New memory technologies integrated into the back-end-of-line and methods of engineering and controlling heat transport are required to break through the memory bottleneck to meet the demands of data intensive computation in addition to new approaches for neuromorphic computing and computation-in-memory. Embedded non-volatile memory strategies such as thermally-engineered phase-change memory (PCM), multi-state ferroelectric memory, and ionic electrochemical RAM each have significant strengths that lend themselves to high-density non-volatile memory for data-abundant computing. Addressing challenges associated with fast read and write times, endurance, logic compatible programming and erase voltages are key components to the memory Theme in IMPACT. Furthermore, these technologies can address requirements in parallelism for efficient matrix-vector multiplication and analog weight cells providing efficient future solutions for computation-ally expensive learning in neuro-inspired architectures. Example issues we will address include obtaining linear symmetric weight updates over a large dynamic range from identical pulse inputs and preventing resistance drift from elemental phase segregation. These same memories can also enable unique new designs in interconnects, illustrating the need for a center setting. Thermal management for BEOL memory and logic integration strategies is a critical challenge as well, and IMPACT will address this with a novel nanoparticle/ALD hybrid approach. Utilizing AlN and diamond nano- and microparticles (the best electrically insulating thermal conductors) coupled with ALD of AlN for infill, we plan to demonstrate excellent heat spreaders with a sub-350°C fabrication temperature, providing a BEOL solution to thermal manage-ment comparable in performance to bulk high-temperature fabricated materials. These heat spreader solutions will also impact RF applications naturally leading to more cross-theme collaborations.
Current5 Research Tasks3 Universities9 Students5 Faculty Researchers63 Liaison Personnel
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