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Thrust/Theme
PKG – Packaging
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| 1 through 26 of
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- 1:
Semiconductor Research Corporation - SRC
- GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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- 2:
 Overview of Research
- Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB
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- 3:
Virtual John Oakley, Science Director Tameka Bell & Mary Nichols...
- Packaging (PKG) e-Kickoff March 23 and 29-31, 2022 Virtual John Oakley, Science Director Tameka Bell & Mary Nichols, Research Program Coordinator SRC Select Disclosure Because the ...
URL: https://www.src.org/calendar/e007527/pkgintroslides.pdf
Modified: 2022-04-04 - 663KB
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- 4:
IRP Advisory Board Meeting
- Packaging Research Program e-Kickoff March 22-23, 2023, virtual John Oakley, Science Director LaDonya Dooley, Research Program Coordinator Day 1 : https://www.src.org/calendar/...
URL: https://www.src.org/.../1_2023-ekickoff-pkg-introduction.pdf
Modified: 2023-03-27 - 535KB
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- 5:
3DASSM
- Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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- 6:
Research Program Annual Review
- Packaging (PKG) Research Program Annual Review July 12-14, 2022 Dallas, TX @ Texas Instruments John Oakley, Science Director Tameka Bell, Research Program Coordinator SRC Select ...
URL: https://www.src.org/...oslides/2022reviewpkgintroduction.pdf
Modified: 2022-07-27 - 514KB
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- 7:
Methods and Apparatuses for Integrated Packaging of Microelectromechan...
- Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices Application Type: Utility Patent Number: 8557623 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1230/
Modified: 2013-10-15 - 26KB
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- 8:
Electromagnetic Bandgap Structure for Isolation in Mixed-Signal...
- Electromagnetic Bandgap Structure for Isolation in Mixed-Signal Systems Application Type: Utility Patent Number: 7215301 Country: United States Status: Filed on 8-Sep-2004, Issued ...
URL: https://www.src.org/library/patent/p0470/
Modified: 2007-05-08 - 22KB
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- 9:
Mixed-Signal Systems With Alternating Impedance Electromagnetic...
- Mixed-Signal Systems With Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structures For Noise Suppression/Isolation Application Type: Continuation (in part) Patent Number: ...
URL: https://www.src.org/library/patent/p0578/
Modified: 2007-08-07 - 22KB
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- 10:
Methods, Systems, and Computer Program Products for Asymmetric...
- Methods, Systems, and Computer Program Products for Asymmetric Multimode Interconnect Application Type: Utility Patent Number: 9008215 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1331/
Modified: 2015-04-14 - 22KB
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- 11:
Systems, Methods, and Computer Readable Media for Fractional...
- Systems, Methods, and Computer Readable Media for Fractional Pre-emphasis of Multi-Mode Interconnect Application Type: Utility Patent Number: 8208578 Country: United States Status: ...
URL: https://www.src.org/library/patent/p1191/
Modified: 2012-06-26 - 22KB
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- 12:
Methods, Systems, and Computer Program Products for Low Power...
- Methods, Systems, and Computer Program Products for Low Power Multimode Interconnect for Lossy and Tightly Coupled Multi-Channel Application Type: Utility Patent Number: 8903010 ...
URL: https://www.src.org/library/patent/p1328/
Modified: 2014-12-02 - 22KB
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- 13:
Presentation title here
- Low environmental impact packaging Presentation to SRC Packaging TAB - 7-14-22 Tim Yeakley 1 Agenda . Change example . Global thinking about products . Government supply chain ...
URL: https://www.src.org/...ow-environmental-impact-packaging.pdf
Modified: 2022-07-22 - 481KB
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- 14:
Microsoft PowerPoint - Lall_PackagedAutomotiveSystemsR2
- cave 3 NSF Center for Advanced Vehicle and Extreme Environment Electronics Packaged Systems Research for Advanced Vehicle Electronics @CAVE3 Pradeep Lall MacFarlane Endowed ...
URL: https://www.src.org/calendar/e005907/pradeep-lall.pdf
Modified: 2016-06-08 - 10.4MB
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- 15:
2021 Packaging CHIRP Center Review
- 2021 Packaging CHIRP Center Review August 24-26 - Virtual Event https://www.src.org/calendar/e007230/ Student Poster Information (Abstracts) Featuring: Sanoop Thekkut Ronit Das ...
URL: https://www.src.org/...ster/catalog/chirp_poster_catalog.pdf
Modified: 2021-08-23 - 597KB
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- 16:
Electrospray Printer (Patent P2030) - SRC
- Electrospray Printer Application Type: Utility Country: United States Status: Filed on 1-Nov-2022, Published by Patent Office Organization: Binghamton University - SUNY SRC Filing ...
URL: https://www.src.org/library/patent/p2030/
Modified: 2022-11-01 - 23KB
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- 17:
Integrated Tunable Inductors (Patent P1632) - SRC
- Integrated Tunable Inductors Application Type: Utility Patent Number: 9881731 Country: United States Status: Filed on 14-Jun-2016, Issued on 30-Jan-2018 Organization: Arizona State ...
URL: https://www.src.org/library/patent/p1632/
Modified: 2018-01-30 - 24KB
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- 18:
Mixed-signal Substrate with Integrated Through-Substrate Vias...
- Mixed-signal Substrate with Integrated Through-Substrate Vias Application Type: Utility Patent Number: 10330874 Country: United States Status: Filed on 2-Feb-2017, Issued on ...
URL: https://www.src.org/library/patent/p1675/
Modified: 2019-06-25 - 23KB
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- 19:
Composite Thermal Interface Material Including Aligned Nanofibers...
- Composite Thermal Interface Material Including Aligned Nanofibers with Low Melting Temperature Binder Application Type: Utility Patent Number: 8389119 Country: United States ...
URL: https://www.src.org/library/patent/p1023/
Modified: 2013-03-05 - 25KB
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- 20:
Electronic Device Carrier Structures Including Polymer Layers...
- Electronic Device Carrier Structures Including Polymer Layers as Barriers to Solid State Solder Diffusion and Methods of Forming the Same Application Type: Utility Country: United ...
URL: https://www.src.org/library/patent/p1994/
Modified: 2022-05-21 - 23KB
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- 21:
Oxidation Resistant PB-Free Solder Alloys (Patent P1108) - SRC
- Oxidation Resistant PB-Free Solder Alloys Application Type: Utility Patent Number: 8530058 Country: United States Status: Filed on 6-Mar-2009, Issued on 10-Sep-2013, Patent ...
URL: https://www.src.org/library/patent/p1108/
Modified: 2013-09-10 - 22KB
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- 22:
Composite Thermal Interface Material Including Particles and...
- Composite Thermal Interface Material Including Particles and Nanofibers Application Type: Utility Patent Number: 7504453 Country: United States Status: Filed on 17-Dec-2004, Issued ...
URL: https://www.src.org/library/patent/p0506/
Modified: 2009-03-17 - 22KB
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- 23:
Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition...
- Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition Copper Application Type: Utility Patent Number: 7808106 Country: United States Status: Filed on 9-May-2008, ...
URL: https://www.src.org/library/patent/p1076/
Modified: 2010-10-05 - 22KB
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- 24:
PKG AR Day 1 Recordings - SRC
- 2022 Packaging / Packaging CHIRP Annual Review Tuesday, July 12, 2022 Presentation Videos Ganesh Subbarayan, Marisol Koslowski & Andrew Pham / Purdue Pradeep Lall / Auburn Pradeep ...
URL: https://www.src.org/calendar/e007520/day1recordings/
Modified: 2022-07-14 - 27KB
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- 25:
PKG Chirp Review - Student Videos - SRC
- Packaging Review Student Posters We're excited to share virtual student poster sessions with you. Please scroll below to browse videos of students speaking to their poster. Sanoop ...
URL: https://www.src.org/calendar/e007229/student/videos/chirp/
Modified: 2021-08-27 - 24KB
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- 26:
Student Poster Information
- 2021 Packaging Review August 17-19 - Virtual Event https://www.src.org/calendar/e007229/ Student Poster Information (Abstracts) Featuring: Diego Vaca Allison Osmanson Yi Ram Kim ...
URL: https://www.src.org/calendar/e007229/pkg_poster_catalog.pdf
Modified: 2021-08-12 - 305KB
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