Questions?
[x] GRC Science Area
IPS – Interconnect & Packaging Sciences

Content Type
Events 14
Patent Filings 4
Other 1

SRC Program
SRC 10
GRC 9
3D EC 1
FCRP 1

Year
2016 2
2013 3
2012 3
2011 4
2010 2

Center
C2S2 6
FENA 6
GSRC 6
IFC 6
MSD 6
MuSyC 6
C-FAR 4
CNFD 4
FAME 4
INDEX 4
LEAST 4
SONIC 4
SWAN 4
TerraSwarm 4
EBSM 3
TxACE 3
NPT 2
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
PKG – Packaging 4
Back End Processes 3
BEP – Back End Processes 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AMS-CSD – Analog/Mixed-Signal Ci... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

1 through 19 of 19 similar documents, best matches first.   
1: TECHCON 2013 (Event E004683) - SRC
TECHCON 2013 Date: Monday, Sept. 9, 2013, 8 a.m. - Tuesday, Sept. 10, 2013, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004683 E004683 image ...
URL: https://www.src.org/calendar/e004683/
Modified: 2014-03-10 - 136KB
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2: TECHCON 2011 (Event E004113) - SRC
TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
URL: https://www.src.org/calendar/e004113/
Modified: 2012-03-13 - 97KB
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3: TECHCON 2012 (Event E004114) - SRC
TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB
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4: 3D IC University Research e-Workshop (Event E004357) - SRC
3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB
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5: Emerging Interconnect Solutions Workshop - Part 1 (Event E004837...
Emerging Interconnect Solutions Workshop - Part 1 Date: Monday, June 11, 2012, 2 p.m.-3:30 p.m. ET Location: via web conference, Research Triangle Park, NC, United States Event ID: ...
URL: https://www.src.org/calendar/e004837/
Modified: 2012-12-11 - 28KB
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6: pdfOverview of Research
Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB
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7: pdfSemiconductor Research Corporation
TECHCON 2012 Judging Criteria Criteria Technical Content (0 - 35 points) Perceived Value (0 - 15 points) Technology/Information Transfer (0 - 20 points) Presentation (Paper and ...
URL: https://www.src.org/calendar/e004114/judging-criteria.pdf
Modified: 2012-05-10 - 13KB
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8: Semiconductor Research Corporation - SRC
GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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9: pdfMicrosoft PowerPoint - Watson SRC TECHCON 090913 FINAL PUBLISH...
© 2013 International Business Machines Corporation SRC TECHCON 2013 Putting Watson to Work September 9, 2013 Richard Talbot Director, PLM IBM Power Systems - Austin, Texas ...
URL: https://www.src.org/...004683/watson/talbot-techcon-2013.pdf
Modified: 2013-09-19 - 3.0MB
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10: Posters: Undergraduate Research Opportunities (URO) - SRC
TECHCON 2011 TECHCON 2011 Posters - Undergraduate Research Opportunities Room: RioGrande A Back to Session Listing URO Posters Poster Number Presentation Time Title Presenter & ...
URL: https://www.src.org/calendar/e004113/uro-posters/
Modified: 2011-06-30 - 27KB
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11: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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12: Multiple Copper Vias for Intergrated Circuit Metallization (Patent...
Multiple Copper Vias for Intergrated Circuit Metallization Application Type: Continuation Patent Number: 7078817 Country: United States Status: Filed on 13-Dec-2004, Issued on ...
URL: https://www.src.org/library/patent/p0521/
Modified: 2006-07-18 - 22KB
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13: pdfSlide 1
Renaissance Hotel Austin, TX September 12-13, 2011 . student presentations . broad research spectrum . networking global research collaboration, focus center research program and ...
URL: https://www.src.org/calendar/e004113/flyer.pdf
Modified: 2010-12-15 - 169KB
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14: Multiple Copper Vias for Integrated Circuit Metallization and...
Multiple Copper Vias for Integrated Circuit Metallization and Methods of Fabricating Same Application Type: Utility Patent Number: 6919639 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0268/
Modified: 2005-07-19 - 22KB
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15: Method of Forming Boron Carbo-Nitride Layers for Integrated Circuit...
Method of Forming Boron Carbo-Nitride Layers for Integrated Circuit Devices Application Type: Utility Patent Number: 7144803 Country: United States Status: Filed on 16-Apr-2004, ...
URL: https://www.src.org/library/patent/p0451/
Modified: 2006-12-05 - 22KB
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16: Putting Watson to Work (TECHCON 2013) - SRC
Putting Watson to Work TECHCON 2013 Special Session Richard Talbot, Director, PLM of the IBM Poser Systems View presentation as PDF Presented: Monday, September 9 at TECHCON 2013 ...
URL: https://www.src.org/calendar/e004683/watson/
Modified: 2013-09-09 - 21KB
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17: 2013 GRC SACC and TAB Chair Recognition - SRC
2013 GRC SACC and TAB Chair Recognition TAB and SACC Chairs at TECHCON 2013 Technical Advisory Boards (TABs) and Science Area Coordinating Committees (SACCs) work together with the ...
URL: https://www.src.org/calendar/e004683/tab-chair/
Modified: 2011-09-16 - 21KB
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18: Composite Thermal Interface Material Including Aligned Nanofibers...
Composite Thermal Interface Material Including Aligned Nanofibers with Low Melting Temperature Binder Application Type: Utility Patent Number: 8389119 Country: United States ...
URL: https://www.src.org/library/patent/p1023/
Modified: 2013-03-05 - 25KB
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19: Judging Criteria - TECHCON 2011 Author's Kit - SRC
TECHCON 2011 Author's Kit Judging Criteria Criteria Technical Content 0 - 35 points Perceived Value 0 - 15 points Technology / Information Transfer 0 - 20 points Presentation ...
URL: https://www.src.org/calendar/e004113/judging-criteria/
Modified: 2010-06-21 - 22KB
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1 through 19 of 19 similar documents, best matches first.