Questions?
Content Type
Other 643
Events 389
Patent Filings 241

SRC Program
SRC 606
GRC 449
FCRP 56
NRI 54
JUMP 35
JUMP2 26
STARnet 21
SRCEA 14
nCORE 11
3D EC 3
Auto 3
SRP 3
ERI 2
ICA 1
MSR-Intel 1
NINE 1

Year
2024 19
2023 47
2022 55
2021 61
2020 28
2019 31
2018 50
2017 55
2016 41
2015 43
2014 35
2013 50
2012 55
2011 225
2010 227
2009 1
2008 1

Center
C2S2 46
GSRC 44
IFC 44
MSD 42
FENA 39
ASCENT 28
EBSM 24
INDEX 21
MuSyC 20
TxACE 20
SWAN 19
CNFD 18
FAME 16
LEAST 16
C-FAR 14
SONIC 14
TerraSwarm 14
ACE4S 10
CBRIC 10
E2CDA-NRI 9
NPT 8
NRI-NSF 8
C-SPIN 6
CHIRP 6
IMPACT 6
MIND 5
Benchmarking 3
SUPREME 3
WIN 3
ACE 2
AMML 2
CONIX 2
CUBIC 2
E2CDA 2
NCRC 2
NEWLIMITS 2
NRI-Projects 2
ADA 1
CAIST 1
CAPSL 1

Thrust/Theme
TT – Test & Testability 24
NMP – Nanomanufacturing Material... 20
CD – Circuit Design 19
Factory Systems 16
ESH – Environment Safety and Hea... 15
PKG – Packaging 14
ASCENT-T1 – Vertical CMOS 13
HWS – Hardware Security 12
SLD – System Level Design 12
I3T – Innovative and Intelligent... 11
CADT – Computer-Aided Design and... 10
AMS-CSD – Analog/Mixed-Signal Ci... 9
ASCENT-T2 – Beyond CMOS 9
PAT – Patterning 9
ISD – Integrated System Design 8
LPD – Logic & Physical Design 8
DesTech – Design Techniques 6
ASCENT-T3 – Heterogeneous Integr... 5
CFM&TCM – CFM & Total Chemical M... 5
IMPACT-T1 – Materials for Scaled... 5
VER – Verification 5
BEP – Back End Processes 4
CBRIC-T2 – Neuromorphic Fabrics 4
LMD – Logic and Memory Devices 4
NEM – Nanoengineered Materials 4
Pat(MPS) – Patterning 4
Advanced Devices & Technologies 3
Back End Processes 3
CBRIC-T1 – Neuro-inspired Algori... 3
DCMOS – Digital CMOS Technologie... 3
SCARF – Supply Chain AI Realized... 3
AMML-T1 – Antiferromagnetic Magn... 2
ASCENT-T4 – Merged Logic Memory ... 2
C&S – Controls and Sensing 2
CM – Compact Modeling 2
CONIX-T1 – ARENA Integrator 2
Doping Technologies 2
E2CDA2 – E2CDA 2.0 2
EP3C – Efficiency and Performanc... 2
FACSYS – Factory Systems 2
IMPACT-T2 – Materials for Storag... 2
MTMP – Metrology Tools Matls & P... 2
Masks 2
Materials 2
Modeling & Simulation 2
Multi-level Interconnect 2
NEWLIMITS-T3 – Advanced Manufact... 2
Physical Design 2
Processes – Processes 2
Reliability 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADA-T1 – Deft Development 1
ADA-T2 – Algorithm-driven Archit... 1
ADA-T3 – Technology-driven Syste... 1
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Technology Option 1
Analysis Design & Simulation 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
CBRIC-T3 – Distributed Intellige... 1
CBRIC-T4 – Application Drivers 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T2 – Hardware/Software Pla... 1
CONIX-T3 – Security 1
CONIX-T4 – Machine Learning 1
CONIX-T5 – Communication Positio... 1
CONIX-T6 – Programming and Resou... 1
CRISP-T1 – Hardware Support for ... 1
CRISP-T2 – System Support for Ma... 1
CRISP-T3 – Scaling Applications ... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T1 – Systems and Algor... 1
ComSenTer-T2 – mm-wave/THz ICs a... 1
ComSenTer-T3 – Application-speci... 1
ComSenTer-T4 – Center-wide Demon... 1
Contamination Control 1
Cost Reduction 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DEEP3M-T4 – Architectures 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1

GRC Science Area
CADTS – Computer Aided Design & ... 94
NMS – Nanomanufacturing Sciences 74
ICSS – Integrated Circuit & Syst... 57
DS – Device Sciences 51
IPS – Interconnect & Packaging S... 48
CSR – Cross-disciplinary Semicon... 46
MPS – Material & Process Science... 31
NIS – Nanostructure & Integratio... 23
LIT – Lithography Sciences 12
MBP – Materials & Bulk Processes... 11
DES – Design Sciences 10
ES-H – Environmental Safety & He... 8
SRCEA – SRC Education Alliance 8
INT – Interconnect Sciences 7
MIC – Microstructure Sciences 4
PKG – Packaging Sciences 4
MFGPS – Manufacturing Process Sc... 3
FAC – Factory Sciences 2
GEN – General 1
ISA – Industrial Support Activit... 1
MFG – Manufacturing Sciences 1
MSS – Manufacturing Systems Scie... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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331: pdfTask 1.1 Evolvable Distributed Accelerators
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339: pdfNanoelectronics
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343: 2011 Aristotle Award Winner - SRC
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344: pdf2002-2007 ICSS Research Needs Document
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345: SRC has Reach - John Hennessy video clip - SRC
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347: Semiconductor Research Corporation - SRC
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349: S201004 - Back End Processes Solicitation - SRC
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350: Moving Technology Forward - John Hennessy video clip - SRC
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351: 2020 Technical Excellence Award - SRC
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352: Low-Power Phase Change Memory Technology with Interfacial Thermoelectr...
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353: SRC Call for White Papers: FEP - SRC
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355: pdfSRC CONNECTIONS OCTOBER 2021
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356: SRC Enables Cooperation - James Plummer video clip - SRC
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357: Call for Research in IPS - Back End Processes, Packaging, and...
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360: Depletion-Mode Field-Effect Transistor-Based Phototransistor...
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