Questions?
Content Type
Other 455
Events 374
Patent Filings 105

SRC Program
SRC 404
GRC 380
FCRP 38
NRI 38
JUMP2 23
JUMP 20
STARnet 16
SRP 7
3D EC 6
Auto 4
ERI 2
ICA 2
MSR-Intel 2
SRCEA 2
nCORE 2
NINE 1

Year
2024 16
2023 43
2022 56
2021 57
2020 22
2019 28
2018 39
2017 40
2016 24
2015 27
2014 32
2013 25
2012 53
2011 218
2010 142
2009 1
2008 1

Center
ACE4S 22
C2S2 20
GSRC 18
IFC 15
TxACE 15
MSD 14
ASCENT 13
FENA 12
LEAST 12
EBSM 8
INDEX 8
MuSyC 7
SONIC 7
C-FAR 6
E2CDA-NRI 6
SWAN 6
CBRIC 5
CHIRP 5
CNFD 5
FAME 5
TerraSwarm 5
C-SPIN 4
NRI-NSF 4
CONIX 3
SUPREME 3
ACE 2
ADA 2
CEMPI 2
CRISP 2
CUBIC 2
ComSenTer 2
NPT 2
CAIST 1
CDADIC 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
E2CDA 1
IPC 1
JUMP-URI 1

Thrust/Theme
SLD – System Level Design 25
CD – Circuit Design 23
I3T – Innovative and Intelligent... 23
ISD – Integrated System Design 12
PKG – Packaging 12
AMS-CSD – Analog/Mixed-Signal Ci... 9
ASCENT-T1 – Vertical CMOS 8
CADT – Computer-Aided Design and... 8
ESH – Environment Safety and Hea... 8
HWS – Hardware Security 8
LPD – Logic & Physical Design 7
NMP – Nanomanufacturing Material... 6
TT – Test & Testability 6
LMD – Logic and Memory Devices 5
PAT – Patterning 5
VER – Verification 5
NEM – Nanoengineered Materials 4
AIHW – Artificial Intelligence H... 3
ASCENT-T3 – Heterogeneous Integr... 3
Back End Processes 3
CBRIC-T1 – Neuro-inspired Algori... 3
CONIX-T1 – ARENA Integrator 3
Packaging & Interconnect Systems 3
Physical Design 3
ADA-T1 – Deft Development 2
ADA-T2 – Algorithm-driven Archit... 2
ADA-T3 – Technology-driven Syste... 2
AMS – Analog and Mixed-Signal De... 2
ASCENT-T4 – Merged Logic Memory ... 2
BEP – Back End Processes 2
CRISP-T3 – Scaling Applications ... 2
ComSenTer-T3 – Application-speci... 2
DCMOS – Digital CMOS Technologie... 2
EP3C – Efficiency and Performanc... 2
FACSYS – Factory Systems 2
IRP – India Research Program 2
MT – Memory Technologies 2
SCARF – Supply Chain AI Realized... 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADS – Alternative Device Structu... 1
ASCENT-T2 – Beyond CMOS 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
C&S – Controls and Sensing 1
CBRIC-T2 – Neuromorphic Fabrics 1
CBRIC-T3 – Distributed Intellige... 1
CBRIC-T4 – Application Drivers 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T2 – Hardware/Software Pla... 1
CONIX-T3 – Security 1
CONIX-T4 – Machine Learning 1
CONIX-T5 – Communication Positio... 1
CONIX-T6 – Programming and Resou... 1
CRISP-T1 – Hardware Support for ... 1
CRISP-T2 – System Support for Ma... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T1 – Systems and Algor... 1
ComSenTer-T2 – mm-wave/THz ICs a... 1
ComSenTer-T4 – Center-wide Demon... 1
Contamination Control 1
Cost Reduction 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
E2CDA2 – E2CDA 2.0 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
JUMP-URI – JUMP Undergraduate Re... 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1

GRC Science Area
ICSS – Integrated Circuit & Syst... 54
CADTS – Computer Aided Design & ... 48
NMS – Nanomanufacturing Sciences 30
IPS – Interconnect & Packaging S... 23
DS – Device Sciences 17
CSR – Cross-disciplinary Semicon... 15
SRCEA – SRC Education Alliance 9
NIS – Nanostructure & Integratio... 6
MPS – Material & Process Science... 5
PKG – Packaging Sciences 5
DES – Design Sciences 4
ES-H – Environmental Safety & He... 4
INT – Interconnect Sciences 3
FAC – Factory Sciences 1
GEN – General 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MSS – Manufacturing Systems Scie... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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1: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
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9: pdf1995 Annual Report
Vision The Semiconductor Research Corporation (SRC) will be the world’s premier research management consortium for providing university-based research results in semiconductor ...
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L o o k i n g b a c k v i s i o n Semiconductor Research Corporation (SRC) will provide competitive advan- tage to its members as the world's pre- mier research management ...
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16: pdfThe Value of Members
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The Semiconductor Research Corporation Creating Value Through Research A n n u a l R e p o r t 1 9 9 6 Vision The Semiconductor Research Corporation (SRC) will be the world's ...
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Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>