Questions?
[x] GRC Science Area
IPS – Interconnect & Packaging Sciences

Content Type
Events 24
Patent Filings 17
Other 1

SRC Program
GRC 26
SRC 16
3D EC 4
FCRP 4

Year
2016 3
2013 4
2012 6
2011 9
2010 2

Center
C2S2 11
FENA 11
GSRC 11
IFC 11
MSD 11
MuSyC 11
EBSM 6
TxACE 6
C-FAR 5
CNFD 5
FAME 5
INDEX 5
LEAST 5
NPT 5
SONIC 5
SWAN 5
TerraSwarm 5
CEMPI 4
CAIST 2
ACE4S 1
CDADIC 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
BEP – Back End Processes 10
PKG – Packaging 10
Processes – Processes 2
Reliability 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AMS-CSD – Analog/Mixed-Signal Ci... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Quality & Reliability 1
Rapid Yield Learning 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

1 through 30 of 42 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 next >>
1: TECHCON 2011 (Event E004113) - SRC
TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
URL: https://www.src.org/calendar/e004113/
Modified: 2012-03-13 - 97KB
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2: TECHCON 2012 (Event E004114) - SRC
TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB
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3: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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4: Semiconductor Research Corporation - SRC
GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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5: pdfOverview of Research
Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB
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6: 3D IC University Research e-Workshop (Event E004357) - SRC
3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB
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7: TECHCON 2013 (Event E004683) - SRC
TECHCON 2013 Date: Monday, Sept. 9, 2013, 8 a.m. - Tuesday, Sept. 10, 2013, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004683 E004683 image ...
URL: https://www.src.org/calendar/e004683/
Modified: 2014-03-10 - 136KB
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8: pdfDescription
Call for Abstracts Call for abstracts opens Monday, January 16, 2012. Deadline for submission is 3:00 p.m. eastern time on Wednesday, February 22, 2012. Description TECHCON is ...
URL: https://www.src.org/calendar/e004114/call-for-abstracts.pdf
Modified: 2012-01-26 - 27KB
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9: pdfSlide 1
Renaissance Hotel Austin, TX September 12-13, 2011 . student presentations . broad research spectrum . networking global research collaboration, focus center research program and ...
URL: https://www.src.org/calendar/e004113/flyer.pdf
Modified: 2010-12-15 - 169KB
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10: Polyelectrolyte Nanolayers as Diffusion Barriers In Semiconductor...
Polyelectrolyte Nanolayers as Diffusion Barriers In Semiconductor Devices Application Type: Utility Patent Number: 7081674 Country: United States Status: Filed on 11-Jun-2004, ...
URL: https://www.src.org/library/patent/p0466/
Modified: 2006-07-25 - 22KB
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11: Emerging Interconnect Solutions Workshop - Part 1 (Event E004837...
Emerging Interconnect Solutions Workshop - Part 1 Date: Monday, June 11, 2012, 2 p.m.-3:30 p.m. ET Location: via web conference, Research Triangle Park, NC, United States Event ID: ...
URL: https://www.src.org/calendar/e004837/
Modified: 2012-12-11 - 28KB
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12: Surface Modifcation of CVD Polymer Films (Patent P0591) - SRC
Surface Modifcation of CVD Polymer Films Application Type: Utility Patent Number: 7501154 Country: United States Status: Filed on 18-Feb-2005, Issued on 10-Mar-2009 Organization: ...
URL: https://www.src.org/library/patent/p0591/
Modified: 2009-03-10 - 22KB
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13: Growth of Inorganic Thin Films using Self-Assembled Monolayers...
Growth of Inorganic Thin Films using Self-Assembled Monolayers as Nucleation Sites Application Type: Utility Patent Number: 7829150 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1139/
Modified: 2010-11-09 - 22KB
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14: Self-Assembled Sub-Nanolayers as Interfacial Adhesion Enhancers...
Self-Assembled Sub-Nanolayers as Interfacial Adhesion Enhancers and Diffusion Barriers Application Type: Utility Patent Number: 7026716 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0415/
Modified: 2006-04-11 - 22KB
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15: Judging Criteria - TECHCON 2011 Author's Kit - SRC
TECHCON 2011 Author's Kit Judging Criteria Criteria Technical Content 0 - 35 points Perceived Value 0 - 15 points Technology / Information Transfer 0 - 20 points Presentation ...
URL: https://www.src.org/calendar/e004113/judging-criteria/
Modified: 2010-06-21 - 22KB
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16: Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition...
Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition Copper Application Type: Utility Patent Number: 7808106 Country: United States Status: Filed on 9-May-2008, ...
URL: https://www.src.org/library/patent/p1076/
Modified: 2010-10-05 - 22KB
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17: pdfSemiconductor Research Corporation
TECHCON 2012 Judging Criteria Criteria Technical Content (0 - 35 points) Perceived Value (0 - 15 points) Technology/Information Transfer (0 - 20 points) Presentation (Paper and ...
URL: https://www.src.org/calendar/e004114/judging-criteria.pdf
Modified: 2012-05-10 - 13KB
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18: 2013 GRC SACC and TAB Chair Recognition - SRC
2013 GRC SACC and TAB Chair Recognition TAB and SACC Chairs at TECHCON 2013 Technical Advisory Boards (TABs) and Science Area Coordinating Committees (SACCs) work together with the ...
URL: https://www.src.org/calendar/e004683/tab-chair/
Modified: 2011-09-16 - 21KB
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19: pdfMicrosoft PowerPoint - Watson SRC TECHCON 090913 FINAL PUBLISH...
© 2013 International Business Machines Corporation SRC TECHCON 2013 Putting Watson to Work September 9, 2013 Richard Talbot Director, PLM IBM Power Systems - Austin, Texas ...
URL: https://www.src.org/...004683/watson/talbot-techcon-2013.pdf
Modified: 2013-09-19 - 3.0MB
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20: pdfPresentation Title
PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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21: Mixed-signal Substrate with Integrated Through-Substrate Vias...
Mixed-signal Substrate with Integrated Through-Substrate Vias Application Type: Utility Patent Number: 10330874 Country: United States Status: Filed on 2-Feb-2017, Issued on ...
URL: https://www.src.org/library/patent/p1675/
Modified: 2019-06-25 - 23KB
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22: 2011 GRC SACC and TAB Chair Recognition - SRC
2011 GRC SACC and TAB Chair Recognition Technical Advisory Boards (TABs) and Science Area Coordinating Committees (SACCs) work together with the SRC technical staff to guide the ...
URL: https://www.src.org/calendar/e004113/tab-chair/
Modified: 2011-09-16 - 20KB
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23: pdfTECHCON 2010
Renaissance Hotel Austin, TX September 10 & 11 more information at www.src.org Showcasing: . The quality of the research portfolio . The excellence of SRC students and faculty . ...
URL: https://www.src.org/calendar/e004114/advert-slide.pdf
Modified: 2012-05-21 - 153KB
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24: Wafer Fabrication Monitoring/Control System and Method (Patent...
Wafer Fabrication Monitoring/Control System and Method Application Type: Utility Patent Number: 9366601 Country: United States Status: Filed on 15-Mar-2012, Issued on 14-Jun-2016 ...
URL: https://www.src.org/library/patent/p1332/
Modified: 2016-06-14 - 23KB
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25: Multilevel Reservoirs for Integrated Circuit Interconnects (Patent...
Multilevel Reservoirs for Integrated Circuit Interconnects Application Type: Utility Patent Number: 8278758 Country: United States Status: Filed on 29-Apr-2009, Issued on ...
URL: https://www.src.org/library/patent/p1141/
Modified: 2012-10-02 - 22KB
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26: Synthesis and Characterization of First Row Transition Metal...
Synthesis and Characterization of First Row Transition Metal Complexes Containing a-Imino Alkoxide as Precursors for Deposition of Metal Films Application Type: Utility Patent ...
URL: https://www.src.org/library/patent/p1373/
Modified: 2017-09-12 - 22KB
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27: Low Temperature Metal Etching and Patterning (Patent P1290) ...
Low Temperature Metal Etching and Patterning Application Type: Utility Patent Number: 8679359 Country: United States Status: Filed on 10-May-2011, Issued on 25-Mar-2014 ...
URL: https://www.src.org/library/patent/p1290/
Modified: 2014-03-25 - 23KB
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28: Synthesis and Characterization of First Row Transition Metal...
Synthesis and Characterization of First Row Transition Metal Complexes Containing Alpha-Keto Hydrazonate Ligands as Potential Precursors for Use in Metal Film Deposition ...
URL: https://www.src.org/library/patent/p1356/
Modified: 2015-12-09 - 22KB
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29: pdfSlide 1
3D University Research Summit May 5 th , 2011 Restricted Distribution: Contains SRC Confidential Material Restricted Distribution: Contains SRC Confidential Material Summit Goals . ...
URL: https://www.src.org/calendar/e004357/0-intro.pdf
Modified: 2011-05-04 - 285KB
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30: Electromagnetic Bandgap Structure for Isolation in Mixed-Signal...
Electromagnetic Bandgap Structure for Isolation in Mixed-Signal Systems Application Type: Utility Patent Number: 7215301 Country: United States Status: Filed on 8-Sep-2004, Issued ...
URL: https://www.src.org/library/patent/p0470/
Modified: 2007-05-08 - 22KB
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1 through 30 of 42 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 next >>