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1 through 26 of
26 similar documents, best matches first. |
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- 1:
Past
- PAST FCRP workshop - M Mayberry, May 2012 Source: SRC website, Feb 2011 FCRP workshop - M Mayberry, May 2012 system software systems systems structures structures materials ...
URL: https://www.src.org/calendar/e004827/mayberry.pdf
Modified: 2012-05-16 - 3.4MB Find Similar Documents
- 2:
Proposers' Conference for the Focus Center Research Program ...
- Proposers' Conference for the Focus Center Research Program Date: Monday, May 14, 2012, 11:30 a.m.-4 p.m. CT Location: Hyatt Regency DFW, Enterprise 7 & 8, Dallas, TX, United ...
URL: https://www.src.org/calendar/e004827/
Modified: 2012-11-14 - 49KB Find Similar Documents
- 3:
About Circuit Design - SRC
- About Circuit Design Research at C2S2 FCRP Legacy Content FCRP Phase V ended on 31-Jan-2013, and this content may no longer be current. Longer term microelectronics research is now ...
URL: https://www.src.org/program/fcrp/c2s2/about/
Modified: 2010-06-21 - 25KB Find Similar Documents
- 4:
Carbon Electronics Workshop (Event E003973) - SRC
- Carbon Electronics Workshop Date: Tuesday, Sept. 21, 2010, 9 a.m. - Wednesday, Sept. 22, 2010, 1 p.m. ET Location: NanoFab 300, South Auditorium, CSNE, University of Albany-SUNY, ...
URL: https://www.src.org/calendar/e003973/
Modified: 2011-03-22 - 83KB Find Similar Documents
- 5:
Presentation Title
- PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB Find Similar Documents
- 6:
In-situ Studies of III-V Surfaces and High-k Atomic Layer Deposition...
- In-situ Studies of III-V Surfaces and High-k Atomic Layer Deposition Date: Tuesday, Oct. 23, 2012, 4 p.m.-5:30 p.m. ET Location: via web conference, Research Triangle Park, NC, ...
URL: https://www.src.org/calendar/e004519/
Modified: 2013-04-23 - 32KB Find Similar Documents
- 7:
Semiconductor Research Corporation - SRC
- FCRP FCRP Focus Center Research Program (Legacy) Multi-Scale Systems Research Center Creation of a comprehensive and a systematic solution to the distributed multi-scale system ...
URL: https://www.src.org/program/fcrp/
Modified: 2023-10-10 - 32KB Find Similar Documents
- 8:
FCRP Proposers' Conference
- FCRP Proposers' Conference Welcome!! Thank you for your interest! Objectives of this event: Learning and Teaming! Hearing perspectives from DARPA and Industry regarding ...
URL: https://www.src.org/calendar/e004827/weitzman.pdf
Modified: 2012-05-16 - 58KB Find Similar Documents
- 9:
3D IC University Research e-Workshop (Event E004357) - SRC
- 3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB Find Similar Documents
- 10:
FAQs About the Focus Center Research Program - SRC
- FAQs About the Focus Center Research Program (FCRP) FCRP Legacy Content FCRP Phase V ended on 31-Jan-2013, and this content may no longer be current. Longer term microelectronics ...
URL: https://www.src.org/program/fcrp/about/faq/
Modified: 2010-06-26 - 29KB Find Similar Documents
- 11:
About Interconnect - SRC
- About Interconnect Research at IFC FCRP Legacy Content FCRP Phase V ended on 31-Jan-2013, and this content may no longer be current. Longer term microelectronics research is now ...
URL: https://www.src.org/program/fcrp/ifc/about/
Modified: 2010-06-21 - 23KB Find Similar Documents
- 12:
About Nano Materials - SRC
- About Nano Materials Research at FENA FCRP Legacy Content FCRP Phase V ended on 31-Jan-2013, and this content may no longer be current. Longer term microelectronics research is now ...
URL: https://www.src.org/program/fcrp/fena/about/
Modified: 2010-06-21 - 22KB Find Similar Documents
- 13:
About Materials and Devices - SRC
- About Materials and Devices Research at MSD FCRP Legacy Content FCRP Phase V ended on 31-Jan-2013, and this content may no longer be current. Longer term microelectronics research ...
URL: https://www.src.org/program/fcrp/msd/about/
Modified: 2010-06-21 - 22KB Find Similar Documents
- 14:
FCRP - About - SRC
- About Focus Center Research Program FCRP Legacy Content FCRP Phase V ended on 31-Jan-2013, and this content may no longer be current. Longer term microelectronics research is now ...
URL: https://www.src.org/program/fcrp/about/
Modified: 2010-06-27 - 22KB Find Similar Documents
- 15:
Multi-Tapped Inductively-Coupled Charging System (Patent P1417...
- Multi-Tapped Inductively-Coupled Charging System Application Type: Utility Patent Number: 9293942 Country: United States Status: Filed on 9-May-2013, Issued on 22-Mar-2016, Patent ...
URL: https://www.src.org/library/patent/p1417/
Modified: 2016-03-22 - 23KB Find Similar Documents
- 16:
INTER-CORE Cooperative TLB Prefetchers (Patent P1497) - SRC
- INTER-CORE Cooperative TLB Prefetchers Application Type: Continuation Patent Number: 9524232 Country: United States Status: Filed on 3-Oct-2014, Issued on 20-Dec-2016, Patent ...
URL: https://www.src.org/library/patent/p1497/
Modified: 2016-12-20 - 24KB Find Similar Documents
- 17:
Inter-Core Cooperative TLB Prefetchers (Patent P1195) - SRC
- Inter-Core Cooperative TLB Prefetchers Application Type: Utility Patent Number: 8880844 Country: United States Status: Filed on 12-Mar-2010, Issued on 4-Nov-2014, Patent Abandoned ...
URL: https://www.src.org/library/patent/p1195/
Modified: 2014-11-04 - 23KB Find Similar Documents
- 18:
Vortex Tube Refrigeration Systems and Methods (Patent P0520)...
- Vortex Tube Refrigeration Systems and Methods Application Type: Utility Patent Number: 7669428 Country: United States Status: Filed on 14-Apr-2005, Issued on 2-Mar-2010, Patent ...
URL: https://www.src.org/library/patent/p0520/
Modified: 2010-03-02 - 22KB Find Similar Documents
- 19:
3-D ICs Equipped with Double Sided Power, Coolant, and Date Features...
- 3-D ICs Equipped with Double Sided Power, Coolant, and Date Features Application Type: Continuation (in part) Patent Number: 8546930 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1143/
Modified: 2013-10-01 - 23KB Find Similar Documents
- 20:
3-D ICs Equipped with Double Sided Power, Coolant, and Data Features...
- 3-D ICs Equipped with Double Sided Power, Coolant, and Data Features Application Type: Continuation (in part) Patent Number: 8546930 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1419/
Modified: 2014-10-01 - 23KB Find Similar Documents
- 21:
Graphene Device Including a PVA Layer or Formed Using a PVA Layer...
- Graphene Device Including a PVA Layer or Formed Using a PVA Layer Application Type: Continuation Patent Number: 8735209 Country: United States Status: Filed on 15-Mar-2013, Issued ...
URL: https://www.src.org/library/patent/p1404/
Modified: 2014-05-27 - 24KB Find Similar Documents
- 22:
FCRP Program Mission and Description - SRC
- FCRP Program Mission FCRP Legacy Content FCRP Phase V ended on 31-Jan-2013, and this content may no longer be current. Longer term microelectronics research is now being sponsored ...
URL: https://www.src.org/program/fcrp/about/mission/
Modified: 2010-06-21 - 22KB Find Similar Documents
- 23:
Thermal Management Devices, Systems, and Methods (Patent P1044...
- Thermal Management Devices, Systems, and Methods Application Type: Utility Patent Number: 7532467 Country: United States Status: Filed on 4-Oct-2007, Issued on 12-May-2009, Patent ...
URL: https://www.src.org/library/patent/p1044/
Modified: 2009-05-12 - 22KB Find Similar Documents
- 24:
High-Performance Gate Oxides such as for Graphene Field-Effect...
- High-Performance Gate Oxides such as for Graphene Field-Effect Transistors or Carbon Nanotubes Application Type: Utility Patent Number: 8445893 Country: United States Status: Filed ...
URL: https://www.src.org/library/patent/p1209/
Modified: 2013-05-21 - 24KB Find Similar Documents
- 25:
Backplane, Printed Wiring Board and\or Multi-Chip Module-Level...
- Backplane, Printed Wiring Board and\or Multi-Chip Module-Level Optical Interconnect Layer Having Embedded Air-Gap Technologies and Methods of Fabrication Application Type: ...
URL: https://www.src.org/library/patent/p0442/
Modified: 2004-09-07 - 21KB Find Similar Documents
- 26:
3D IMAPS
- Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB Find Similar Documents
1 through 26 of
26 similar documents, best matches first. |
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