JUMP 2.0 Best Papers

Each quarter, the JUMP 2.0 Centers identify the single best publication (i.e. top paper) from their research efforts. The papers are listed below, categorized by Center with the most recent contribution at the top.

2024

 ACE

• Quarter 1: 310454: Caravan: Practical Online Learning of In-Network ML Models with Labeling Agents
• Quarter 2: 321758: Allo: A Programming Model for Composable Accelerator Design
  
• Quarter 3: 382480: ReCycle: Pipeline Adaptation for the Resilient Distributed Training of Large DNNs

CHIMES: 

• Quarter 1: 325398: Achieving a High Thermally Conductive One Micron AlN Deposition by High Power Impulse Magnetron Sputtering Plus Kick
• Quarter 2: 402032: ALT-Lock: Logic and Timing Ambiguity-Based IP Obfuscation Against Reverse Engineering
• Quarter 3: 272062: Glass Package with Multiple Embedded Dies for mm Wave Applications IEEE Transactions on Components, Packaging and Manufacturing Technology

COCOSYS

• Quarter 1: 291359: CogSys: Efficient and Scalable Neurosymbolic Cognition System via Algorithm-Hardware Co-Design
  
• Quarter 2: 311877: A Dynamic Power-only Compute-In-Memory Macro with Power-of-Two Nonlinear SAR ADC for Non-volatile Ferroelectric Capacitive Crossbar Array
• Quarter 3: 395260: Towards Efficient Neuro-Symbolic AI: From Workload Characterization to Hardware Architecture

COGNISENSE

• Quarter 1: Slepian Beamforming: Broadband Beamforming using Streaming Least Squares
• Quarter 2: 291489: Wideband D-Band Front-End Transmitter Components in a 90-nm SiGe Process
  
• Quarter 3: INTIACC: A Programmable Floating- Point Accelerator for Partial Differential Equations

CUBIC

• Quarter 1: 291112: 140-GHz 2-D Scalable On-Grid 8 x 8-Element Transmit–Receive Phased Arrays With Up/Down Converters Demonstrating a 5.2-m Link at 16 Gbps
• Quarter 2: 346777: Characterizing Sub-Terahertz Reflection and Its Impact on Next-Generation Wireless Networking
• Quarter 3: 379514: Enhancing the Accuracy of 6T SRAM-based In-Memory Architecture via Maximum Likelihood Detection

PRISM

• Quarter 1: 306175: NeuroSim V1.4: Extending technology support for digital compute-in-memory towards 1nm node
• Quarter 2: 306543: TAPA-CS: Enabling Scalable Accelerator Design on Distributed HBM-FPGAs
• Quarter 3: 383127: “UFC: A Unified Accelerator for Fully Homomorphic Encryption”, IEEE/ACM International Symposium on Microarchitecture 

SUPREME

• Quarter 1: 310555: CMOS-Compatible Strain Engineering for High-Performance Monolayer Semiconductor Transistors
  
• Quarter 2: 306589: High-throughput ab initio screening of 2D materials identifies p-type monolayer WS2 as potential ultra-high mobility semiconductor 
• Quarter 3: 399389: Enabling P-type Conduction in Bilayer WS₂ with NbP Topological Semimetal Contacts

2023

 ACE

• Quarter 3: 205910: CC-NIC: a Cache-Coherent Interface to the NIC 

CHIMES: 

• Quarter 3: 199353: H3DAtten Heterogeneous 3D Integrated Hybrid Analog and Digital Compute-in-Memory Accelerator for Vision Transformer Self-Attention

COCOSYS

• Quarter 3: 206878: GPT4AIGChip: Towards Next-Generation AI Accelerator Design Automation via Large Language Models

COGNISENSE

• Quarter 3: 189124: An 18.6-dBm, 8-way-combined D-band Power Amplifier with 21.6% PAE in 22-nm FD-SOI CMOS

CUBIC

• Quater 3: 199103: N-Polar GaN Deep Recess HEMT with Atomic Layer Deposition HfO₂ as Gate Insulator

PRISM

• Quater 3: 202291: Demystifying CXL Memory with Genuine CXL-Ready Systems and Devices

SUPREME

• Quarter 3: 210082: Invited Paper: Algorithm/Hardware Co-design for Few-Shot Learning at the Edge