Questions?
[x] GRC Science Area
CADTS – Computer Aided Design & Test Sciences

Content Type
Events 44
Other 1
Patent Filings 1

SRC Program
SRC 26
GRC 20
FCRP 6
3D EC 5

Year
2015 1
2013 4
2012 4
2011 24
2010 11

Center
GSRC 19
C2S2 18
FENA 18
IFC 18
MSD 18
MuSyC 12
TxACE 6
C-FAR 5
CNFD 5
EBSM 5
FAME 5
INDEX 5
LEAST 5
SONIC 5
SWAN 5
TerraSwarm 5
NPT 4
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
LPD – Logic & Physical Design 3
AMS-CSD – Analog/Mixed-Signal Ci... 2
CADT – Computer-Aided Design and... 2
CD – Circuit Design 2
HWS – Hardware Security 2
ISD – Integrated System Design 2
SLD – System Level Design 2
TT – Test & Testability 2
VER – Verification 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PKG – Packaging 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

1 through 30 of 46 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 next >>
1: pdfFinal Report - Workshop on Failure and Uncertainty in Mixed-Signal...
National Science Foundation Workshop on Failure and Uncertainty in Mixed-Signal Circuits and Systems Arlington, Virginia July 8-9, 2010 Principal Investigators: Ralph Cavin, ...
URL: https://www.src.org/calendar/e004025/final-report.pdf
Modified: 2011-06-01 - 914KB
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2: pdfPresentation Title
PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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3: pdfDesign Forum: David Kung Position Statement
Future of Design Automation To determine the future direction of Design Automation, we need to take a careful look at the trends in design (systems and circuits) and technology. On ...
URL: https://www.src.org/...764/david-kung-position-statement.pdf
Modified: 2011-08-02 - 33KB
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4: 3D IC University Research e-Workshop (Event E004357) - SRC
3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB
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5: Semiconductor Research Corporation - SRC
GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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6: pdfSRC/NSF Design Forum - Position Statement
A Position Statement in the Forum on Future Directions for Design Automation Research Jason Cong UCLA Computer Science Department http://cadlab.cs.ucla.edu/~cong There are many ...
URL: https://www.src.org/...764/jason-cong-position-statement.pdf
Modified: 2011-08-02 - 35KB
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7: TECHCON 2011 (Event E004113) - SRC
TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
URL: https://www.src.org/calendar/e004113/
Modified: 2012-03-13 - 97KB
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8: pdfDesign Forum: Hugo De Man Position Statement
Some (possibly controversial) thoughts H. De Man, Em. Prof. K.U.Leuven, Senior Fellow IMEC, deman@imec.be The right questions are formulated. One could start suggestions for ...
URL: https://www.src.org/...764/hugo-deman-position-statement.pdf
Modified: 2011-08-02 - 36KB
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9: TECHCON 2013 (Event E004683) - SRC
TECHCON 2013 Date: Monday, Sept. 9, 2013, 8 a.m. - Tuesday, Sept. 10, 2013, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004683 E004683 image ...
URL: https://www.src.org/calendar/e004683/
Modified: 2014-03-10 - 136KB
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10: TECHCON 2012 (Event E004114) - SRC
TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB
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11: pdf3D IMAPS
Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB
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12: TECHCON 2010 Best in Session Awards - SRC
TECHCON 2010 Best in Session Awards Seventeen students received Best in Session Awards at TECHCON 2010, presented by Dr. Michael Mayberry, Intel, SRC Board of Directors Member ...
URL: https://www.src.org/calendar/e003428/best-in-session/
Modified: 2010-09-29 - 26KB
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13: pdfSRC/NSF Design Forum - Position Statement
Thoughts on the "Future Directions of Design Automation Research" Andreas Kuehlmann, Cadence Berkeley Labs October 24, 2006 Some of the main challenges we will face in the next ...
URL: https://www.src.org/...reas-kuehlmann-position-statement.pdf
Modified: 2011-08-02 - 69KB
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14: pdfSRC/NSF Design Forum - Position Statement
SRC/NSF Workshop on Future Directions for Design Automation Research Comments by David Yeh, Texas Instruments, currently an assignee at SRC I approached this from two perspectives. ...
URL: https://www.src.org/...2764/david-yeh-position-statement.pdf
Modified: 2011-08-02 - 12KB
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15: pdfPowerPoint Presentation
RTI International High Performance Processing Systems Enabled by 3D Integration Bob Conn May 5, 2011 1 Bob Conn, RTI International, rconn@rti.org, bobconn@ieee.org RTI ...
URL: https://www.src.org/calendar/e004357/03-conn.pdf
Modified: 2011-05-04 - 1.1MB
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16: 2013 GRC SACC and TAB Chair Recognition - SRC
2013 GRC SACC and TAB Chair Recognition TAB and SACC Chairs at TECHCON 2013 Technical Advisory Boards (TABs) and Science Area Coordinating Committees (SACCs) work together with the ...
URL: https://www.src.org/calendar/e004683/tab-chair/
Modified: 2011-09-16 - 21KB
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17: pdfSRC: GRC Design Forum Postion Statement - Jeff Parkhurst,Intel
Future Design Environment Complexity in 2017: - Designs will contain over 200B transistors. - Design teams will remain constant size o CAD must bridge the productivity GAP - ...
URL: https://www.src.org/...2764/parkhurst-position-statement.pdf
Modified: 2011-08-02 - 16KB
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18: 2010 SACC and TAB Chair Recognition - SRC
2010 SACC and TAB Chair Recognition Steve Hillenius (l), SRC GRC Executive Director, presented the 2010 SACC and TAB Chair Awards to 19 industry representatives including Darvin ...
URL: https://www.src.org/calendar/e003428/tab-chair-awards/
Modified: 2010-09-28 - 22KB
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19: pdfE003932 - Variability Forum - Torres
Variability, Friend or Foe?: An EDA Foe?: An EDA perspective J. Andres Torres LFD Product Lead Engineer Calibre Design to Silicon Division Calibre Design to Silicon Division April ...
URL: https://www.src.org/calendar/e003932/e003932_s3_2_torres.pdf
Modified: 2010-06-29 - 387KB
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20: pdfSRC/NSF Design Forum - Position Statement
NSF/SRC Forum on Future Directions for Design Automation Research Top Three Challenges for Electronic Design Automation Sachin Sapatnekar, University of Minnesota As system ...
URL: https://www.src.org/...hin-sapatnekar-position-statement.pdf
Modified: 2011-08-02 - 15KB
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21: TECHCON 2010: Poster / Demonstration Instructions - SRC
TECHCON 2010: Technology and Talent for the 21st Century Poster Instructions All paper presenters are expected to present a poster. Failure to present a poster will adversely ...
URL: https://www.src.org/calendar/e003428/poster-instructions/
Modified: 2010-06-21 - 26KB
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22: TECHCON 2012 - Author's Kit: Poster-Instructions - SRC
TECHCON 2012 - Poster/Demonstration Instructions All paper presenters are expected to present a poster. Failure to present a poster will adversely affect the judging of your ...
URL: https://www.src.org/...4114/authors-kit/poster-instructions/
Modified: 2012-05-10 - 24KB
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23: Poster Instructions - TECHCON 2011 Author's Kit - SRC
TECHCON 2011 Poster/Demonstration Instructions All paper presenters are expected to present a poster. Failure to present a poster will adversely affect the judging of your ...
URL: https://www.src.org/calendar/e004113/poster-instructions/
Modified: 2011-04-15 - 24KB
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24: TECHCON 2013 Authors Kit: Preparing the Oral Presentation - SRC
TECHCON 2012 TECHCON 2013 Author's Kit: Preparing the Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals ...
URL: https://www.src.org/calendar/e004683/preparing-presentation/
Modified: 2013-04-24 - 24KB
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25: TECHCON 2013 Authors Kit: Poster Instructions - SRC
TECHCON 2012 TECHCON 2013 Author's Kit: Poster Instructions All paper presenters are expected to present a poster. Failure to present a poster will adversely affect the judging of ...
URL: https://www.src.org/calendar/e004683/poster-instructions/
Modified: 2013-04-24 - 24KB
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26: TECHCON 2010: Preparing the Oral Presentation - SRC
TECHCON 2010: Technology and Talent for the 21st Century Preparing the Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they ...
URL: https://www.src.org/...ar/e003428/presentation-instructions/
Modified: 2010-06-21 - 25KB
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27: TECHCON 2012 - Author's Kit: Preparing Oral Presentation - SRC
TECHCON 2012: Preparing the Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals that are readable from all ...
URL: https://www.src.org/...4/authors-kit/preparing-presentation/
Modified: 2012-05-10 - 24KB
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28: Preparing Your Oral Presentation - TECHCON 2011 Author's Kit...
TECHCON 2011 Author's Kit Preparing The Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals that are readable ...
URL: https://www.src.org/calendar/e004113/preparing-presentation/
Modified: 2011-04-15 - 24KB
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29: pdfE003932 - Variability Forum - Gupta
NanoCAD Lab Modeling Performance Impact of Variability Puneet Gupta Dept. of EE, University of California Los Angeles (puneet@ee.ucla.edu) Work partly supported by NSF, UC ...
URL: https://www.src.org/calendar/e003932/e003932_s2_2_gupta.pdf
Modified: 2010-06-29 - 1.4MB
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30: On-Chip Radio Frequency (RF) Interconnects for Network-On-Chip...
On-Chip Radio Frequency (RF) Interconnects for Network-On-Chip Designs Application Type: Utility Patent Number: 8270316 Country: United States Status: Filed on 30-Jan-2009, Issued ...
URL: https://www.src.org/library/patent/p1123/
Modified: 2012-09-18 - 23KB
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1 through 30 of 46 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 next >>