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SRC Program

SRC	618
GRC	374
FCRP	134
NRI	52
JUMP2	14
JUMP	11
STARnet	7
SRP	6
3D EC	5
Auto	3
SRCEA	3
nCORE	3
ICA	2
ERI	1
Undergrad	1

Year

2023	50
2022	62
2021	55
2020	30
2019	29
2018	57
2017	59
2016	49
2015	52
2014	42
2013	45
2012	57
2011	264
2010	229
2009	1
2008	1

Thrust/Theme

ESH – Environment Safety and Hea...	13
PKG – Packaging	9
NMP – Nanomanufacturing Material...	7
CD – Circuit Design	6
HWS – Hardware Security	6
LMD – Logic and Memory Devices	6
AMS-CSD – Analog/Mixed-Signal Ci...	5
PAT – Patterning	5
TT – Test & Testability	5
CADT – Computer-Aided Design and...	4
ISD – Integrated System Design	4
LPD – Logic & Physical Design	4
CBRIC-T1 – Neuro-inspired Algori...	3
NEM – Nanoengineered Materials	3
SLD – System Level Design	3
VER – Verification	3
ASCENT-T3 – Heterogeneous Integr...	2
DV – Design Verification	2
DesTech – Design Techniques	2
EP3C – Efficiency and Performanc...	2
FACSYS – Factory Systems	2
I3T – Innovative and Intelligent...	2
Modeling & Simulation	2
Physical Design	2
SCARF – Supply Chain AI Realized...	2
TechCAD – Technology CAD	2
ACE-T1 – Heterogeneous Computing...	1
ACE-T2 – Distributed Evolvable M...	1
ACE-T3 – Fine-grained Communicat...	1
ACE-T4 – Security Privacy and Co...	1
ACE-T5 – Demonstrators	1
ADS – Alternative Device Structu...	1
AIHW – Artificial Intelligence H...	1
AMS – Analog and Mixed-Signal De...	1
ASCENT-T2 – Beyond CMOS	1
ASCENT-T4 – Merged Logic Memory ...	1
AdvTech – Advanced Technology	1
Advanced Bipolar SOI-MOS Transis...	1
Advanced Devices	1
Advanced Devices & Technologies	1
Advanced Technology Option	1
Analysis Design & Simulation	1
BEP – Back End Processes	1
Back End Processes	1
C&S – Controls and Sensing	1
CFM&TCM – CFM & Total Chemical M...	1
CHIMES-T1 – System Driven Functi...	1
CHIMES-T2 – Monolithic 3D (M3D) ...	1
CHIMES-T3 – Ultra Dense Heteroge...	1
CHIMES-T4 – Materials Behavior S...	1
CM – Compact Modeling	1
COCOSYS-T1 – Neural Symbolic and...	1
COCOSYS-T2 – Hardware-Algorithm ...	1
COCOSYS-T3 – Technology-driven H...	1
COCOSYS-T4 – Collaborative Intel...	1
COGNISENSE-1 – Multi-spectral Ar...	1
COGNISENSE-2 – Analog-to-Insight	1
COGNISENSE-3 – Closed-Loop Atten...	1
COGNISENSE-4 – Heterogeneous Sys...	1
COGNISENSE-5 – System Software a...	1
CRISP-T1 – Hardware Support for ...	1
CSR – Cross-Disciplinary Semicon...	1
CUBIC-T1 – Connectivity Networks...	1
CUBIC-T2 – Wireline and Lightwav...	1
CUBIC-T3 – Wireless Circuits and...	1
ComSenTer-T1 – Systems and Algor...	1
Contamination Control	1
Cost Reduction	1
DCMOS – Digital CMOS Technologie...	1
DE – Design Environment	1
DSMS – Device Sciences Modeling ...	1
Defect Reduction	1
Deposition	1
DesSyn – Design Synthesis	1
Doping Technologies	1
E2CDA2 – E2CDA 2.0	1
Equip Automation & Process Contr...	1
Equip – Equipment	1
Equip. Auto. and Process Control	1
FAM – Factory Automation & Manag...	1
FEOL – FEOL Processes	1
FacOps – Factory Operations	1
Factory Systems	1
Front End Processes	1
Heat Signal & Power Distribution	1
Heat Signal Power	1
IRP – India Research Program	1
Interconnect Architecture	1
Lithography	1
Logic Design	1
Logistics & Modeling/Simulation	1
MT – Memory Technologies	1
MTMP – Metrology Tools Matls & P...	1
Masks	1
Materials	1
Materials & Measurements	1
Metrology	1
Modeling & TCAD	1
Multi-level Interconnect	1
NCR – Non-Classical CMOS Researc...	1
PMM – Packaging Materials and Me...	1
PMS – Packaging Modeling and Sim...	1
PRISM-T1 – Systems and Software	1
PRISM-T2 – Architecture	1
PRISM-T3 – Devices and Circuits	1
PRISM-T4 – Grand Challenges	1
PS/E – Process Simplification/En...	1
Package & Electrical Design	1
Package Reliability	1
Packaging & Interconnect Systems	1