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- 241:
Sample Website User Agreement - SRC
- Sample Website User Agreement Website User Agreement Citizenship and Country of Residence The issues related to verifying citizenship and country of residence to allow access to ...
URL: https://www.src.org/app/account/guide/sample-agreement/
Modified: 2011-01-25 - 31KB
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- 242:
 SRC: GRC Design Forum Postion Statement - Jeff Parkhurst,Intel
- Future Design Environment Complexity in 2017: - Designs will contain over 200B transistors. - Design teams will remain constant size o CAD must bridge the productivity GAP - ...
URL: https://www.src.org/...2764/parkhurst-position-statement.pdf
Modified: 2011-08-02 - 16KB
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- 243:
Microsoft Word - Pkg Needs 2005.doc
- Page 1 of 4 2005 Packaging Thrust Strategic Needs The following sections describe some specific needs within the current Packaging sub-thrusts. Overall Issues The ITRS identifies ...
URL: https://www.src.org/...ips/research-needs/2005/packaging.pdf
Modified: 2011-02-03 - 82KB
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- 244:
BEP Research Needs Statement
- IPS - Interface: Processing Needs Document Introduction The Interconnect Packaging Sciences has identified the interface between Back End Processing and Packaging as a critical ...
URL: https://www.src.org/...ips/research-needs/2011/interface.pdf
Modified: 2011-03-22 - 75KB
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- 245:
Microsoft Word - Interface Research Needs.doc
- Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law ...
URL: https://www.src.org/...ips/research-needs/2007/interface.pdf
Modified: 2011-02-03 - 25KB
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- 246:
S200807_research_needs_INT.doc
- Research in Support of the Die / Package Interface Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law and the ITRS roadmap, ...
URL: https://www.src.org/...ips/research-needs/2008/interface.pdf
Modified: 2011-02-03 - 29KB
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- 247:
2009 Summer Study: Co-Design of Future Architectures with 3D...
- IBM Research Co-Design of Future Architectures with 3D Integration Michael Rosenfield Di t VLSI S t Director, VLSI Systems IBM Research Division Yorktown Heights, NY 6 30 09 ...
URL: https://www.src.org/...9s-study-siii-codesign-rosenfield.pdf
Modified: 2011-06-17 - 1.5MB
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- 248:
Biography for Gamal Refai-Ahmed - AMD - SRC
- GAMAL REFAI-AHMED obtained the M. A. SC. and Ph. D. degrees in Mechanical Engineering from the University of Waterloo, Canada. His research area of specialization is in the thermal ...
URL: https://www.src.org/calendar/e003506/refai-bio/
Modified: 2011-06-17 - 21KB
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- 249:
SRC GRC: Nano-Morphic Forum- P1 Timp
- Alek Alek Aksimentiev Aksimentiev, R. Cirelli, J. Comer, V. Dimitrov, B. Dorvel, F. Klemens ‡ , A. Kornblit ‡ , J.P. J.P. Leburton Leburton , , W. Mansfield ‡ , P. P. ...
URL: https://www.src.org/calendar/e003062/timp.pdf
Modified: 2011-08-02 - 3.0MB
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- 250:
Poster Instructions - TECHCON 2011 Author's Kit - SRC
- TECHCON 2011 Poster/Demonstration Instructions All paper presenters are expected to present a poster. Failure to present a poster will adversely affect the judging of your ...
URL: https://www.src.org/calendar/e004113/poster-instructions/
Modified: 2011-04-15 - 24KB
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- 251:
SRC GRC: Nano-Morphic Forum - P4 Zhirnov
- "Minimizing" the Effects of Physical Limits Victor Zhirnov Semiconductor Research Corporation Stanford University, November 8 & 9, 2007 CMOS scaling on track to obtain physical ...
URL: https://www.src.org/calendar/e003062/zhirnov.pdf
Modified: 2011-08-02 - 351KB
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- 252:
Design Forum: Sharad Malik Panel Position Statement
- Making our Way through the End-of-the Roadmap Maze Panel Position Statement Sharad Malik Princeton University As we look forward over the next 10-15 years, there are several ...
URL: https://www.src.org/...4/sharad-malik-position-statement.pdf
Modified: 2011-08-02 - 20KB
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- 253:
3D IMAPS
- Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB
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- 254:
No Slide Title
- Taller vs. Smaller: 3D Development & Moore's Law F. M. Schellenberg, Ph.D. Design-to-Silicon Division Mentor Graphics GRC ETAB Summer Study La Quinta, CA June 30, 2009 Mentor ...
URL: https://www.src.org/...-siii-tallervsmaller-schellenberg.pdf
Modified: 2011-06-17 - 843KB
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- 255:
Massive Data Computing in a Connected World
- Massive Data Computing Massive Data Computing In a Connected World 2009 GRC ETAB Summer Study, June 29 2009 Pradeep K. Dubey IEEE Fellow and Director of Throughput Computing Intel ...
URL: https://www.src.org/calendar/e003506/05-sessionii-dubey.pdf
Modified: 2011-06-17 - 1.2MB
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- 256:
VIA-2020 Forum - Panel 3 - Moore
- The Role of Accelerated Computing in the Multi-Core Era Chuck Moore Senior Fellow Advanced Micro Devices May 17, 2006 The Role of Accelerated Computing in the Multi-core Era 2 7/...
URL: https://www.src.org/calendar/e003362/p3-moore.pdf
Modified: 2011-04-18 - 511KB
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- 257:
VIA-2020 Forum - Panel 4 Presentation - Cavin
- Computation vis-à-vis Physics: A Framework VIA 2020 Forum, July 10 & 11, 2008 Ralph K. Cavin, III, Victor V. Zhirnov & Sadasivan Shankar (Intel) 2 Outline Relations between ...
URL: https://www.src.org/...dar/e003362/p4-presentation-cavin.pdf
Modified: 2011-04-18 - 553KB
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