Questions?
Content Type
Other 380
Events 326
Patent Filings 24

SRC Program
SRC 312
GRC 299
NRI 52
JUMP2 23
FCRP 18
nCORE 12
JUMP 8
STARnet 8
3D EC 5
ERI 4
ICA 1
MSR-Intel 1
NINE 1
SRCEA 1
SRP 1

Year
2024 12
2023 39
2022 43
2021 41
2020 19
2019 15
2018 22
2017 41
2016 24
2015 19
2014 20
2013 24
2012 50
2011 172
2010 158
2009 1

Center
SWAN 16
MSD 14
INDEX 12
FENA 11
C2S2 10
GSRC 10
IFC 10
NRI-NSF 9
C-SPIN 8
ASCENT 7
CNFD 7
MIND 7
MuSyC 7
TxACE 7
AMML 6
EBSM 6
WIN 6
CHIRP 5
FAME 5
LEAST 5
NEWLIMITS 4
Benchmarking 3
C-FAR 3
E2CDA-NRI 3
SONIC 3
TerraSwarm 3
ACE 2
CAPSL 2
CUBIC 2
NRI-Projects 2
SUPREME 2
ACE4S 1
CAIST 1
CBRIC 1
CDADIC 1
CEMPI 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
DEEP3M 1

Thrust/Theme
LMD – Logic and Memory Devices 12
PKG – Packaging 9
AMML-T1 – Antiferromagnetic Magn... 6
NMP – Nanomanufacturing Material... 6
AMS-CSD – Analog/Mixed-Signal Ci... 5
ASCENT-T1 – Vertical CMOS 5
ESH – Environment Safety and Hea... 5
NEM – Nanoengineered Materials 4
CADT – Computer-Aided Design and... 3
HWS – Hardware Security 3
PAT – Patterning 3
SLD – System Level Design 3
AIHW – Artificial Intelligence H... 2
ASCENT-T2 – Beyond CMOS 2
ASCENT-T3 – Heterogeneous Integr... 2
Advanced Devices & Technologies 2
CAPSL-T1 – Materials Development... 2
CAPSL-T2 – P-transistors for PSL... 2
CAPSL-T3 – Device Models and Tut... 2
CAPSL-T4 – Architectures and Sys... 2
CD – Circuit Design 2
FACSYS – Factory Systems 2
Factory Systems 2
I3T – Innovative and Intelligent... 2
ISD – Integrated System Design 2
LPD – Logic & Physical Design 2
NEWLIMITS-T1 – Novel Computing a... 2
NEWLIMITS-T2 – 2D Materials Devi... 2
NEWLIMITS-T4 – Characterization ... 2
TT – Test & Testability 2
VER – Verification 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADS – Alternative Device Structu... 1
AMS – Analog and Mixed-Signal De... 1
ASCENT-T4 – Merged Logic Memory ... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DEEP3M-T4 – Architectures 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
E2CDA2 – E2CDA 2.0 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
IMPACT-T1 – Materials for Scaled... 1
IMPACT-T2 – Materials for Storag... 1
IRP – India Research Program 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEWLIMITS-T3 – Advanced Manufact... 1

GRC Science Area
NMS – Nanomanufacturing Sciences 34
CADTS – Computer Aided Design & ... 33
ICSS – Integrated Circuit & Syst... 23
IPS – Interconnect & Packaging S... 17
CSR – Cross-disciplinary Semicon... 13
DS – Device Sciences 12
SRCEA – SRC Education Alliance 9
PKG – Packaging Sciences 5
MBP – Materials & Bulk Processes... 2
MIC – Microstructure Sciences 2
MPS – Material & Process Science... 2
NIS – Nanostructure & Integratio... 2
PID – Process Integration & Devi... 2
DES – Design Sciences 1
ES-H – Environmental Safety & He... 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MSS – Manufacturing Systems Scie... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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211: pdfResearch Needs for Compact Modeling
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212: pdfResearch Needs for Compact Modeling
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219: pdfDr
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224: pdfE003676 - Memory Forum - Government-University-Industry Collaborative...
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230: pdf3D IMAPS
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