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[x] SRC Program
GRC

Content Type
Other 129
Events 126
Patent Filings 5

Year
2024 2
2023 10
2022 11
2021 9
2020 7
2019 9
2018 13
2017 7
2016 12
2015 12
2014 5
2013 6
2012 5
2011 101
2010 43
2009 1
2008 1

Center
TxACE 12
EBSM 10
CHIRP 7
CEMPI 2
ACE4S 1
CAIST 1
CDADIC 1
IPC 1
NCRC 1

Thrust/Theme
PKG – Packaging 10
ESH – Environment Safety and Hea... 9
AMS-CSD – Analog/Mixed-Signal Ci... 7
CADT – Computer-Aided Design and... 6
HWS – Hardware Security 5
LMD – Logic and Memory Devices 5
NMP – Nanomanufacturing Material... 4
CD – Circuit Design 3
ISD – Integrated System Design 3
LPD – Logic & Physical Design 3
NEM – Nanoengineered Materials 3
SLD – System Level Design 3
TT – Test & Testability 3
VER – Verification 3
BEP – Back End Processes 2
EP3C – Efficiency and Performanc... 2
FACSYS – Factory Systems 2
I3T – Innovative and Intelligent... 2
PAT – Patterning 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

GRC Science Area
NMS – Nanomanufacturing Sciences 20
CADTS – Computer Aided Design & ... 14
ICSS – Integrated Circuit & Syst... 14
IPS – Interconnect & Packaging S... 8
PKG – Packaging Sciences 5
ES-H – Environmental Safety & He... 4
CSR – Cross-disciplinary Semicon... 2
DES – Design Sciences 1
DS – Device Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

211 through 240 of 260 similar documents, best matches first.   
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211: Simon Karecki Fellowship Fund - SRC
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212: pdfCADT - Verification Reserach Needs Document
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Modified: 2010-07-29 - 620KB
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214: 2016 Simon Karecki Award Presented to Xiangyu Bi, Arizona State...
2016 Simon Karecki Award Presented to Xiangyu Bi, Arizona State University The following is an excerpt of the 2016 Simon Karecki award presentation: This is the 15th presentation ...
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Modified: 2010-06-21 - 25KB
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215: Vivek De bio - SRC
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216: pdfSRC/NSF Design Forum - Professor Arvind
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217: 2017 Simon Karecki Award Presented to Sarah Karimi, University...
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219: pdf2002-2007 ICSS Research Needs Document
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Modified: 2011-02-03 - 35KB
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220: pdfResearch Needs for Device Sciences Modeling and Simulation
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Modified: 2011-02-15 - 73KB
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221: ESH e-Workshop: Experimental Evaluation of Degradation Rates...
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223: The Transformation of the Semiconductor Industry: From Integrated...
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225: 2010 Simon Karecki Award Presented to Chi-cheng Chiu - SRC
2010 Simon Karecki Award Presented to Chi-cheng Chiu Note: The following is the presentation awarding the 2010 Simon Karecki Award at the SRC/SEMATECH Center for Environmentally ...
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226: pdfMemory Needs
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227: pdfSemiconductor Research Corporation (SRC), Durham, NC 27703
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228: Trends in Semiconductor Materials (Event E005568) - SRC
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229: pdfSRC: GRC Design Forum Postion Statement - Jeff Parkhurst,Intel
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230: Engineering Research Center for Environmentally Benign Semiconductor...
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232: Summer Study - Bio - Rajiv Joshi - SRC
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233: NMS Nanoengineered Materials Annual Review (Event E004780) -...
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URL: https://www.src.org/calendar/e004780/
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234: pdfCADTS LPD Needs Document
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235: pdfNMS Newsletters - October 2012
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Modified: 2012-10-09 - 75KB
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237: pdf2009 Summer Study: Application and Network Optimized Next Generation...
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238: pdfExecSummary MICurrent.doc
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239: pdfPowerPoint Presentation
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240: pdfBeyond the System-on-a-Chip
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211 through 240 of 260 similar documents, best matches first.   
<< previous Page: 4 5 6 7 8 9 next >>