Search: infield%3Aenc%3AdnavConType%3DPublication%2BDocuments

SRC Program

SRC	500
GRC	315
NRI	44
JUMP2	24
FCRP	20
SRCEA	11
SRP	6
3D EC	5
STARnet	5
nCORE	5
JUMP	3
Auto	2
ICA	2
NINE	1
Undergrad	1

Year

2024	15
2023	39
2022	52
2021	50
2020	25
2019	25
2018	40
2017	51
2016	34
2015	33
2014	22
2013	36
2012	51
2011	240
2010	180
2009	1
2008	1

Thrust/Theme

NMP – Nanomanufacturing Material...	12
ESH – Environment Safety and Hea...	11
PKG – Packaging	10
AMS-CSD – Analog/Mixed-Signal Ci...	7
HWS – Hardware Security	7
CD – Circuit Design	6
LMD – Logic and Memory Devices	6
CADT – Computer-Aided Design and...	5
TT – Test & Testability	5
Back End Processes	4
SLD – System Level Design	4
DesTech – Design Techniques	3
I3T – Innovative and Intelligent...	3
ISD – Integrated System Design	3
LPD – Logic & Physical Design	3
PAT – Patterning	3
VER – Verification	3
AIHW – Artificial Intelligence H...	2
IMPACT-T1 – Materials for Scaled...	2
Materials	2
Modeling & Simulation	2
NEM – Nanoengineered Materials	2
Physical Design	2
SCARF – Supply Chain AI Realized...	2
TechCAD – Technology CAD	2
ACE-T1 – Heterogeneous Computing...	1
ACE-T2 – Distributed Evolvable M...	1
ACE-T3 – Fine-grained Communicat...	1
ACE-T4 – Security Privacy and Co...	1
ACE-T5 – Demonstrators	1
ADS – Alternative Device Structu...	1
AMS – Analog and Mixed-Signal De...	1
AdvTech – Advanced Technology	1
Advanced Bipolar SOI-MOS Transis...	1
Advanced Devices	1
Advanced Devices & Technologies	1
Advanced Technology Option	1
Analysis Design & Simulation	1
BEP – Back End Processes	1
C&S – Controls and Sensing	1
CBRIC-T1 – Neuro-inspired Algori...	1
CFM&TCM – CFM & Total Chemical M...	1
CHIMES-T1 – System Driven Functi...	1
CHIMES-T2 – Monolithic 3D (M3D) ...	1
CHIMES-T3 – Ultra Dense Heteroge...	1
CHIMES-T4 – Materials Behavior S...	1
CM – Compact Modeling	1
COCOSYS-T1 – Neural Symbolic and...	1
COCOSYS-T2 – Hardware-Algorithm ...	1
COCOSYS-T3 – Technology-driven H...	1
COCOSYS-T4 – Collaborative Intel...	1
COGNISENSE-1 – Multi-spectral Ar...	1
COGNISENSE-2 – Analog-to-Insight	1
COGNISENSE-3 – Closed-Loop Atten...	1
COGNISENSE-4 – Heterogeneous Sys...	1
COGNISENSE-5 – System Software a...	1
CSR – Cross-Disciplinary Semicon...	1
CUBIC-T1 – Connectivity Networks...	1
CUBIC-T2 – Wireline and Lightwav...	1
CUBIC-T3 – Wireless Circuits and...	1
Contamination Control	1
Cost Reduction	1
DCMOS – Digital CMOS Technologie...	1
DE – Design Environment	1
DSMS – Device Sciences Modeling ...	1
DV – Design Verification	1
Defect Reduction	1
Deposition	1
DesSyn – Design Synthesis	1
Doping Technologies	1
EP3C – Efficiency and Performanc...	1
Equip Automation & Process Contr...	1
Equip – Equipment	1
Equip. Auto. and Process Control	1
FACSYS – Factory Systems	1
FAM – Factory Automation & Manag...	1
FEOL – FEOL Processes	1
FacOps – Factory Operations	1
Factory Systems	1
Front End Processes	1
Heat Signal & Power Distribution	1
Heat Signal Power	1
IMPACT-T2 – Materials for Storag...	1
IRP – India Research Program	1
Interconnect Architecture	1
Lithography	1
Logic Design	1
Logistics & Modeling/Simulation	1
MT – Memory Technologies	1
MTMP – Metrology Tools Matls & P...	1
Masks	1
Materials & Measurements	1
Metrology	1
Modeling & TCAD	1
Multi-level Interconnect	1
NCR – Non-Classical CMOS Researc...	1
PMM – Packaging Materials and Me...	1
PMS – Packaging Modeling and Sim...	1
PRISM-T1 – Systems and Software	1
PRISM-T2 – Architecture	1
PRISM-T3 – Devices and Circuits	1
PRISM-T4 – Grand Challenges	1
PS/E – Process Simplification/En...	1
Package & Electrical Design	1
Package Reliability	1
Packaging & Interconnect Systems	1
Packaging Materials Interfaces	1
Pat(MPS) – Patterning	1
PatMat – Patterning Materials	1
PatSys – Patterning Systems	1