Questions?
[x] GRC Science Area
CADTS – Computer Aided Design & Test Sciences

[x] SRC Program
GRC

Content Type
Events 19
Patent Filings 8
Other 1

Year
2015 1
2011 18

Center
TxACE 2
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
EBSM 1
GSRC 1
IPC 1
NCRC 1

Thrust/Theme
DesTech – Design Techniques 4
LPD – Logic & Physical Design 4
AMS-CSD – Analog/Mixed-Signal Ci... 2
CADT – Computer-Aided Design and... 2
CD – Circuit Design 2
DV – Design Verification 2
HWS – Hardware Security 2
ISD – Integrated System Design 2
Physical Design 2
SLD – System Level Design 2
TT – Test & Testability 2
TechCAD – Technology CAD 2
VER – Verification 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PKG – Packaging 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1

1 through 28 of 28 similar documents, best matches first.   
1: pdfFinal Report - Workshop on Failure and Uncertainty in Mixed-Signal...
National Science Foundation Workshop on Failure and Uncertainty in Mixed-Signal Circuits and Systems Arlington, Virginia July 8-9, 2010 Principal Investigators: Ralph Cavin, ...
URL: https://www.src.org/calendar/e004025/final-report.pdf
Modified: 2011-06-01 - 914KB
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2: Semiconductor Research Corporation - SRC
GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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3: pdfDesign Forum: Hugo De Man Position Statement
Some (possibly controversial) thoughts H. De Man, Em. Prof. K.U.Leuven, Senior Fellow IMEC, deman@imec.be The right questions are formulated. One could start suggestions for ...
URL: https://www.src.org/...764/hugo-deman-position-statement.pdf
Modified: 2011-08-02 - 36KB
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4: pdfDesign Forum: John Hayes Position Statement
Future Directions for Design Automation: Three Challenges John P. Hayes October 1, 2006 1. Complexity and Change With CMOS transistor size approaching the nanometer range, two ...
URL: https://www.src.org/...764/john-hayes-position-statement.pdf
Modified: 2011-08-02 - 26KB
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5: 3D IC University Research e-Workshop (Event E004357) - SRC
3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB
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6: pdfPresentation Title
PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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7: pdfSRC/NSF Design Forum - Position Statement
Thoughts on the "Future Directions of Design Automation Research" Andreas Kuehlmann, Cadence Berkeley Labs October 24, 2006 Some of the main challenges we will face in the next ...
URL: https://www.src.org/...reas-kuehlmann-position-statement.pdf
Modified: 2011-08-02 - 69KB
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8: pdfSRC/NSF Design Forum - Position Statement
A Forum on Future Directions for Design Automation Research Juan C. Rey Senior Director Of Engineering Design to Silicon Division Mentor Graphics Corporation October, 2006 10:30 ...
URL: https://www.src.org/...02764/juan-rey-position-statement.pdf
Modified: 2011-08-02 - 13KB
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9: pdfSRC/NSF Design Forum - Position Statement
A Position Statement in the Forum on Future Directions for Design Automation Research Jason Cong UCLA Computer Science Department http://cadlab.cs.ucla.edu/~cong There are many ...
URL: https://www.src.org/...764/jason-cong-position-statement.pdf
Modified: 2011-08-02 - 35KB
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10: pdfSlide 1
Third Annual India Design Review January 7-8, 2015 William H. Joyner, Jr. CADTS William.Joyner@src.org David C. Yeh ICSS David.Yeh@src.org Restricted Distribution: Contains SRC ...
URL: https://www.src.org/...r/e005563/2015_indiawelcome_final.pdf
Modified: 2015-02-04 - 319KB
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11: pdfSRC: GRC Design Forum Postion Statement - Jeff Parkhurst,Intel
Future Design Environment Complexity in 2017: - Designs will contain over 200B transistors. - Design teams will remain constant size o CAD must bridge the productivity GAP - ...
URL: https://www.src.org/...2764/parkhurst-position-statement.pdf
Modified: 2011-08-02 - 16KB
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12: Methods, Apparatus and Computer Program products for Synthesizing...
Methods, Apparatus and Computer Program products for Synthesizing Integrated Circuits with Electrostatic Discharge Capability and Correcting Ground Rule Faults Therein Application ...
URL: https://www.src.org/library/patent/p0049/
Modified: 1998-08-18 - 27KB
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13: pdfSRC/NSF Design Forum - Professor Arvind
Future Directions in Design Automation Arvind, CSAIL , MIT Will there be a greater or smaller variety of electronic chips a decade from now? There is a dramatic decrease in the ...
URL: https://www.src.org/...64/prof-arvind-position-statement.pdf
Modified: 2011-08-02 - 9KB
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14: pdfDesign Forum: Sharad Malik Panel Position Statement
Making our Way through the End-of-the Roadmap Maze Panel Position Statement Sharad Malik Princeton University As we look forward over the next 10-15 years, there are several ...
URL: https://www.src.org/...4/sharad-malik-position-statement.pdf
Modified: 2011-08-02 - 20KB
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15: pdfSRC/NSF Design Forum - Position Statement
NSF/SRC Forum on Future Directions for Design Automation Research Top Three Challenges for Electronic Design Automation Sachin Sapatnekar, University of Minnesota As system ...
URL: https://www.src.org/...hin-sapatnekar-position-statement.pdf
Modified: 2011-08-02 - 15KB
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16: pdfSRC/NSF Design Forum - Position Statement
SRC/NSF Workshop on Future Directions for Design Automation Research Comments by David Yeh, Texas Instruments, currently an assignee at SRC I approached this from two perspectives. ...
URL: https://www.src.org/...2764/david-yeh-position-statement.pdf
Modified: 2011-08-02 - 12KB
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17: pdfSRC/NSF Design Forum - Posiltion Statement
Future Directions for Design Automation Research Tim Cheng, UCSB In my opinion, the following are three key challenges for future design automation research. Silicon Debugging: The ...
URL: https://www.src.org/...2764/tim-cheng-position-statement.pdf
Modified: 2011-08-02 - 14KB
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18: pdfSRC/NSF Design Forum - Position Statement
© R.A. Rutenbar 2006 NSF Forum on Future Directions for Design Automation Research Increased Diversity: Position Statement NSF Forum on Future Directions for Design Automation ...
URL: https://www.src.org/...4/rob-rutenbar-position-statement.pdf
Modified: 2011-08-02 - 99KB
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19: pdfSRC/NSF Design Forum - Position Statement
ATT4457633.txt Views on Important Direction in Design Automation J. White Professor, Department of Electrical Engineering and Computer Science Massachusetts Institute of Technology ...
URL: https://www.src.org/...64/jacob-white-position-statement.pdf
Modified: 2011-08-02 - 21KB
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20: On-Chip Radio Frequency (RF) Interconnects for Network-On-Chip...
On-Chip Radio Frequency (RF) Interconnects for Network-On-Chip Designs Application Type: Utility Patent Number: 8270316 Country: United States Status: Filed on 30-Jan-2009, Issued ...
URL: https://www.src.org/library/patent/p1123/
Modified: 2012-09-18 - 23KB
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21: Method of Fabricating a Self-Aligned High Speed MOSFET Device...
Method of Fabricating a Self-Aligned High Speed MOSFET Device Application Type: Continuation (in part) Patent Number: 5599728 Country: United States Status: Filed on 28-Oct-1994, ...
URL: https://www.src.org/library/patent/p0006/
Modified: 1997-02-04 - 22KB
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22: Systems, Methods and Computer Program Products for Creating Hierarchic...
Systems, Methods and Computer Program Products for Creating Hierarchical Equivalent Circuit Models Application Type: Utility Patent Number: 7096174 Country: United States Status: ...
URL: https://www.src.org/library/patent/p0200/
Modified: 2006-08-22 - 24KB
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23: pdfDesign Forum: Bill Read Position Statement
Freescale(tm) and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale ...
URL: https://www.src.org/...2764/bill-read-position-statement.pdf
Modified: 2011-08-02 - 57KB
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24: ESD/EOS Protection Circuits for Integrated Circuits (Patent P0074...
ESD/EOS Protection Circuits for Integrated Circuits Application Type: Utility Patent Number: 5450267 Country: United States Status: Filed on 31-Mar-1993, Issued on 12-Sep-1995, ...
URL: https://www.src.org/library/patent/p0074/
Modified: 1995-09-12 - 25KB
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25: Source Contact Placement for Efficient ESD/EOS Protection in...
Source Contact Placement for Efficient ESD/EOS Protection in Grounded Substrate MOS Integrated Circuit Application Type: Utility Patent Number: 5404041 Country: United States ...
URL: https://www.src.org/library/patent/p0067/
Modified: 1995-04-04 - 25KB
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26: Method and System for Performing Optical Proximity Correction...
Method and System for Performing Optical Proximity Correction with Process Variations Considerations Application Type: Utility Patent Number: 7711504 Country: United States Status: ...
URL: https://www.src.org/library/patent/p1031/
Modified: 2010-05-04 - 23KB
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27: Method, Apparatus and Computer Program Product for Determining...
Method, Apparatus and Computer Program Product for Determining a Frequency Domain Response of a Nonlinear Microelectronic Circuit Application Type: Utility Patent Number: 5663890 ...
URL: https://www.src.org/library/patent/p0014/
Modified: 1997-09-02 - 24KB
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28: pdf3D IMAPS
Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB
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1 through 28 of 28 similar documents, best matches first.