB
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13: Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition...
Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition Copper Application Type: Utility Patent Number: 7808106 Country: United States Status: Filed on 9-May-2008, ...
URL: https://www.src.org/library/patent/p1076/
Modified: 2010-10-05 - 22KB
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14: Synthesis and Characterization of First Row Transition Metal...
Synthesis and Characterization of First Row Transition Metal Complexes Containing a-Imino Alkoxide as Precursors for Deposition of Metal Films Application Type: Utility Patent ...
URL: https://www.src.org/library/patent/p1373/
Modified: 2017-09-12 - 22KB
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15: pdfDescription
Call for Abstracts Call for abstracts opens Monday, January 16, 2012. Deadline for submission is 3:00 p.m. eastern time on Wednesday, February 22, 2012. Description TECHCON is ...
URL: https://www.src.org/calendar/e004114/call-for-abstracts.pdf
Modified: 2012-01-26 - 27KB
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16: Synthesis and Characterization of First Row Transition Metal...
Synthesis and Characterization of First Row Transition Metal Complexes Containing Alpha-Keto Hydrazonate Ligands as Potential Precursors for Use in Metal Film Deposition ...
URL: https://www.src.org/library/patent/p1356/
Modified: 2015-12-09 - 22KB
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17: TECHCON 2013 Authors Kit: Submitting the Oral Presentation -...
TECHCON 2012 TECHCON 2013 Author's Kit: Submitting the Oral Presentation The deadline for presentation materials is August 21, 2013 Please follow these instructions carefully; our ...
URL: https://www.src.org/...ndar/e004683/submitting-presentation/
Modified: 2013-04-24 - 22KB
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18: TECHCON 2012 - Author's Kit: Poster-Instructions - SRC
TECHCON 2012 - Poster/Demonstration Instructions All paper presenters are expected to present a poster. Failure to present a poster will adversely affect the judging of your ...
URL: https://www.src.org/...4114/authors-kit/poster-instructions/
Modified: 2012-05-10 - 24KB
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19: Poster Instructions - TECHCON 2011 Author's Kit - SRC
TECHCON 2011 Poster/Demonstration Instructions All paper presenters are expected to present a poster. Failure to present a poster will adversely affect the judging of your ...
URL: https://www.src.org/calendar/e004113/poster-instructions/
Modified: 2011-04-15 - 24KB
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20: TECHCON 2012 - Author's Kit: Submitting Oral Presentation - SRC
TECHCON 2012: Instructions for Submitting Oral Presentation Materials Presentation Materials: DEADLINE IS August 22, 2012 Please follow these instructions carefully; our time and ...
URL: https://www.src.org/...4114/authors-kit/submit-presentation/
Modified: 2012-05-10 - 22KB
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21: Submitting Presentation - TECHCON 2011 AUthor's Kit - SRC
TECHCON 2011 Author's Kit Instructions for Submitting Oral Presentation Materials Presentation Materials: DEADLINE IS August 24, 2011 Please follow these instructions carefully; ...
URL: https://www.src.org/calendar/e004113/submit-presentation/
Modified: 2011-04-15 - 22KB
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22: TECHCON 2013 Authors Kit: Poster Instructions - SRC
TECHCON 2012 TECHCON 2013 Author's Kit: Poster Instructions All paper presenters are expected to present a poster. Failure to present a poster will adversely affect the judging of ...
URL: https://www.src.org/calendar/e004683/poster-instructions/
Modified: 2013-04-24 - 24KB
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23: URO Poster Instructions - TECHCON 2011 Author's Kit - SRC
TECHCON 2011 URO Poster Instructions Posters and demonstrations will be set up in TechFair, which is located in the Rio Grande Exhibit Hall on the lower level. Set-up is from 4:00 ...
URL: https://www.src.org/...ndar/e004113/uro-poster-instructions/
Modified: 2011-04-15 - 21KB
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24: 2013 GRC SACC and TAB Chair Recognition - SRC
2013 GRC SACC and TAB Chair Recognition TAB and SACC Chairs at TECHCON 2013 Technical Advisory Boards (TABs) and Science Area Coordinating Committees (SACCs) work together with the ...
URL: https://www.src.org/calendar/e004683/tab-chair/
Modified: 2011-09-16 - 21KB
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25: pdfMicrosoft PowerPoint - Watson SRC TECHCON 090913 FINAL PUBLISH...
© 2013 International Business Machines Corporation SRC TECHCON 2013 Putting Watson to Work September 9, 2013 Richard Talbot Director, PLM IBM Power Systems - Austin, Texas ...
URL: https://www.src.org/...004683/watson/talbot-techcon-2013.pdf
Modified: 2013-09-19 - 3.0MB
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26: pdfPresentation Title
PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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1 through 26 of 26 similar documents, best matches first.