Questions?
Content Type
Other 308
Events 161

SRC Program
SRC 231
GRC 179
JUMP2 27
NRI 15
FCRP 9
JUMP 4
3D EC 2
nCORE 2
ICA 1
SRP 1
STARnet 1

Year
2024 18
2023 41
2022 44
2021 35
2020 13
2019 14
2018 19
2017 30
2016 18
2015 13
2014 7
2013 17
2012 24
2011 100
2010 69
2009 1
2008 1

Center
TxACE 8
CHIRP 6
EBSM 4
FENA 4
MSD 4
C2S2 3
E2CDA-NRI 3
GSRC 3
IFC 3
MuSyC 3
NRI-NSF 3
SUPREME 3
ACE 2
CUBIC 2
ACE4S 1
AMML 1
C-FAR 1
C-SPIN 1
CAIST 1
CAPSL 1
CBRIC 1
CDADIC 1
CEMPI 1
CHIMES 1
CNFD 1
COCOSYS 1
COGNISENSE 1
DEEP3M 1
E2CDA 1
FAME 1
IMPACT 1
INDEX 1
IPC 1
LEAST 1
NCRC 1
NEWLIMITS 1
NPT 1
PRISM 1
SMART 1
SONIC 1

Thrust/Theme
PKG – Packaging 11
LMD – Logic and Memory Devices 6
AMS-CSD – Analog/Mixed-Signal Ci... 5
HWS – Hardware Security 4
CADT – Computer-Aided Design and... 3
CD – Circuit Design 3
ESH – Environment Safety and Hea... 3
ISD – Integrated System Design 3
LPD – Logic & Physical Design 3
NMP – Nanomanufacturing Material... 3
SLD – System Level Design 3
TT – Test & Testability 3
VER – Verification 3
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMML-T1 – Antiferromagnetic Magn... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
CBRIC-T1 – Neuro-inspired Algori... 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DEEP3M-T4 – Architectures 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
E2CDA2 – E2CDA 2.0 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
IMPACT-T1 – Materials for Scaled... 1
IMPACT-T2 – Materials for Storag... 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NEWLIMITS-T1 – Novel Computing a... 1
NEWLIMITS-T2 – 2D Materials Devi... 1
NEWLIMITS-T3 – Advanced Manufact... 1
NEWLIMITS-T4 – Characterization ... 1
NEWLIMITS-T5 – Simulations and M... 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PRISM-T1 – Systems and Software 1

GRC Science Area
CADTS – Computer Aided Design & ... 12
ICSS – Integrated Circuit & Syst... 12
IPS – Interconnect & Packaging S... 8
NMS – Nanomanufacturing Sciences 8
PKG – Packaging Sciences 5
SRCEA – SRC Education Alliance 5
CSR – Cross-disciplinary Semicon... 3
DS – Device Sciences 3
ES-H – Environmental Safety & He... 2
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

1 through 30 of 469 similar documents, best matches first.   
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1: pdfJoint University Microelectronics Program 2.0 Proposers' Day...
Advanced Heterogeneous Integration SRC JUMP 2.0 Proposers Workshop January 25, 2022 Theme 6: Advanced Monolithic and Heterogeneous Integration Prepared by Johanna Swan, Fellow, ...
URL: https://www.src.org/...adosavljevic_theme_6-jump-2-0-pdw.pdf
Modified: 2022-01-26 - 2.4MB
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2: pdfJoint University Microelectronics Program 2.0 Proposers' Day...
Joint University Microelectronics Program 2.0 Proposers' Day Workshop SRC Select Disclosure Tim Green JUMP Director Introduction to the JUMP 2.0 Program 2 Thank you for being here ...
URL: https://www.src.org/...07507/jump2-0-intro-tim-green-pdw.pdf
Modified: 2022-01-26 - 682KB
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3: JUMP Mission - SRC
JUMP Mission The mission of JUMP is to look beyond today's technology horizon and lay the scientific groundwork that extends the viability of Moore's Law economics through 2040. ...
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Modified: 2013-01-15 - 26KB
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4: pdfSRC CONNECTIONS February 2022
F E B R U A R Y 2 0 2 2 NSF and SRC have committed to support hands-on research opportunities for undergraduate students in technical areas related to microelectronics and advanced ...
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5: pdfJoint University Microelectronics Program 2.0 Proposers' Day...
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JUMP Research Announcement Program Objectives and Description Timetable and Deadlines "Vertical" Application-Focused Centers "Horizontal" Disciplinary-Focused Centers Research ...
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7: nCORE Request for Proposals - SRC
Request for Proposals for the nanoelectronic COmputing REsearch (nCORE) Program A. Background A1. Research Areas of Interest A2. Proposal Process A3. Program Scope and Planned ...
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8: pdfProposers' Day Workshop
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JUMP 2.0 Theme 7: High Performance Energy-efficient Devices for Digital and Analog Applications Harsono Simka (h.simka@samsung.com) Logic Pathfinding Group, Device Lab, Samsung ...
URL: https://www.src.org/...arsono_simka_theme-7-jump-2-0-pdw.pdf
Modified: 2022-01-26 - 2.6MB
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11: pdfGeneration Companies 2016 financial statements.pdf
®= Semiconductor Research Cor p oration Building the Future In 2018, SRC continued its growth trajectory with the addition of new industry members and government agency awards ...
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12: pdfJoint University Microelectronics Program 2.0 Proposers' Day...
JUMP 2.0 Proposers' Day Dev Palmer Deputy Director Microsystems Technology Office Joint University Microelectronics Program 2.0 Proposer's Day January 25, 2022 Approved for Public ...
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13: pdfRA 2012-XXXXX Proposer Information Pamphlet
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URL: https://www.src.org/compete/s201209/pip-s201209.pdf
Modified: 2012-04-23 - 181KB
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14: pdfJoint University Microelectronics Program 2.0 Proposers' Day...
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15: pdfCenter for Ubiquitous Connectivity
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16: pdfPowerPoint Presentation
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20: pdfTable
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21: pdfPowerPoint Presentation
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22: pdfProposers' Day Workshop
Proposers' Day Workshop Monday, January 23, 2017 @srcJUMP, #JUMPpdw . Please silence your phone. . Materials will be posted soon. Photography is not allowed. . We are recording the ...
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23: pdfProposers' Day Workshop
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27: pdfPowerPoint Presentation
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1 through 30 of 469 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>