Questions?
Content Type
Other 447
Patent Filings 365
Events 256

SRC Program
SRC 389
FCRP 193
GRC 192
STARnet 101
NRI 94
JUMP 54
nCORE 27
JUMP2 18
SRP 6
Auto 3
ERI 2
ICA 2
SRCEA 2
3D EC 1
Undergrad 1

Year
2024 1
2023 47
2022 60
2021 58
2020 28
2019 28
2018 37
2017 53
2016 39
2015 19
2014 25
2013 27
2012 44
2011 95
2010 132
2009 1
2008 1

Center
IFC 81
C2S2 41
C-SPIN 40
FENA 39
GSRC 34
MSD 27
ASCENT 24
LEAST 23
C-FAR 19
CNFD 18
FAME 18
SWAN 18
NRI-NSF 16
EBSM 14
INDEX 13
E2CDA-NRI 12
SONIC 12
CBRIC 11
CRISP 10
TxACE 10
MuSyC 8
WIN 8
AMML 7
Benchmarking 6
CONIX 6
IMPACT 6
MIND 6
NEWLIMITS 6
TerraSwarm 6
CHIRP 5
ComSenTer 5
ADA 4
DEEP3M 4
E2CDA 3
SUPREME 3
ACE 2
CAPSL 2
CUBIC 2
NPT 2
NRI-Projects 2

Thrust/Theme
ESH – Environment Safety and Hea... 13
ASCENT-T1 – Vertical CMOS 11
ASCENT-T2 – Beyond CMOS 9
CRISP-T1 – Hardware Support for ... 8
AMML-T1 – Antiferromagnetic Magn... 7
AMS-CSD – Analog/Mixed-Signal Ci... 7
PKG – Packaging 7
CONIX-T1 – ARENA Integrator 6
CBRIC-T1 – Neuro-inspired Algori... 5
CBRIC-T2 – Neuromorphic Fabrics 5
HWS – Hardware Security 5
IMPACT-T1 – Materials for Scaled... 5
ISD – Integrated System Design 5
LMD – Logic and Memory Devices 5
LPD – Logic & Physical Design 5
NMP – Nanomanufacturing Material... 5
ADA-T1 – Deft Development 4
DEEP3M-T4 – Architectures 4
PAT – Patterning 4
SLD – System Level Design 4
ASCENT-T3 – Heterogeneous Integr... 3
CRISP-T3 – Scaling Applications ... 3
ComSenTer-T1 – Systems and Algor... 3
E2CDA2 – E2CDA 2.0 3
NEM – Nanoengineered Materials 3
NEWLIMITS-T2 – 2D Materials Devi... 3
ASCENT-T4 – Merged Logic Memory ... 2
CADT – Computer-Aided Design and... 2
CAPSL-T4 – Architectures and Sys... 2
CD – Circuit Design 2
ComSenTer-T2 – mm-wave/THz ICs a... 2
ComSenTer-T3 – Application-speci... 2
DEEP3M-T2 – Circuits 2
EP3C – Efficiency and Performanc... 2
FACSYS – Factory Systems 2
I3T – Innovative and Intelligent... 2
IMPACT-T2 – Materials for Storag... 2
NEWLIMITS-T1 – Novel Computing a... 2
NEWLIMITS-T3 – Advanced Manufact... 2
NEWLIMITS-T4 – Characterization ... 2
SCARF – Supply Chain AI Realized... 2
SMART-T1 – Spin-orbit Torque Mat... 2
TT – Test & Testability 2
VER – Verification 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADA-T2 – Algorithm-driven Archit... 1
ADA-T3 – Technology-driven Syste... 1
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CBRIC-T3 – Distributed Intellige... 1
CBRIC-T4 – Application Drivers 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T2 – Hardware/Software Pla... 1
CONIX-T3 – Security 1
CONIX-T4 – Machine Learning 1
CONIX-T5 – Communication Positio... 1
CONIX-T6 – Programming and Resou... 1
CRISP-T2 – System Support for Ma... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T4 – Center-wide Demon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T3 – Materials 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1

GRC Science Area
NMS – Nanomanufacturing Sciences 20
CADTS – Computer Aided Design & ... 16
ICSS – Integrated Circuit & Syst... 11
CSR – Cross-disciplinary Semicon... 10
IPS – Interconnect & Packaging S... 10
DS – Device Sciences 9
ES-H – Environmental Safety & He... 7
SRCEA – SRC Education Alliance 5
PKG – Packaging Sciences 4
MPS – Material & Process Science... 3
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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1: pdfProposers' Day Workshop
Proposers' Day Workshop Monday, January 23, 2017 @srcJUMP, #JUMPpdw . Please silence your phone. . Materials will be posted soon. Photography is not allowed. . We are recording the ...
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3: pdfTable
1 2 Table of Contents B. Executive Summary ...... 3 C. Description of ...
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4: pdfTable
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6: pdfGeneration Companies 2016 financial statements.pdf
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1 2 SRC Historical Highlights 1981 - Robert N. Noyce, SIA Chair, announced the creation of SRC in December 1982 - SRC offi cially formed; Eric Bloch, IBM, fi rst BOD chair; Larry ...
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11: JUMP Research Announcement - SRC
JUMP Research Announcement Program Objectives and Description Timetable and Deadlines "Vertical" Application-Focused Centers "Horizontal" Disciplinary-Focused Centers Research ...
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14: pdf2007 SRC Annual Report
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