Questions?
Content Type
Other 606
Events 380
Patent Filings 359

SRC Program
SRC 543
GRC 314
FCRP 197
NRI 105
STARnet 68
JUMP 55
JUMP2 28
nCORE 28
SRCEA 12
SRP 6
ERI 5
3D EC 3
Auto 3
ICA 1
Undergrad 1

Year
2024 20
2023 51
2022 67
2021 62
2020 27
2019 29
2018 45
2017 56
2016 42
2015 26
2014 52
2013 38
2012 59
2011 194
2010 208
2009 1
2008 1

Center
IFC 85
C2S2 45
FENA 43
C-SPIN 40
GSRC 38
MSD 31
ASCENT 25
SWAN 24
CNFD 21
FAME 21
INDEX 18
NRI-NSF 18
LEAST 16
EBSM 13
CRISP 12
E2CDA-NRI 12
TxACE 12
CBRIC 11
WIN 10
MuSyC 9
MIND 8
TerraSwarm 8
AMML 7
C-FAR 7
NEWLIMITS 7
Benchmarking 6
CONIX 6
IMPACT 6
SONIC 6
CHIRP 5
ComSenTer 5
ACE4S 4
ADA 4
CEMPI 4
DEEP3M 4
E2CDA 3
NRI-Projects 3
SUPREME 3
ACE 2
CAIST 2

Thrust/Theme
ASCENT-T1 – Vertical CMOS 13
ESH – Environment Safety and Hea... 12
CRISP-T1 – Hardware Support for ... 10
NMP – Nanomanufacturing Material... 10
AMS-CSD – Analog/Mixed-Signal Ci... 9
ASCENT-T2 – Beyond CMOS 9
PKG – Packaging 9
Factory Systems 8
AMML-T1 – Antiferromagnetic Magn... 7
LMD – Logic and Memory Devices 7
SLD – System Level Design 7
CONIX-T1 – ARENA Integrator 6
Advanced Devices & Technologies 5
CBRIC-T1 – Neuro-inspired Algori... 5
CBRIC-T2 – Neuromorphic Fabrics 5
CD – Circuit Design 5
HWS – Hardware Security 5
I3T – Innovative and Intelligent... 5
IMPACT-T1 – Materials for Scaled... 5
ISD – Integrated System Design 5
LPD – Logic & Physical Design 5
PAT – Patterning 5
ADA-T1 – Deft Development 4
BEP – Back End Processes 4
DEEP3M-T4 – Architectures 4
NEM – Nanoengineered Materials 4
NEWLIMITS-T2 – 2D Materials Devi... 4
ASCENT-T3 – Heterogeneous Integr... 3
CRISP-T3 – Scaling Applications ... 3
ComSenTer-T1 – Systems and Algor... 3
E2CDA2 – E2CDA 2.0 3
NEWLIMITS-T1 – Novel Computing a... 3
NEWLIMITS-T3 – Advanced Manufact... 3
NEWLIMITS-T4 – Characterization ... 3
ASCENT-T4 – Merged Logic Memory ... 2
CADT – Computer-Aided Design and... 2
CAPSL-T4 – Architectures and Sys... 2
ComSenTer-T2 – mm-wave/THz ICs a... 2
ComSenTer-T3 – Application-speci... 2
DEEP3M-T2 – Circuits 2
DesTech – Design Techniques 2
EP3C – Efficiency and Performanc... 2
FACSYS – Factory Systems 2
IMPACT-T2 – Materials for Storag... 2
Materials 2
Modeling & Simulation 2
NEWLIMITS-T5 – Simulations and M... 2
SCARF – Supply Chain AI Realized... 2
SMART-T1 – Spin-orbit Torque Mat... 2
TT – Test & Testability 2
TechCAD – Technology CAD 2
VER – Verification 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADA-T2 – Algorithm-driven Archit... 1
ADA-T3 – Technology-driven Syste... 1
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Technology Option 1
Analysis Design & Simulation 1
Back End Processes 1
C&S – Controls and Sensing 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CBRIC-T3 – Distributed Intellige... 1
CBRIC-T4 – Application Drivers 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T2 – Hardware/Software Pla... 1
CONIX-T3 – Security 1
CONIX-T4 – Machine Learning 1
CONIX-T5 – Communication Positio... 1
CONIX-T6 – Programming and Resou... 1
CRISP-T2 – System Support for Ma... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T4 – Center-wide Demon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T3 – Materials 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1

GRC Science Area
CADTS – Computer Aided Design & ... 35
NMS – Nanomanufacturing Sciences 35
ICSS – Integrated Circuit & Syst... 24
IPS – Interconnect & Packaging S... 22
CSR – Cross-disciplinary Semicon... 18
DS – Device Sciences 17
MPS – Material & Process Science... 11
SRCEA – SRC Education Alliance 8
ES-H – Environmental Safety & He... 7
MBP – Materials & Bulk Processes... 6
NIS – Nanostructure & Integratio... 6
PID – Process Integration & Devi... 6
PKG – Packaging Sciences 5
MIC – Microstructure Sciences 4
DES – Design Sciences 3
INT – Interconnect Sciences 2
FAC – Factory Sciences 1
GEN – General 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MSS – Manufacturing Systems Scie... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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271: pdfGoal + Message Content
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274: Call for Research: Interconnect and Packaging Sciences Program...
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278: pdfNMS Research Needs Document, Version 1
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287: pdf2nd SRC Bioelectronics Roundtable
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291: pdfSRC CONNECTIONS February 23
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