Questions?
[x] GRC Science Area
IPS – Interconnect & Packaging Sciences

Content Type
Events 16
Other 1

SRC Program
SRC 10
GRC 7
3D EC 3
FCRP 3

Year
2016 3
2013 4
2012 2
2011 7

Center
C-FAR 5
C2S2 5
CNFD 5
FAME 5
FENA 5
GSRC 5
IFC 5
INDEX 5
LEAST 5
MSD 5
MuSyC 5
SONIC 5
SWAN 5
TerraSwarm 5
EBSM 3
TxACE 3
NPT 2
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
PKG – Packaging 4
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AMS-CSD – Analog/Mixed-Signal Ci... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

1 through 17 of 17 similar documents, best matches first.   
1: 3D IC University Research e-Workshop (Event E004357) - SRC
3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB
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2: pdfMicrosoft PowerPoint - Lall_PackagedAutomotiveSystemsR2
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URL: https://www.src.org/calendar/e005907/pradeep-lall.pdf
Modified: 2016-06-08 - 10.4MB
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3: pdfOverview of Research
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Modified: 2016-06-08 - 8.0MB
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4: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
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5: Semiconductor Research Corporation - SRC
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Modified: 2023-10-10 - 33KB
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6: TECHCON 2013 Authors Kit: Preparing the Oral Presentation - SRC
TECHCON 2012 TECHCON 2013 Author's Kit: Preparing the Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals ...
URL: https://www.src.org/calendar/e004683/preparing-presentation/
Modified: 2013-04-24 - 24KB
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7: TECHCON 2012 - Author's Kit: Preparing Oral Presentation - SRC
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TECHCON 2011 Author's Kit Preparing The Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals that are readable ...
URL: https://www.src.org/calendar/e004113/preparing-presentation/
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10: TECHCON 2011 (Event E004113) - SRC
TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
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Modified: 2012-03-13 - 97KB
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11: pdfPresentation Title
PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
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RTI International High Performance Processing Systems Enabled by 3D Integration Bob Conn May 5, 2011 1 Bob Conn, RTI International, rconn@rti.org, bobconn@ieee.org RTI ...
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17: TECHCON 2013 Authors Kit: Poster Instructions - SRC
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1 through 17 of 17 similar documents, best matches first.