Questions?
Content Type
Other 455
Events 278
Patent Filings 4

SRC Program
SRC 397
GRC 255
NRI 29
JUMP2 18
FCRP 14
SRCEA 10
JUMP 5
SRP 4
3D EC 3
Auto 3
STARnet 3
ICA 2
ERI 1
nCORE 1

Year
2024 21
2023 39
2022 49
2021 34
2020 18
2019 22
2018 32
2017 34
2016 31
2015 33
2014 26
2013 27
2012 41
2011 177
2010 143
2009 1
2008 1

Center
EBSM 16
INDEX 9
NRI-NSF 9
MSD 8
SWAN 8
TxACE 8
C2S2 7
FENA 7
CHIRP 6
E2CDA-NRI 6
GSRC 6
IFC 6
CNFD 5
FAME 4
LEAST 4
MIND 4
ASCENT 3
Benchmarking 3
CBRIC 3
MuSyC 3
WIN 3
C-FAR 2
C-SPIN 2
SONIC 2
SUPREME 2
TerraSwarm 2
ACE 1
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
CUBIC 1
IPC 1
NCRC 1
NPT 1
NRI-Projects 1
PRISM 1

Thrust/Theme
ESH – Environment Safety and Hea... 14
PKG – Packaging 10
HWS – Hardware Security 6
AMS-CSD – Analog/Mixed-Signal Ci... 5
LMD – Logic and Memory Devices 5
NMP – Nanomanufacturing Material... 5
CADT – Computer-Aided Design and... 4
SLD – System Level Design 4
CD – Circuit Design 3
I3T – Innovative and Intelligent... 3
ISD – Integrated System Design 3
LPD – Logic & Physical Design 3
NEM – Nanoengineered Materials 3
PAT – Patterning 3
TT – Test & Testability 3
VER – Verification 3
AIHW – Artificial Intelligence H... 2
ASCENT-T3 – Heterogeneous Integr... 2
FACSYS – Factory Systems 2
SCARF – Supply Chain AI Realized... 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADS – Alternative Device Structu... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CBRIC-T1 – Neuro-inspired Algori... 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
IRP – India Research Program 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PRISM-T1 – Systems and Software 1
PRISM-T2 – Architecture 1
PRISM-T3 – Devices and Circuits 1
PRISM-T4 – Grand Challenges 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1

GRC Science Area
NMS – Nanomanufacturing Sciences 27
CADTS – Computer Aided Design & ... 17
ICSS – Integrated Circuit & Syst... 12
IPS – Interconnect & Packaging S... 12
CSR – Cross-disciplinary Semicon... 9
DS – Device Sciences 8
ES-H – Environmental Safety & He... 8
SRCEA – SRC Education Alliance 7
PKG – Packaging Sciences 5
MPS – Material & Process Science... 4
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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241: pdfDesign Forum: Bill Read Position Statement
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242: pdfThe GRC division of SRC focuses on research in a timeframe 5...
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243: pdfThe GRC division of SRC focuses on research in a timeframe 5...
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244: pdfResearch Needs for Compact Modeling
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245: pdfDecadal Plan Overview
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246: Call for White Papers in Emerging Technologies in Materials,...
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248: NST - SRC
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252: pdfESH Needs Document - June 2018
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253: S201005 - Packaging Solicitation - SRC
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254: pdfP
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255: pdf2011 Systems Design Needs
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256: pdf2002-2007 ICSS Research Needs Document
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257: pdfDSMS Research Needs
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258: pdf2006 SRC ICSS Research Needs Document for Circuit Design
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259: pdfDSMS Research Needs
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260: 2015 Summer Study - Bio - John Hanks - SRC
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262: Call for White Papers in Modeling & Simulation 2011 - SRC
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263: In the News - SRC
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266: SRC: Program Announcement: Packaging and Interconnect Systems...
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268: pdfスライド 1
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269: Broadening Participation - SRC
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241 through 270 of 737 similar documents, best matches first.   
<< previous Page: 5 6 7 8 9 10 11 12 13 14 next >>