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GRC Science Area
IPS – Interconnect & Packaging Sciences
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1 through 26 of
26 similar documents, best matches first. |
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- 1:
3DASSM
- Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB Find Similar Documents
- 2:
Semiconductor Research Corporation - SRC
- GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB Find Similar Documents
- 3:
Overview of Research
- Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB Find Similar Documents
- 4:
3D IC University Research e-Workshop (Event E004357) - SRC
- 3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB Find Similar Documents
- 5:
Polyelectrolyte Nanolayers as Diffusion Barriers In Semiconductor...
- Polyelectrolyte Nanolayers as Diffusion Barriers In Semiconductor Devices Application Type: Utility Patent Number: 7081674 Country: United States Status: Filed on 11-Jun-2004, ...
URL: https://www.src.org/library/patent/p0466/
Modified: 2006-07-25 - 22KB Find Similar Documents
- 6:
Emerging Interconnect Solutions Workshop - Part 1 (Event E004837...
- Emerging Interconnect Solutions Workshop - Part 1 Date: Monday, June 11, 2012, 2 p.m.-3:30 p.m. ET Location: via web conference, Research Triangle Park, NC, United States Event ID: ...
URL: https://www.src.org/calendar/e004837/
Modified: 2012-12-11 - 28KB Find Similar Documents
- 7:
Surface Modifcation of CVD Polymer Films (Patent P0591) - SRC
- Surface Modifcation of CVD Polymer Films Application Type: Utility Patent Number: 7501154 Country: United States Status: Filed on 18-Feb-2005, Issued on 10-Mar-2009 Organization: ...
URL: https://www.src.org/library/patent/p0591/
Modified: 2009-03-10 - 22KB Find Similar Documents
- 8:
Growth of Inorganic Thin Films using Self-Assembled Monolayers...
- Growth of Inorganic Thin Films using Self-Assembled Monolayers as Nucleation Sites Application Type: Utility Patent Number: 7829150 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1139/
Modified: 2010-11-09 - 22KB Find Similar Documents
- 9:
Self-Assembled Sub-Nanolayers as Interfacial Adhesion Enhancers...
- Self-Assembled Sub-Nanolayers as Interfacial Adhesion Enhancers and Diffusion Barriers Application Type: Utility Patent Number: 7026716 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0415/
Modified: 2006-04-11 - 22KB Find Similar Documents
- 10:
Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition...
- Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition Copper Application Type: Utility Patent Number: 7808106 Country: United States Status: Filed on 9-May-2008, ...
URL: https://www.src.org/library/patent/p1076/
Modified: 2010-10-05 - 22KB Find Similar Documents
- 11:
Presentation Title
- PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB Find Similar Documents
- 12:
Mixed-signal Substrate with Integrated Through-Substrate Vias...
- Mixed-signal Substrate with Integrated Through-Substrate Vias Application Type: Utility Patent Number: 10330874 Country: United States Status: Filed on 2-Feb-2017, Issued on ...
URL: https://www.src.org/library/patent/p1675/
Modified: 2019-06-25 - 23KB Find Similar Documents
- 13:
Wafer Fabrication Monitoring/Control System and Method (Patent...
- Wafer Fabrication Monitoring/Control System and Method Application Type: Utility Patent Number: 9366601 Country: United States Status: Filed on 15-Mar-2012, Issued on 14-Jun-2016 ...
URL: https://www.src.org/library/patent/p1332/
Modified: 2016-06-14 - 23KB Find Similar Documents
- 14:
Multilevel Reservoirs for Integrated Circuit Interconnects (Patent...
- Multilevel Reservoirs for Integrated Circuit Interconnects Application Type: Utility Patent Number: 8278758 Country: United States Status: Filed on 29-Apr-2009, Issued on ...
URL: https://www.src.org/library/patent/p1141/
Modified: 2012-10-02 - 22KB Find Similar Documents
- 15:
Synthesis and Characterization of First Row Transition Metal...
- Synthesis and Characterization of First Row Transition Metal Complexes Containing a-Imino Alkoxide as Precursors for Deposition of Metal Films Application Type: Utility Patent ...
URL: https://www.src.org/library/patent/p1373/
Modified: 2017-09-12 - 22KB Find Similar Documents
- 16:
Low Temperature Metal Etching and Patterning (Patent P1290) ...
- Low Temperature Metal Etching and Patterning Application Type: Utility Patent Number: 8679359 Country: United States Status: Filed on 10-May-2011, Issued on 25-Mar-2014 ...
URL: https://www.src.org/library/patent/p1290/
Modified: 2014-03-25 - 23KB Find Similar Documents
- 17:
Synthesis and Characterization of First Row Transition Metal...
- Synthesis and Characterization of First Row Transition Metal Complexes Containing Alpha-Keto Hydrazonate Ligands as Potential Precursors for Use in Metal Film Deposition ...
URL: https://www.src.org/library/patent/p1356/
Modified: 2015-12-09 - 22KB Find Similar Documents
- 18:
Slide 1
- 3D University Research Summit May 5 th , 2011 Restricted Distribution: Contains SRC Confidential Material Restricted Distribution: Contains SRC Confidential Material Summit Goals . ...
URL: https://www.src.org/calendar/e004357/0-intro.pdf
Modified: 2011-05-04 - 285KB Find Similar Documents
- 19:
Electromagnetic Bandgap Structure for Isolation in Mixed-Signal...
- Electromagnetic Bandgap Structure for Isolation in Mixed-Signal Systems Application Type: Utility Patent Number: 7215301 Country: United States Status: Filed on 8-Sep-2004, Issued ...
URL: https://www.src.org/library/patent/p0470/
Modified: 2007-05-08 - 22KB Find Similar Documents
- 20:
Oxidation Resistant High Conductivity Copper Layers for Microelectric...
- Oxidation Resistant High Conductivity Copper Layers for Microelectric Applications and Process of Making Same Application Type: Utility Patent Number: 5622608 Country: United ...
URL: https://www.src.org/library/patent/p0007/
Modified: 1997-04-22 - 22KB Find Similar Documents
- 21:
Mixed-Signal Systems With Alternating Impedance Electromagnetic...
- Mixed-Signal Systems With Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structures For Noise Suppression/Isolation Application Type: Continuation (in part) Patent Number: ...
URL: https://www.src.org/library/patent/p0578/
Modified: 2007-08-07 - 22KB Find Similar Documents
- 22:
Microsoft PowerPoint - Lall_PackagedAutomotiveSystemsR2
- cave 3 NSF Center for Advanced Vehicle and Extreme Environment Electronics Packaged Systems Research for Advanced Vehicle Electronics @CAVE3 Pradeep Lall MacFarlane Endowed ...
URL: https://www.src.org/calendar/e005907/pradeep-lall.pdf
Modified: 2016-06-08 - 10.4MB Find Similar Documents
- 23:
Systems, Methods and Computer Program Products for Prediction...
- Systems, Methods and Computer Program Products for Prediction of Defect-Related Failures in Integrated Circuits Application Type: Utility Patent Number: 5822218 Country: United ...
URL: https://www.src.org/library/patent/p0050/
Modified: 1998-10-13 - 22KB Find Similar Documents
- 24:
Methods, Systems, and Computer Program Products for Asymmetric...
- Methods, Systems, and Computer Program Products for Asymmetric Multimode Interconnect Application Type: Utility Patent Number: 9008215 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1331/
Modified: 2015-04-14 - 22KB Find Similar Documents
- 25:
Methods, Systems, and Computer Program Products for Low Power...
- Methods, Systems, and Computer Program Products for Low Power Multimode Interconnect for Lossy and Tightly Coupled Multi-Channel Application Type: Utility Patent Number: 8903010 ...
URL: https://www.src.org/library/patent/p1328/
Modified: 2014-12-02 - 22KB Find Similar Documents
- 26:
3D IMAPS
- Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB Find Similar Documents
1 through 26 of
26 similar documents, best matches first. |
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