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GRC Science Area
IPS – Interconnect & Packaging Sciences
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1 through 19 of
19 similar documents, best matches first. |
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- 1:
TECHCON 2013 (Event E004683) - SRC
- TECHCON 2013 Date: Monday, Sept. 9, 2013, 8 a.m. - Tuesday, Sept. 10, 2013, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004683 E004683 image ...
URL: https://www.src.org/calendar/e004683/
Modified: 2014-03-10 - 136KB Find Similar Documents
- 2:
TECHCON 2011 (Event E004113) - SRC
- TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
URL: https://www.src.org/calendar/e004113/
Modified: 2012-03-13 - 97KB Find Similar Documents
- 3:
TECHCON 2012 (Event E004114) - SRC
- TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB Find Similar Documents
- 4:
3D IC University Research e-Workshop (Event E004357) - SRC
- 3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB Find Similar Documents
- 5:
Emerging Interconnect Solutions Workshop - Part 1 (Event E004837...
- Emerging Interconnect Solutions Workshop - Part 1 Date: Monday, June 11, 2012, 2 p.m.-3:30 p.m. ET Location: via web conference, Research Triangle Park, NC, United States Event ID: ...
URL: https://www.src.org/calendar/e004837/
Modified: 2012-12-11 - 28KB Find Similar Documents
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Overview of Research
- Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB Find Similar Documents
- 7:
Semiconductor Research Corporation
- TECHCON 2012 Judging Criteria Criteria Technical Content (0 - 35 points) Perceived Value (0 - 15 points) Technology/Information Transfer (0 - 20 points) Presentation (Paper and ...
URL: https://www.src.org/calendar/e004114/judging-criteria.pdf
Modified: 2012-05-10 - 13KB Find Similar Documents
- 8:
Semiconductor Research Corporation - SRC
- GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB Find Similar Documents
- 9:
Microsoft PowerPoint - Watson SRC TECHCON 090913 FINAL PUBLISH...
- © 2013 International Business Machines Corporation SRC TECHCON 2013 Putting Watson to Work September 9, 2013 Richard Talbot Director, PLM IBM Power Systems - Austin, Texas ...
URL: https://www.src.org/...004683/watson/talbot-techcon-2013.pdf
Modified: 2013-09-19 - 3.0MB Find Similar Documents
- 10:
Posters: Undergraduate Research Opportunities (URO) - SRC
- TECHCON 2011 TECHCON 2011 Posters - Undergraduate Research Opportunities Room: RioGrande A Back to Session Listing URO Posters Poster Number Presentation Time Title Presenter & ...
URL: https://www.src.org/calendar/e004113/uro-posters/
Modified: 2011-06-30 - 27KB Find Similar Documents
- 11:
3DASSM
- Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB Find Similar Documents
- 12:
Multiple Copper Vias for Intergrated Circuit Metallization (Patent...
- Multiple Copper Vias for Intergrated Circuit Metallization Application Type: Continuation Patent Number: 7078817 Country: United States Status: Filed on 13-Dec-2004, Issued on ...
URL: https://www.src.org/library/patent/p0521/
Modified: 2006-07-18 - 22KB Find Similar Documents
- 13:
Slide 1
- Renaissance Hotel Austin, TX September 12-13, 2011 . student presentations . broad research spectrum . networking global research collaboration, focus center research program and ...
URL: https://www.src.org/calendar/e004113/flyer.pdf
Modified: 2010-12-15 - 169KB Find Similar Documents
- 14:
Multiple Copper Vias for Integrated Circuit Metallization and...
- Multiple Copper Vias for Integrated Circuit Metallization and Methods of Fabricating Same Application Type: Utility Patent Number: 6919639 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0268/
Modified: 2005-07-19 - 22KB Find Similar Documents
- 15:
Method of Forming Boron Carbo-Nitride Layers for Integrated Circuit...
- Method of Forming Boron Carbo-Nitride Layers for Integrated Circuit Devices Application Type: Utility Patent Number: 7144803 Country: United States Status: Filed on 16-Apr-2004, ...
URL: https://www.src.org/library/patent/p0451/
Modified: 2006-12-05 - 22KB Find Similar Documents
- 16:
Putting Watson to Work (TECHCON 2013) - SRC
- Putting Watson to Work TECHCON 2013 Special Session Richard Talbot, Director, PLM of the IBM Poser Systems View presentation as PDF Presented: Monday, September 9 at TECHCON 2013 ...
URL: https://www.src.org/calendar/e004683/watson/
Modified: 2013-09-09 - 21KB Find Similar Documents
- 17:
2013 GRC SACC and TAB Chair Recognition - SRC
- 2013 GRC SACC and TAB Chair Recognition TAB and SACC Chairs at TECHCON 2013 Technical Advisory Boards (TABs) and Science Area Coordinating Committees (SACCs) work together with the ...
URL: https://www.src.org/calendar/e004683/tab-chair/
Modified: 2011-09-16 - 21KB Find Similar Documents
- 18:
Composite Thermal Interface Material Including Aligned Nanofibers...
- Composite Thermal Interface Material Including Aligned Nanofibers with Low Melting Temperature Binder Application Type: Utility Patent Number: 8389119 Country: United States ...
URL: https://www.src.org/library/patent/p1023/
Modified: 2013-03-05 - 25KB Find Similar Documents
- 19:
Judging Criteria - TECHCON 2011 Author's Kit - SRC
- TECHCON 2011 Author's Kit Judging Criteria Criteria Technical Content 0 - 35 points Perceived Value 0 - 15 points Technology / Information Transfer 0 - 20 points Presentation ...
URL: https://www.src.org/calendar/e004113/judging-criteria/
Modified: 2010-06-21 - 22KB Find Similar Documents
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