Questions?
Content Type
Other 474
Events 306
Patent Filings 8

SRC Program
SRC 414
GRC 289
JUMP2 28
NRI 28
FCRP 9
SRP 5
nCORE 5
3D EC 4
SRCEA 3
Auto 2
JUMP 2
NINE 2
STARnet 2
ICA 1
Undergrad 1

Year
2024 16
2023 43
2022 49
2021 46
2020 23
2019 26
2018 26
2017 45
2016 25
2015 27
2014 12
2013 29
2012 43
2011 213
2010 150
2009 1
2008 1

Center
EBSM 12
TxACE 12
CHIRP 6
E2CDA-NRI 6
INDEX 6
SWAN 5
C-FAR 4
C2S2 4
CNFD 4
FAME 4
FENA 4
GSRC 4
IFC 4
IMPACT 4
LEAST 4
MSD 4
NRI-NSF 4
SONIC 4
TerraSwarm 4
ACE 2
CUBIC 2
MIND 2
MuSyC 2
SUPREME 2
ACE4S 1
AMML 1
C-SPIN 1
CAIST 1
CAPSL 1
CDADIC 1
CEMPI 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
DEEP3M 1
E2CDA 1
IPC 1
NCRC 1
NEWLIMITS 1
NPT 1

Thrust/Theme
ESH – Environment Safety and Hea... 11
PKG – Packaging 10
AMS-CSD – Analog/Mixed-Signal Ci... 6
CADT – Computer-Aided Design and... 6
CD – Circuit Design 6
HWS – Hardware Security 6
LMD – Logic and Memory Devices 5
SLD – System Level Design 5
NMP – Nanomanufacturing Material... 4
AIHW – Artificial Intelligence H... 3
I3T – Innovative and Intelligent... 3
IMPACT-T1 – Materials for Scaled... 3
ISD – Integrated System Design 3
LPD – Logic & Physical Design 3
TT – Test & Testability 3
VER – Verification 3
IMPACT-T2 – Materials for Storag... 2
Physical Design 2
SCARF – Supply Chain AI Realized... 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADS – Alternative Device Structu... 1
AMML-T1 – Antiferromagnetic Magn... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DEEP3M-T4 – Architectures 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
E2CDA2 – E2CDA 2.0 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
IRP – India Research Program 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NEWLIMITS-T1 – Novel Computing a... 1
NEWLIMITS-T2 – 2D Materials Devi... 1
NEWLIMITS-T3 – Advanced Manufact... 1
NEWLIMITS-T4 – Characterization ... 1
NEWLIMITS-T5 – Simulations and M... 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1

GRC Science Area
CADTS – Computer Aided Design & ... 37
ICSS – Integrated Circuit & Syst... 25
NMS – Nanomanufacturing Sciences 25
IPS – Interconnect & Packaging S... 13
CSR – Cross-disciplinary Semicon... 8
DS – Device Sciences 8
SRCEA – SRC Education Alliance 8
ES-H – Environmental Safety & He... 6
PKG – Packaging Sciences 5
DES – Design Sciences 2
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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181: pdfSTUDENTS' CATALOG
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182: Call for Research in India Research Program - SRC
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183: pdfOverview of Research
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184: pdfP
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185: pdf2013 SRC Corporate Annual Report
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186: TECHCON 2011 (Event E004113) - SRC
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187: pdfMicrosoft PowerPoint - 2022_scarf_review_intro.pptx
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188: pdfMicrosoft Word - Interface Research Needs.doc
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189: pdfS200807_research_needs_INT.doc
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190: pdfE003932 - Variability Forum - Gupta
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192: pdfIRP Advisory Board Meeting
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193: pdfPowerPoint Presentation
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194: pdfEnvironment, Safety, and Health Needs Document
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195: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
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196: pdfNIST's Perspective on Bioelectronics
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197: pdfNEWSLETTER
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200: pdfProposers' Day Workshop
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201: pdfPowerPoint Presentation
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205: GRC Managed Crosscuts - SRC
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206: TECHCON 2019 Submission Guide - SRC
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207: pdfResearch Opportunities at the Interface of Design and Technology
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208: pdfE003932 - Variability Forum - Spanos
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209: Penn State E2CDA-NRI Liaison Team Visit (Event E006222) - SRC
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210: pdf2009 Summer Study: 3D Desig Eco-System
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