Questions?
[x] GRC Science Area
CADTS – Computer Aided Design & Test Sciences

Content Type
Events 17
Other 1

SRC Program
GRC 12
SRC 6
3D EC 4
FCRP 4

Year
2015 1
2013 2
2012 1
2011 10
2010 3

Center
TxACE 3
C-FAR 2
C2S2 2
CNFD 2
EBSM 2
FAME 2
FENA 2
GSRC 2
IFC 2
INDEX 2
LEAST 2
MSD 2
MuSyC 2
SONIC 2
SWAN 2
TerraSwarm 2
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
IPC 1
NCRC 1
NPT 1

Thrust/Theme
AMS-CSD – Analog/Mixed-Signal Ci... 2
CADT – Computer-Aided Design and... 2
CD – Circuit Design 2
HWS – Hardware Security 2
ISD – Integrated System Design 2
LPD – Logic & Physical Design 2
SLD – System Level Design 2
TT – Test & Testability 2
VER – Verification 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PKG – Packaging 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

1 through 18 of 18 similar documents, best matches first.   
1: pdfFinal Report - Workshop on Failure and Uncertainty in Mixed-Signal...
National Science Foundation Workshop on Failure and Uncertainty in Mixed-Signal Circuits and Systems Arlington, Virginia July 8-9, 2010 Principal Investigators: Ralph Cavin, ...
URL: https://www.src.org/calendar/e004025/final-report.pdf
Modified: 2011-06-01 - 914KB
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2: TECHCON 2012 (Event E004114) - SRC
TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB
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3: pdfPowerPoint Presentation
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URL: https://www.src.org/calendar/e004357/03-conn.pdf
Modified: 2011-05-04 - 1.1MB
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4: TECHCON 2011 (Event E004113) - SRC
TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
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URL: https://www.src.org/calendar/e004357/01-vontrapp.pdf
Modified: 2011-05-04 - 2.3MB
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Some (possibly controversial) thoughts H. De Man, Em. Prof. K.U.Leuven, Senior Fellow IMEC, deman@imec.be The right questions are formulated. One could start suggestions for ...
URL: https://www.src.org/...764/hugo-deman-position-statement.pdf
Modified: 2011-08-02 - 36KB
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10: pdfDesign Forum: David Kung Position Statement
Future of Design Automation To determine the future direction of Design Automation, we need to take a careful look at the trends in design (systems and circuits) and technology. On ...
URL: https://www.src.org/...764/david-kung-position-statement.pdf
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11: pdfPresentation Title
PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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12: India Design Review (Event E005563) - SRC
India Design Review Date: Wednesday, Jan. 7, 2015, 6 p.m. - Thursday, Jan. 8, 2015, 5 p.m. Local Location: Hyatt Bangalore, 1/1, Swami Vivekananda Road, Off M.G. Road, Ulsoor, ...
URL: https://www.src.org/calendar/e005563/
Modified: 2015-02-04 - 82KB
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13: TECHCON 2013 (Event E004683) - SRC
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Modified: 2014-03-10 - 136KB
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14: pdfSRC/NSF Design Forum - Position Statement
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URL: https://www.src.org/...764/jason-cong-position-statement.pdf
Modified: 2011-08-02 - 35KB
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15: pdf3D IMAPS
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16: pdfE003932 - Variability Forum - Nowka
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URL: https://www.src.org/calendar/e003932/e003932_s1_3_nowka.pdf
Modified: 2010-06-29 - 1.4MB
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17: pdfE003932 - Variability Forum - McAndrew
Variability Modeling at the Device Level for Circuit Simulation First International Variability Characterization Workshop April 30, 2010 Freescale Semiconductor Colin McAndrew ...
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Modified: 2010-06-29 - 1.1MB
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18: pdfVertically Integrated Test/Calibration and Reliability Enhancement...
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URL: https://www.src.org/calendar/e004025/ozev.pdf
Modified: 2010-07-19 - 54KB
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1 through 18 of 18 similar documents, best matches first.