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SRC Program

GRC	208
SRC	197
JUMP2	14
NRI	10
FCRP	6
3D EC	4
JUMP	3
nCORE	2
ERI	1
ICA	1
NINE	1

Year

2024	9
2023	22
2022	26
2021	27
2020	10
2019	9
2018	16
2017	20
2016	13
2015	12
2014	17
2013	10
2012	35
2011	104
2010	104
2009	1

Thrust/Theme

PKG – Packaging	11
ESH – Environment Safety and Hea...	8
NMP – Nanomanufacturing Material...	7
NEM – Nanoengineered Materials	3
AMS-CSD – Analog/Mixed-Signal Ci...	2
ASCENT-T1 – Vertical CMOS	2
PAT – Patterning	2
ADS – Alternative Device Structu...	1
AIHW – Artificial Intelligence H...	1
AMML-T1 – Antiferromagnetic Magn...	1
AMS – Analog and Mixed-Signal De...	1
AdvTech – Advanced Technology	1
Advanced Bipolar SOI-MOS Transis...	1
Advanced Devices	1
Advanced Devices & Technologies	1
Advanced Technology Option	1
Analysis Design & Simulation	1
BEP – Back End Processes	1
Back End Processes	1
C&S – Controls and Sensing	1
CADT – Computer-Aided Design and...	1
CAPSL-T1 – Materials Development...	1
CAPSL-T2 – P-transistors for PSL...	1
CAPSL-T3 – Device Models and Tut...	1
CAPSL-T4 – Architectures and Sys...	1
CD – Circuit Design	1
CFM&TCM – CFM & Total Chemical M...	1
CM – Compact Modeling	1
CSR – Cross-Disciplinary Semicon...	1
ComSenTer-T1 – Systems and Algor...	1
ComSenTer-T2 – mm-wave/THz ICs a...	1
ComSenTer-T3 – Application-speci...	1
ComSenTer-T4 – Center-wide Demon...	1
Contamination Control	1
Cost Reduction	1
DCMOS – Digital CMOS Technologie...	1
DE – Design Environment	1
DEEP3M-T1 – Devices	1
DEEP3M-T2 – Circuits	1
DEEP3M-T3 – Materials	1
DEEP3M-T4 – Architectures	1
DSMS – Device Sciences Modeling ...	1
DV – Design Verification	1
Defect Reduction	1
Deposition	1
DesSyn – Design Synthesis	1
DesTech – Design Techniques	1
Doping Technologies	1
E2CDA2 – E2CDA 2.0	1
EP3C – Efficiency and Performanc...	1
Equip Automation & Process Contr...	1
Equip – Equipment	1
Equip. Auto. and Process Control	1
FACSYS – Factory Systems	1
FAM – Factory Automation & Manag...	1
FEOL – FEOL Processes	1
FacOps – Factory Operations	1
Factory Systems	1
Front End Processes	1
HWS – Hardware Security	1
Heat Signal & Power Distribution	1
Heat Signal Power	1
I3T – Innovative and Intelligent...	1
IMPACT-T1 – Materials for Scaled...	1
IMPACT-T2 – Materials for Storag...	1
ISD – Integrated System Design	1
Interconnect Architecture	1
LMD – Logic and Memory Devices	1
LPD – Logic & Physical Design	1
Lithography	1
Logic Design	1
Logistics & Modeling/Simulation	1
MT – Memory Technologies	1
MTMP – Metrology Tools Matls & P...	1
Masks	1
Materials	1
Materials & Measurements	1
Metrology	1
Modeling & Simulation	1
Modeling & TCAD	1
Multi-level Interconnect	1
NCR – Non-Classical CMOS Researc...	1
NEWLIMITS-T1 – Novel Computing a...	1
NEWLIMITS-T2 – 2D Materials Devi...	1
NEWLIMITS-T3 – Advanced Manufact...	1
NEWLIMITS-T4 – Characterization ...	1
NEWLIMITS-T5 – Simulations and M...	1
PMM – Packaging Materials and Me...	1
PMS – Packaging Modeling and Sim...	1
PS/E – Process Simplification/En...	1
Package & Electrical Design	1
Package Reliability	1
Packaging & Interconnect Systems	1
Packaging Materials Interfaces	1
Pat(MPS) – Patterning	1
PatMat – Patterning Materials	1
PatSys – Patterning Systems	1
PhyDes – Physical Design	1
Physical Design	1
Plasma Etch	1
Process Architecture	1
Processes – Processes	1
Quality & Reliability	1
Rapid Yield Learning	1
Reliability	1
Resist	1
SLD – System Level Design	1
SMART-T1 – Spin-orbit Torque Mat...	1
SMART-T2 – Ultra-Low Loss Spin W...	1
SMART-T3 – Magneto-ionic Materia...	1