Questions?
[x] GRC Science Area
IPS – Interconnect & Packaging Sciences

Content Type
Events 19
Patent Filings 6
Other 1

SRC Program
GRC 13
SRC 13
3D EC 3
FCRP 3

Year
2016 3
2013 5
2012 3
2011 8

Center
C2S2 7
FENA 7
GSRC 7
IFC 7
MSD 7
MuSyC 7
C-FAR 6
CNFD 6
FAME 6
INDEX 6
LEAST 6
SONIC 6
SWAN 6
TerraSwarm 6
EBSM 4
TxACE 4
NPT 3
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
PKG – Packaging 9
Reliability 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AMS-CSD – Analog/Mixed-Signal Ci... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

1 through 26 of 26 similar documents, best matches first.   
1: 3D IC University Research e-Workshop (Event E004357) - SRC
3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB
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2: Semiconductor Research Corporation - SRC
GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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3: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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4: TECHCON 2011 (Event E004113) - SRC
TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
URL: https://www.src.org/calendar/e004113/
Modified: 2012-03-13 - 97KB
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5: pdfOverview of Research
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Modified: 2016-06-08 - 8.0MB
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6: TECHCON 2013 (Event E004683) - SRC
TECHCON 2013 Date: Monday, Sept. 9, 2013, 8 a.m. - Tuesday, Sept. 10, 2013, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004683 E004683 image ...
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Modified: 2014-03-10 - 136KB
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7: TECHCON 2012 (Event E004114) - SRC
TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
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Modified: 2013-03-11 - 98KB
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8: pdfMicrosoft PowerPoint - Lall_PackagedAutomotiveSystemsR2
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Modified: 2016-06-08 - 10.4MB
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9: 2013 GRC SACC and TAB Chair Recognition - SRC
2013 GRC SACC and TAB Chair Recognition TAB and SACC Chairs at TECHCON 2013 Technical Advisory Boards (TABs) and Science Area Coordinating Committees (SACCs) work together with the ...
URL: https://www.src.org/calendar/e004683/tab-chair/
Modified: 2011-09-16 - 21KB
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10: Mixed-Signal Systems With Alternating Impedance Electromagnetic...
Mixed-Signal Systems With Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structures For Noise Suppression/Isolation Application Type: Continuation (in part) Patent Number: ...
URL: https://www.src.org/library/patent/p0578/
Modified: 2007-08-07 - 22KB
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11: Electromagnetic Bandgap Structure for Isolation in Mixed-Signal...
Electromagnetic Bandgap Structure for Isolation in Mixed-Signal Systems Application Type: Utility Patent Number: 7215301 Country: United States Status: Filed on 8-Sep-2004, Issued ...
URL: https://www.src.org/library/patent/p0470/
Modified: 2007-05-08 - 22KB
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12: Putting Watson to Work (TECHCON 2013) - SRC
Putting Watson to Work TECHCON 2013 Special Session Richard Talbot, Director, PLM of the IBM Poser Systems View presentation as PDF Presented: Monday, September 9 at TECHCON 2013 ...
URL: https://www.src.org/calendar/e004683/watson/
Modified: 2013-09-09 - 21KB
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13: TECHCON 2013 Authors Kit: Preparing the Oral Presentation - SRC
TECHCON 2012 TECHCON 2013 Author's Kit: Preparing the Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals ...
URL: https://www.src.org/calendar/e004683/preparing-presentation/
Modified: 2013-04-24 - 24KB
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14: TECHCON 2012 - Author's Kit: Preparing Oral Presentation - SRC
TECHCON 2012: Preparing the Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals that are readable from all ...
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15: Preparing Your Oral Presentation - TECHCON 2011 Author's Kit...
TECHCON 2011 Author's Kit Preparing The Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals that are readable ...
URL: https://www.src.org/calendar/e004113/preparing-presentation/
Modified: 2011-04-15 - 24KB
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16: pdfPresentation Title
PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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17: Mixed-signal Substrate with Integrated Through-Substrate Vias...
Mixed-signal Substrate with Integrated Through-Substrate Vias Application Type: Utility Patent Number: 10330874 Country: United States Status: Filed on 2-Feb-2017, Issued on ...
URL: https://www.src.org/library/patent/p1675/
Modified: 2019-06-25 - 23KB
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18: Methods, Systems, and Computer Program Products for Asymmetric...
Methods, Systems, and Computer Program Products for Asymmetric Multimode Interconnect Application Type: Utility Patent Number: 9008215 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1331/
Modified: 2015-04-14 - 22KB
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19: Systems, Methods and Computer Program Products for Prediction...
Systems, Methods and Computer Program Products for Prediction of Defect-Related Failures in Integrated Circuits Application Type: Utility Patent Number: 5822218 Country: United ...
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20: Methods, Systems, and Computer Program Products for Low Power...
Methods, Systems, and Computer Program Products for Low Power Multimode Interconnect for Lossy and Tightly Coupled Multi-Channel Application Type: Utility Patent Number: 8903010 ...
URL: https://www.src.org/library/patent/p1328/
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21: pdfTECHCON 2011 Judges and Chairs
Monday, September 12, 2011 Session 1: Test and Testability Session 2 Analog, Mixed-Signal and RF Circuit Design Session 3 Graphene Session 4a Dielectric Material Robustness 8:00 ...
URL: https://www.src.org/calendar/e004113/judge-chair-list.pdf
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22: pdfMicrosoft PowerPoint - Watson SRC TECHCON 090913 FINAL PUBLISH...
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Modified: 2013-09-19 - 3.0MB
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23: Poster Instructions - TECHCON 2011 Author's Kit - SRC
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URL: https://www.src.org/calendar/e004113/poster-instructions/
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24: TECHCON 2013 Authors Kit: Poster Instructions - SRC
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URL: https://www.src.org/calendar/e004683/poster-instructions/
Modified: 2013-04-24 - 24KB
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25: TECHCON 2012 - Author's Kit: Poster-Instructions - SRC
TECHCON 2012 - Poster/Demonstration Instructions All paper presenters are expected to present a poster. Failure to present a poster will adversely affect the judging of your ...
URL: https://www.src.org/...4114/authors-kit/poster-instructions/
Modified: 2012-05-10 - 24KB
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26: pdf3D IMAPS
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URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB
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1 through 26 of 26 similar documents, best matches first.