Questions?
Content Type
Other 206
Events 114
Patent Filings 3

SRC Program
SRC 194
GRC 98
JUMP2 10
NRI 9
FCRP 4
SRP 3
JUMP 2
SRCEA 2
3D EC 1
ICA 1
nCORE 1

Year
2024 8
2023 21
2022 33
2021 29
2020 9
2019 4
2018 13
2017 18
2016 9
2015 11
2014 7
2013 10
2012 12
2011 52
2010 82

Center
TxACE 5
CHIRP 4
EBSM 4
FENA 3
INDEX 3
MSD 3
C2S2 2
CNFD 2
GSRC 2
IFC 2
NRI-NSF 2
SWAN 2
ACE 1
ACE4S 1
AMML 1
ASCENT 1
C-FAR 1
CAIST 1
CAPSL 1
CBRIC 1
CDADIC 1
CEMPI 1
DEEP3M 1
E2CDA 1
E2CDA-NRI 1
FAME 1
IMPACT 1
IPC 1
LEAST 1
MuSyC 1
NCRC 1
NEWLIMITS 1
SMART 1
SONIC 1
SUPREME 1
TerraSwarm 1

Thrust/Theme
PKG – Packaging 6
AMS-CSD – Analog/Mixed-Signal Ci... 4
ESH – Environment Safety and Hea... 4
LMD – Logic and Memory Devices 4
PAT – Patterning 4
HWS – Hardware Security 3
AIHW – Artificial Intelligence H... 2
CADT – Computer-Aided Design and... 2
I3T – Innovative and Intelligent... 2
NMP – Nanomanufacturing Material... 2
SCARF – Supply Chain AI Realized... 2
SLD – System Level Design 2
ADS – Alternative Device Structu... 1
AMML-T1 – Antiferromagnetic Magn... 1
AMS – Analog and Mixed-Signal De... 1
ASCENT-T3 – Heterogeneous Integr... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DEEP3M-T4 – Architectures 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
E2CDA2 – E2CDA 2.0 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
IMPACT-T1 – Materials for Scaled... 1
IMPACT-T2 – Materials for Storag... 1
IRP – India Research Program 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NEWLIMITS-T1 – Novel Computing a... 1
NEWLIMITS-T2 – 2D Materials Devi... 1
NEWLIMITS-T3 – Advanced Manufact... 1
NEWLIMITS-T4 – Characterization ... 1
NEWLIMITS-T5 – Simulations and M... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SMART-T1 – Spin-orbit Torque Mat... 1
SMART-T2 – Ultra-Low Loss Spin W... 1
SMART-T3 – Magneto-ionic Materia... 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1

GRC Science Area
NMS – Nanomanufacturing Sciences 9
CADTS – Computer Aided Design & ... 7
IPS – Interconnect & Packaging S... 6
CSR – Cross-disciplinary Semicon... 4
DS – Device Sciences 4
ICSS – Integrated Circuit & Syst... 4
MPS – Material & Process Science... 4
PKG – Packaging Sciences 4
ES-H – Environmental Safety & He... 3
SRCEA – SRC Education Alliance 2
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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1: Summer Study - Bio - Rajiv Joshi - SRC
Biography: Rajiv Joshi Rajiv Joshi Dr. Rajiv V. Joshi is a research staff member at T. J. Watson research center, IBM. He received his B.Tech I.I.T (Bombay, India), M.S (M.I.T) and ...
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3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
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5: pdf2010 SRC Corporate Annual Report
IMPACT SRC, TOGETHER WITH ITS MEMBERS, STUDENTS AND FACULTY, MAKES A PROFOUND "REAL-WORLD" DIFFERENCE. ANNUAL REPORT 2010 1 IN TODAY'S CULTURE OF HIGH-SPEED NANOTECH- NOLOGY, there ...
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9: pdf1994 Annual Report
Mission It is the mission of the Semiconductor Research Corporation to solve the technical challenges required to keep the United States number one in the global semiconductor ...
URL: https://www.src.org/about/corporate-annual/1994.pdf
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2009 GRC ETAB Summer Study La Quinta Golf Resort, CA June 29-30, 2009 Session II: Systems, Software, and Applications Research for the Semiconductor Industry Working Committee  ...
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1 through 30 of 323 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>