Questions?
[x] GRC Science Area
ICSS – Integrated Circuit & Systems Sciences

Content Type
Patent Filings 92
Events 54
Other 1

SRC Program
GRC 121
SRC 26
FCRP 7
3D EC 6

Year
2015 3
2012 10
2011 37
2010 4

Center
GSRC 27
C2S2 26
FENA 26
IFC 26
MSD 26
MuSyC 26
TxACE 23
ACE4S 22
EBSM 10
NPT 9
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
CD – Circuit Design 63
SLD – System Level Design 27
ISD – Integrated System Design 25
I3T – Innovative and Intelligent... 21
AMS-CSD – Analog/Mixed-Signal Ci... 9
TT – Test & Testability 8
HWS – Hardware Security 5
CADT – Computer-Aided Design and... 4
LPD – Logic & Physical Design 4
VER – Verification 4
DesSyn – Design Synthesis 2
DesTech – Design Techniques 2
PKG – Packaging 2
Physical Design 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

1 through 30 of 147 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 next >>
1: pdfSlide 1
Third Annual India Design Review January 7-8, 2015 William H. Joyner, Jr. CADTS William.Joyner@src.org David C. Yeh ICSS David.Yeh@src.org Restricted Distribution: Contains SRC ...
URL: https://www.src.org/...r/e005563/2015_indiawelcome_final.pdf
Modified: 2015-02-04 - 319KB
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2: pdfFinal Report - Workshop on Failure and Uncertainty in Mixed-Signal...
National Science Foundation Workshop on Failure and Uncertainty in Mixed-Signal Circuits and Systems Arlington, Virginia July 8-9, 2010 Principal Investigators: Ralph Cavin, ...
URL: https://www.src.org/calendar/e004025/final-report.pdf
Modified: 2011-06-01 - 914KB
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3: Semiconductor Research Corporation - SRC
GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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4: TECHCON 2011 (Event E004113) - SRC
TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
URL: https://www.src.org/calendar/e004113/
Modified: 2012-03-13 - 97KB
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5: 3D IC University Research e-Workshop (Event E004357) - SRC
3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB
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6: pdfSRC: GRC Design Forum Postion Statement - Jeff Parkhurst,Intel
Future Design Environment Complexity in 2017: - Designs will contain over 200B transistors. - Design teams will remain constant size o CAD must bridge the productivity GAP - ...
URL: https://www.src.org/...2764/parkhurst-position-statement.pdf
Modified: 2011-08-02 - 16KB
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7: TECHCON 2012 (Event E004114) - SRC
TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB
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8: pdfSRC/NSF Design Forum - Position Statement
A Position Statement in the Forum on Future Directions for Design Automation Research Jason Cong UCLA Computer Science Department http://cadlab.cs.ucla.edu/~cong There are many ...
URL: https://www.src.org/...764/jason-cong-position-statement.pdf
Modified: 2011-08-02 - 35KB
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9: pdfDesign Forum: Hugo De Man Position Statement
Some (possibly controversial) thoughts H. De Man, Em. Prof. K.U.Leuven, Senior Fellow IMEC, deman@imec.be The right questions are formulated. One could start suggestions for ...
URL: https://www.src.org/...764/hugo-deman-position-statement.pdf
Modified: 2011-08-02 - 36KB
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10: pdf3D IMAPS
Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB
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11: pdfPresentation Title
PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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12: pdfSRC/NSF Design Forum - Position Statement
Thoughts on the "Future Directions of Design Automation Research" Andreas Kuehlmann, Cadence Berkeley Labs October 24, 2006 Some of the main challenges we will face in the next ...
URL: https://www.src.org/...reas-kuehlmann-position-statement.pdf
Modified: 2011-08-02 - 69KB
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13: pdfSRC/NSF Design Forum - Position Statement
A Forum on Future Directions for Design Automation Research Juan C. Rey Senior Director Of Engineering Design to Silicon Division Mentor Graphics Corporation October, 2006 10:30 ...
URL: https://www.src.org/...02764/juan-rey-position-statement.pdf
Modified: 2011-08-02 - 13KB
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14: pdfSRC/NSF Design Forum - Position Statement
ATT4457633.txt Views on Important Direction in Design Automation J. White Professor, Department of Electrical Engineering and Computer Science Massachusetts Institute of Technology ...
URL: https://www.src.org/...64/jacob-white-position-statement.pdf
Modified: 2011-08-02 - 21KB
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15: India Design Review (Event E005563) - SRC
India Design Review Date: Wednesday, Jan. 7, 2015, 6 p.m. - Thursday, Jan. 8, 2015, 5 p.m. Local Location: Hyatt Bangalore, 1/1, Swami Vivekananda Road, Off M.G. Road, Ulsoor, ...
URL: https://www.src.org/calendar/e005563/
Modified: 2015-02-04 - 82KB
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16: pdfSRC/NSF Design Forum - Professor Arvind
Future Directions in Design Automation Arvind, CSAIL , MIT Will there be a greater or smaller variety of electronic chips a decade from now? There is a dramatic decrease in the ...
URL: https://www.src.org/...64/prof-arvind-position-statement.pdf
Modified: 2011-08-02 - 9KB
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17: pdfSRC/NSF Design Forum - Posiltion Statement
Future Directions for Design Automation Research Tim Cheng, UCSB In my opinion, the following are three key challenges for future design automation research. Silicon Debugging: The ...
URL: https://www.src.org/...2764/tim-cheng-position-statement.pdf
Modified: 2011-08-02 - 14KB
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18: pdfSRC/NSF Design Forum - Position Statement
NSF/SRC Forum on Future Directions for Design Automation Research Top Three Challenges for Electronic Design Automation Sachin Sapatnekar, University of Minnesota As system ...
URL: https://www.src.org/...hin-sapatnekar-position-statement.pdf
Modified: 2011-08-02 - 15KB
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19: pdfSRC/NSF Design Forum - Position Statement
SRC/NSF Workshop on Future Directions for Design Automation Research Comments by David Yeh, Texas Instruments, currently an assignee at SRC I approached this from two perspectives. ...
URL: https://www.src.org/...2764/david-yeh-position-statement.pdf
Modified: 2011-08-02 - 12KB
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20: pdfSRC/NSF Design Forum - Position Statement
© R.A. Rutenbar 2006 NSF Forum on Future Directions for Design Automation Research Increased Diversity: Position Statement NSF Forum on Future Directions for Design Automation ...
URL: https://www.src.org/...4/rob-rutenbar-position-statement.pdf
Modified: 2011-08-02 - 99KB
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21: pdfDescription
Call for Abstracts Call for abstracts opens Monday, January 16, 2012. Deadline for submission is 3:00 p.m. eastern time on Wednesday, February 22, 2012. Description TECHCON is ...
URL: https://www.src.org/calendar/e004114/call-for-abstracts.pdf
Modified: 2012-01-26 - 27KB
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22: pdfDesign Forum: Bill Read Position Statement
Freescale(tm) and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale ...
URL: https://www.src.org/...2764/bill-read-position-statement.pdf
Modified: 2011-08-02 - 57KB
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23: pdfTECHCON 2011 Judges and Chairs
Monday, September 12, 2011 Session 1: Test and Testability Session 2 Analog, Mixed-Signal and RF Circuit Design Session 3 Graphene Session 4a Dielectric Material Robustness 8:00 ...
URL: https://www.src.org/calendar/e004113/judge-chair-list.pdf
Modified: 2011-09-08 - 78KB
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24: Low-Power, P-Channel Enhancement-Type Metal-Oxide Semiconductor...
Low-Power, P-Channel Enhancement-Type Metal-Oxide Semiconductor Field-Effect Transistor (PMOSFET) SRAM Cells Application Type: Utility Patent Number: 7286389 Country: United States ...
URL: https://www.src.org/library/patent/p0579/
Modified: 2007-10-23 - 24KB
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25: Inhibiting Address Transitions in Unselected Memory Banks of...
Inhibiting Address Transitions in Unselected Memory Banks of Solid State Memory Circuits Application Type: Utility Patent Number: 8787086 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1168/
Modified: 2014-07-22 - 25KB
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26: Sram Cell with Intrinsically High Stability and Low Leakage ...
Sram Cell with Intrinsically High Stability and Low Leakage Application Type: Utility Patent Number: 7920409 Country: United States Status: Filed on 5-Jun-2007, Issued on ...
URL: https://www.src.org/library/patent/p1015/
Modified: 2011-04-05 - 24KB
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27: ICSS Science Area Coordinating Committee Business Meeting (Event...
ICSS Science Area Coordinating Committee Business Meeting Date: Monday, Feb. 20, 2012, 4 p.m.-6 p.m. PT Location: Pacific A Room , San Francisco Marriott, 55 Fourth Street, San ...
URL: https://www.src.org/calendar/e004699/
Modified: 2012-08-20 - 24KB
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28: pdfDesign Forum: John Hayes Position Statement
Future Directions for Design Automation: Three Challenges John P. Hayes October 1, 2006 1. Complexity and Change With CMOS transistor size approaching the nanometer range, two ...
URL: https://www.src.org/...764/john-hayes-position-statement.pdf
Modified: 2011-08-02 - 26KB
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29: Posters: Undergraduate Research Opportunities (URO) - SRC
TECHCON 2011 TECHCON 2011 Posters - Undergraduate Research Opportunities Room: RioGrande A Back to Session Listing URO Posters Poster Number Presentation Time Title Presenter & ...
URL: https://www.src.org/calendar/e004113/uro-posters/
Modified: 2011-06-30 - 27KB
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30: pdfPowerPoint Presentation
RTI International High Performance Processing Systems Enabled by 3D Integration Bob Conn May 5, 2011 1 Bob Conn, RTI International, rconn@rti.org, bobconn@ieee.org RTI ...
URL: https://www.src.org/calendar/e004357/03-conn.pdf
Modified: 2011-05-04 - 1.1MB
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1 through 30 of 147 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 next >>